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AMD XC3S500E-4FT256C
- Part No.:
- XC3S500E-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S500E-4FT256C.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,625
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Product details
Overview
XC3S500E-4FT256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,824 logic cells, and 221 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-4FT256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), embedded block RAM (360 Kb), DLL-based clock management, and compatibility with Xilinx ISE design tools for rapid prototyping and production deployment.
Technical Context
The XC3S500E-4FT256C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18-bit multipliers and eight Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction.
Configuration is performed via Master Serial mode using external PROM or microcontroller, with JTAG boundary-scan support for testing. The device supports IEEE 1149.1 compliance and includes internal pull-up resistors on configuration pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,824 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 500,000 - indicates relative ASIC-equivalent gate count for architectural sizing |
| Block RAM | 360 Kb - enables local data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 221 - supports high-density peripheral interfacing with banked voltage domains |
| DCMs | 8 - delivers jitter-tolerant clock synthesis and phase alignment across multiple clock domains |
| Speed Grade | -4 - guarantees 4.5 ns maximum propagation delay for critical path timing closure |
| SelectIO Standards | LVTTL, LVCMOS, PCI, HSTL, SSTL - enables direct interfacing with common microprocessors and memory interfaces |
Pinout & Package
Package: 256-ball FBGA (Fine-Pitch Ball Grid Array), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during Master Serial mode; requires clean, monotonic edge |
| DIN | Configuration Data Input | Serial bitstream input for FPGA programming; synchronous to CCLK |
| PROG_B | Program Initiate | Active-low signal that clears configuration memory and resets internal logic prior to reconfiguration |
| INIT_B | Configuration Status Output | Open-drain output indicating configuration completion or error; pulled high externally |
| PROGRAM_B | Reconfiguration Trigger | Asserting low initiates full reconfiguration cycle; used for dynamic partial reconfiguration support |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Eight DCMs provide deterministic clock deskew, frequency multiplication/division, and 90°/180° phase shifts without external PLL components |
| Embedded Multipliers | Twelve 18×18-bit hard multipliers accelerate DSP functions such as FIR filtering and motor control algorithms |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) enabling direct connection to legacy and modern peripherals without level shifters |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, optimized for high-speed synchronous logic and pipelined datapaths |
Applications
| Industrial PLC I/O Module | Video Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (e.g., Profibus) and host controller. IC Role / Device Role / Timing Role: FPGA acts as programmable logic layer managing parallel I/O scanning, interrupt generation, and cyclic redundancy checking. Use Value: XC3S500E-4FT256C delivers deterministic latency (<1 µs) and supports dual-clock domain synchronization for isolated sensor/actuator timing. | Use Scenario: Converting RGB/TTL video signals to LVDS or FPD-Link for embedded display panels. IC Role / Device Role / Timing Role: XC3S500E-4FT256C implements pixel clock domain crossing, color space conversion, and serialization logic. Use Value: Built-in DCMs enable precise pixel clock recovery and skew compensation across 24-bit parallel video buses. |
| Medical Imaging Control | Test Equipment Pattern Generator |
Use Scenario: Coordinating timing-critical acquisition sequences in ultrasound beamforming subsystems. IC Role / Device Role / Timing Role: XC3S500E-4FT256C generates synchronized trigger pulses, ADC sampling clocks, and DMA handshaking signals. Use Value: 221 I/O pins allow simultaneous control of >16 analog front-end channels with independent gain/phase calibration registers. | Use Scenario: Generating high-fidelity digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: FPGA serves as pattern memory controller and high-speed parallel output sequencer. Use Value: 360 Kb block RAM stores >1 million test vectors; -4 speed grade ensures sub-5 ns timing resolution for edge placement. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4FT256C | 400K system gates, 9,120 logic cells, 291 Kb block RAM - lower density and reduced I/O count (195 pins) | Suitable for simpler control logic with fewer parallel interfaces or smaller memory buffers | Choose when design fits within reduced resource budget and avoids over-provisioning |
| XC3S1000-4FT256C | 1M system gates, 17,280 logic cells, 576 Kb block RAM - higher density, same package and pinout | Required for larger state machines, multi-channel DSP, or integrated soft-core processor implementations | Select when XC3S500E-4FT256C resources are insufficient for final RTL utilization |
Compared with XC3S400-4FT256C and XC3S1000-4FT256C, the XC3S500E-4FT256C offers balanced logic capacity, I/O count, and embedded memory for mid-tier industrial and medical designs where cost, power, and board space constrain higher-density alternatives.
Availability
XC3S500E-4FT256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply and long-term design continuity.
Supply support for XC3S500E-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan family for cost-optimized programmable logic solutions.
The Spartan-3E product line was designed for high-volume, price-sensitive applications requiring reliable I/O flexibility, moderate logic density, and proven toolchain integration with Xilinx ISE.
FAQ
What is the maximum operating frequency supported by the XC3S500E-4FT256C?
The XC3S500E-4FT256C supports internal logic operation up to 375 MHz using its Digital Clock Managers (DCMs). This frequency applies to clocked logic paths meeting timing constraints under the -4 speed grade, with actual achievable frequency dependent on design routing, fanout, and I/O standard selection.
Does the XC3S500E-4FT256C support JTAG boundary-scan testing?
Yes, the XC3S500E-4FT256C fully complies with IEEE 1149.1 and supports JTAG boundary-scan for PCB-level interconnect testing. TDI, TDO, TMS, TCK, and TCK pins are dedicated and mapped to specific balls in the FT256 package per the official pinout documentation.
Can the XC3S500E-4FT256C be configured using a microcontroller?
Yes, the XC3S500E-4FT256C supports Slave Serial and Slave Parallel configuration modes, allowing initialization by an external microcontroller. In Slave Serial mode, the microcontroller drives DIN and CCLK while monitoring INIT_B and DONE to manage configuration status.
What I/O voltage standards are supported by the XC3S500E-4FT256C?
The XC3S500E-4FT256C supports LVTTL, LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), PCI, HSTL Class I/II, and SSTL2 Class I/II standards. Each I/O bank is independently configurable for a single VCCO voltage, enabling mixed-voltage system interfacing.
Is the XC3S500E-4FT256C still in active production?
The XC3S500E-4FT256C is a mature device in the Spartan-3E family. While no longer in active new-design promotion, AMD maintains qualified sources and extended lifecycle support for existing customer programs through authorized distribution channels and long-term agreements.
XC3S500E-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 190
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S500E-4FT256C FAQ
1.How can I place an order for XC3S500E-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4FT256C reliable?
The price and inventory of XC3S500E-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S500E-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4FT256C?
XC3S500E-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4FT256C?
For technical support, including XC3S500E-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4FT256C requirements.
6.How does Aetrix verify that XC3S500E-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S500E-4FT256C?
All XC3S500E-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4FT256C part is unused and in its original packaging.
Return procedure for XC3S500E-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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