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AMD XC3S500E-4FG320C
- Part No.:
- XC3S500E-4FG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S500E-4FG320C.pdf
- Description:
- IC FPGA 232 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,852
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Product details
Overview
XC3S500E-4FG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and 228 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (4.9 ns CLB delay), supports 3.3 V/2.5 V/1.2 V mixed-voltage I/O, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-4FG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, embedded block RAM capacity (360 kbits), distributed RAM resources, DLL-based clock management, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S500E-4FG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and fast interconnect. It integrates eighteen 18×18 multipliers and supports up to eight global clock networks driven by Digital Clock Managers (DCMs).
It features SelectIO technology enabling single-ended standards (LVTTL, LVCMOS, PCI) and differential standards (LVDS, RSDS) across its 228 user I/Os. Configuration is performed via Master Serial mode using external PROM or through JTAG IEEE 1149.1 boundary-scan interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - provides combinational and sequential logic density for medium-complexity digital controllers and protocol translators. |
| System Gates | 500,000 - indicates overall logic capacity compatible with legacy ASIC replacement and glue-logic consolidation. |
| Block RAM | 360 kbits - enables on-chip data buffering, FIFO implementation, and small lookup table storage without external memory. |
| I/O Pins | 228 - supports high-pin-count peripheral interfacing including parallel buses, display controllers, and sensor arrays. |
| Speed Grade | -4 (4.9 ns CLB delay) - defines maximum operating frequency for synchronous logic paths in critical timing domains. |
| DCM Units | 4 - delivers clock synthesis, phase shifting, duty-cycle correction, and frequency multiplication for system clock domain management. |
| Multipliers | 18 × 18-bit - accelerates arithmetic-intensive tasks such as motor control algorithms and digital filtering. |
Pinout & Package
XC3S500E-4FG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-230 footprint. The package supports reflow soldering and thermal dissipation suitable for industrial temperature operation (0°C to 85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered and decoupled locally to maintain stable internal logic voltage. |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCM - requires independent regulation and bypassing. |
| T1 | VCCO_0 | 3.3 V I/O bank supply for Bank 0 - sets output voltage level and input threshold for associated pins. |
| R1 | TCK | JTAG test clock input - synchronizes boundary-scan operations during programming and debug sessions. |
| P1 | TMS | JTAG test mode select - controls state transitions of the TAP controller during configuration and testing. |
| N1 | TDO | JTAG test data output - serially returns scan-chain data during boundary-scan verification. |
| M1 | TDI | JTAG test data input - serially loads instruction and data into the JTAG chain. |
| U1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration sequence when asserted low. |
| V1 | INIT_B | Open-drain initialization status - goes high-Z after successful bitstream loading and CRC check. |
| W1 | DONE | Open-drain configuration completion - pulled high externally to indicate valid configuration state. |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports 19 I/O standards including LVTTL, LVCMOS, PCI, LVDS, and RSDS - enables direct interfacing with diverse peripherals without level-shifting components. |
| Digital Clock Manager (DCM) | Four DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication - eliminates need for external clock ICs in timing-critical subsystems. |
| Embedded Multipliers | Eighteen 18×18 signed/unsigned multipliers - accelerate real-time computation for servo control, signal conditioning, and encoder processing. |
| Configuration Security | Bitstream encryption support via external PROM with AES key - protects intellectual property in deployed systems against unauthorized readback. |
| Boundary-Scan Test | IEEE 1149.1 compliant JTAG interface - enables in-system programming, structural testing, and board-level diagnostics without physical probe access. |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and current sensing for 3-phase BLDC drives in factory automation systems. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with deterministic timing via DCM-synchronized clocks. Use Value: Enables integration of motion control IP cores with minimal external components while meeting <1 µs loop latency requirements. | Use Scenario: Converting parallel RGB video signals from image sensors to serialized LVDS streams for high-speed transmission to display processors. IC Role / Device Role / Timing Role: Protocol translation engine implementing pixel clock domain crossing and data serialization using embedded multipliers and I/O timing calibration. Use Value: Reduces PCB layer count and EMI by replacing discrete serializer ICs and eliminating external clock buffers. |
| Communications Backplane Interface | Medical Imaging Data Acquisition |
Use Scenario: Glue logic between multiple ASICs on telecom backplanes supporting TDM and packetized data routing. IC Role / Device Role / Timing Role: Synchronization hub managing clock domain crossings between line cards and switch fabric using dual DCMs and block RAM FIFOs. Use Value: Provides deterministic latency and jitter-controlled data handoff without requiring custom ASIC development cycles. | Use Scenario: Aggregating analog-to-digital converter outputs from multi-channel ultrasound front-ends into a unified parallel bus for DSP processing. IC Role / Device Role / Timing Role: High-speed data concentrator with precise sampling clock distribution and channel alignment via DCM phase-shift control. Use Value: Achieves sub-nanosecond inter-channel skew tolerance required for coherent beamforming algorithms. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4FG320C | 400K system gates, 8,912 logic cells, 288 kbits block RAM - lower density and reduced multiplier count (12 units). | Suitable for simpler control logic where full 500K gate capacity is unused; less I/O drive strength in high-speed interfaces. | Select when design fits within reduced resource budget and cost sensitivity outweighs future scalability needs. |
| XC3S1000-4FG320C | 1M system gates, 17,280 logic cells, 576 kbits block RAM - higher density, additional DCMs (8), and more multipliers (36). | Required for larger state machines, multi-protocol support, or integrated soft-core processors (e.g., MicroBlaze). | Choose when expanding functionality beyond XC3S500E-4FG320C limits without changing PCB layout or package footprint. |
Compared with XC3S500E-4FG320C, XC3S400-4FG320C offers cost reduction at the expense of logic capacity and I/O bandwidth, while XC3S1000-4FG320C extends scalability for complex embedded systems - both share identical FG320 packaging and pin-compatible I/O banks.
Availability
XC3S500E-4FG320C is available at Aetrix Electronics and suitable for industrial motor control, medical imaging data acquisition, video interface bridging, and communications backplane interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC3S500E-4FG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.
The Spartan-3E family was designed for cost-optimized, high-volume embedded applications requiring reliable programmable logic with integrated clock management and flexible I/O.
FAQ
What is the operating temperature range for XC3S500E-4FG320C?
The XC3S500E-4FG320C is rated for commercial and industrial temperature operation from 0°C to +85°C ambient. Its thermal performance is validated under JEDEC JESD51-2 conditions with the FG320 package's thermal resistance (θJA) specified at 25.5°C/W. This allows reliable deployment in fanless industrial enclosures and medical equipment without active cooling when power dissipation remains within datasheet limits for XC3S500E-4FG320C.
Does XC3S500E-4FG320C support configuration via JTAG only?
No, XC3S500E-4FG320C supports multiple configuration modes including Master Serial (using external SPI PROM), Slave Serial, Boundary Scan (JTAG), and SelectMAP. JTAG is used primarily for programming, debugging, and boundary-scan testing, but production systems commonly use Master Serial mode for autonomous startup. All modes are fully supported in XC3S500E-4FG320C without hardware modification.
Can XC3S500E-4FG320C implement a soft microprocessor?
Yes, XC3S500E-4FG320C has sufficient logic cells (11,200) and block RAM (360 kbits) to implement the MicroBlaze soft processor core with peripherals such as UART, GPIO, and timer. Xilinx's EDK tools verify full MicroBlaze instantiation on XC3S500E-4FG320C, though performance is limited to ~50 DMIPS at 50 MHz due to CLB count and memory bandwidth constraints inherent to XC3S500E-4FG320C.
What I/O standards are supported by XC3S500E-4FG320C?
XC3S500E-4FG320C supports 19 SelectIO standards including LVTTL, LVCMOS (1.2 V to 3.3 V), PCI, HSTL, SSTL, LVDS, and RSDS. Each of its 10 I/O banks can be independently configured for voltage and standard, allowing mixed-voltage operation across the same device. This capability is documented in the XC3S500E-4FG320C datasheet Table 21 and verified in production designs.
Is XC3S500E-4FG320C still in active production?
XC3S500E-4FG320C is in long-term availability status per AMD/Xilinx Product Change Notifications. While not in new design introduction, it remains actively stocked and supported by authorized distributors and Aetrix Electronics with committed supply for industrial and medical applications through 2027. Lifecycle documentation for XC3S500E-4FG320C is accessible via AMD's official product page.
XC3S500E-4FG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 320-BGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 232
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S500E-4FG320C FAQ
1.How can I place an order for XC3S500E-4FG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4FG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4FG320C reliable?
The price and inventory of XC3S500E-4FG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4FG320C is usually 5 days.
3.What payment methods are accepted for XC3S500E-4FG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4FG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4FG320C?
XC3S500E-4FG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4FG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4FG320C?
For technical support, including XC3S500E-4FG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4FG320C requirements.
6.How does Aetrix verify that XC3S500E-4FG320C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4FG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4FG320C meets industry standards.
7.What is the process for return or replacement of XC3S500E-4FG320C?
All XC3S500E-4FG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4FG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4FG320C part is unused and in its original packaging.
Return procedure for XC3S500E-4FG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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