AMD XC3S5000-5FGG676C

Overview

XC3S5000-5FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 5,093,760 system gates, 11,648 logic cells, and 3,584 Kbits of block RAM, configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package for high-density digital logic implementation in industrial control and communications infrastructure.

For engineers reviewing the XC3S5000-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (489 user I/Os), maximum DC input frequency (280 MHz), and support for LVCMOS25/LVCMOS33/LVTTL signaling standards in commercial temperature grade.

Technical Context

The XC3S5000-5FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology with programmable slew rate and drive strength per I/O bank.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) providing phase shifting, frequency synthesis, and duty cycle correction across eight independent clock domains.

Key Specifications

Pinout & Package

XC3S5000-5FGG676C is housed in a 676-ball Fine-Pitch BGA (FGG) package with 27 × 27 array, 1.0 mm ball pitch, and thermal pad. Pin assignment follows Xilinx Spartan-3 family standard layout with dedicated configuration, clock, and I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S5000-4FGG676C and XC3S4000-5FGG676C, the XC3S5000-5FGG676C delivers highest gate density and fastest I/O timing in the FGG676 package, making it optimal for bandwidth-constrained, latency-sensitive systems requiring maximal on-chip logic and memory.

Availability

XC3S5000-5FGG676C is available at Aetrix Electronics and suitable for industrial motion control, telecom infrastructure, and video surveillance systems requiring stable component supply and long-term obsolescence management.

Supply support for XC3S5000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.

The Spartan-3 family was originally designed by Xilinx to deliver cost-optimized, high-performance programmable logic for high-volume industrial and communications applications with balanced I/O, logic, and memory resources.

FAQ

What is the maximum operating frequency of the XC3S5000-5FGG676C?

The XC3S5000-5FGG676C has a maximum DC input frequency of 280 MHz and supports internal clock frequencies up to 333 MHz via its Digital Clock Managers. These values are specified for the -5 speed grade under commercial temperature conditions (0°C to 85°C), and actual achievable frequency depends on design placement, routing, and timing constraints.

Does the XC3S5000-5FGG676C support JTAG programming?

Yes, the XC3S5000-5FGG676C supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. JTAG mode enables in-system programming and partial reconfiguration without requiring external PROM, and is fully compatible with Xilinx iMPACT and Vivado tools for bitstream loading and device testing.

What configuration modes does the XC3S5000-5FGG676C support?

The XC3S5000-5FGG676C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using an external PROM to load the bitstream automatically on power-up. Mode selection is controlled by MODE pins (M2:M0), and all modes are documented in the Xilinx Spartan-3 Hardware User Guide.

Is the XC3S5000-5FGG676C RoHS compliant?

Yes, the XC3S5000-5FGG676C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FGG676 package uses matte tin finish on solder balls, and the device is marked with the RoHS symbol in Xilinx documentation and packaging labels.

Can the XC3S5000-5FGG676C interface directly with DDR2 SDRAM?

No, the XC3S5000-5FGG676C does not include a hard DDR2 memory controller. However, Xilinx provides parameterized soft IP cores (e.g., MIG v1.7) that can be implemented in its logic fabric to manage DDR2 interfaces. Successful operation requires careful PCB layout, timing closure, and adherence to Xilinx's MIG implementation guidelines for the Spartan-3 family.