My Inquiry
My Account
AMD XC3S500E-4FTG256C
- Part No.:
- XC3S500E-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S500E-4FTG256C.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:11,018
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S500E-4FTG256C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and 228 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO standards including LVCMOS, LVTTL, and PCI, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count and voltage compatibility, internal RAM capacity, DLL availability for clock management, and supported configuration modes (JTAG, Master Serial, Slave SelectMAP).
Technical Context
The XC3S500E-4FTG256C integrates eight Digital Clock Managers (DCMs) for phase alignment, duty cycle correction, and frequency synthesis. Its logic fabric comprises Configurable Logic Blocks (CLBs) with four-input LUTs and flip-flops, and it includes 360 Kb of total block RAM distributed across 72 x 18 Kb dual-port RAM blocks.
Configuration is performed via external PROM or processor through Master Serial or Slave SelectMAP mode; JTAG boundary-scan is supported for testing. The device uses 1.2 V core voltage and supports 3.3 V, 2.5 V, and 1.8 V I/O standards with programmable drive strength and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - determines combinational and sequential logic capacity for RTL implementation |
| System Gates | 500,000 - legacy metric estimating equivalent NAND gate count for architectural comparison |
| Block RAM | 360 Kb - supports on-chip data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 228 - enables high-pin-count peripheral interfacing with bank-wise voltage isolation |
| DCMs | 8 - provides jitter-tolerant clock synthesis, multiplication, division, and phase shifting |
| Speed Grade | -4 - guarantees maximum 4.5 ns propagation delay for CLB-to-CLB paths at 1.2 V/85°C |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal design margin |
Pinout & Package
XC3S500E-4FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and standard JEDEC MO-251AC footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG331.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered with ≥10 µF ceramic + 1 µF ceramic per bank; decoupling critical for signal integrity |
| VCCO_0–VCCO_5 | I/O bank power | Each of six banks independently configurable for 3.3 V / 2.5 V / 1.8 V operation |
| PROGRAM_B | Active-low configuration initiator | Pulling low resets configuration logic and clears SRAM contents |
| DONE | Configuration status indicator | Open-drain output pulled high externally; goes high when bitstream loading completes successfully |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated multiplier blocks | Four 18 × 18-bit multipliers support arithmetic-intensive functions like FIR filtering without LUT resource overhead |
| SelectIO technology | Per-bank I/O voltage selection enables mixed-voltage interfacing (e.g., 3.3 V microcontroller to 1.8 V sensor) |
| Digital Clock Managers (DCMs) | Eight DCMs allow independent clock domain generation, eliminating need for external PLL ICs in timing-critical subsystems |
| Embedded block RAM | 72 × 18 Kb RAM blocks provide deterministic latency memory access for real-time buffering and state storage |
| MultiBoot configuration | Supports up to four independent bitstreams stored in external PROM for field-upgradable firmware and fail-safe recovery |
Applications
| Industrial PLC I/O Expansion | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Adding isolated digital input/output channels to legacy PLC backplanes using fieldbus protocols. IC Role / Device Role / Timing Role: FPGA acts as protocol-agnostic I/O mapper and level translator between 24 V industrial sensors and 3.3 V controller bus. Use Value: 228 I/O pins and bank-wise VCCO enable direct connection to diverse sensor voltages without external level shifters. | Use Scenario: Implementing ISO 15765-4 (CAN) and K-Line physical layer translation in OBD-II diagnostic tools. IC Role / Device Role / Timing Role: FPGA serves as flexible bridge between USB host and automotive serial buses, handling protocol framing and timing arbitration. Use Value: Eight DCMs ensure precise 500 kbps CAN bit timing and synchronized K-Line edge detection without external clock synthesizers. |
| Medical Imaging Data Aggregation | Test Equipment Pattern Generator |
Use Scenario: Consolidating parallel LVDS outputs from multiple ultrasound transducer arrays into a single serialized stream. IC Role / Device Role / Timing Role: FPGA performs parallel-to-serial conversion, channel synchronization, and CRC insertion before sending over PCIe or GigE. Use Value: 360 Kb block RAM buffers full frame data while logic cells implement real-time checksum and packetization logic. | Use Scenario: Generating high-speed digital stimulus patterns for ATE systems targeting ASIC and SoC validation. IC Role / Device Role / Timing Role: FPGA functions as deterministic pattern sequencer with sub-nanosecond timing resolution via DCM-controlled clocks. Use Value: -4 speed grade guarantees 4.5 ns path delay stability across temperature, enabling reliable 200+ MHz vector rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4PQ208C | Lower logic density (8,064 CLBs), 160-pin PQFP package, no dedicated multipliers | Fits space-constrained PCBs but lacks I/O count and RAM for multi-protocol bridging | Choose when board area is limited and only basic logic + 128 I/O required |
| XC3S1000-4FG320C | Higher density (17,280 CLBs), 320-pin FBGA, same DCM count and I/O voltage flexibility | Supports larger state machines and dual-interface co-processing (e.g., USB + Ethernet MAC) | Choose when expanding logic capacity beyond 11,200 CLBs while retaining identical clocking and I/O architecture |
Compared with XC3S500E-4FTG256C, XC3S400-4PQ208C trades I/O and RAM for compact packaging, while XC3S1000-4FG320C extends scalability within the same Spartan-3E family-both retain DCM-based clock management and SelectIO compatibility but differ in density, pin count, and thermal profile.
Availability
XC3S500E-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S500E-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-3E family was designed by Xilinx to deliver high I/O density and integrated clock management at lowest cost per logic cell for high-volume embedded applications.
FAQ
What configuration modes does the XC3S500E-4FTG256C support?
The XC3S500E-4FTG256C supports Master Serial (via external PROM), Slave SelectMAP (parallel loading from microprocessor), and JTAG boundary-scan configuration. All modes are implemented in hardware and require no soft-core initialization. The XC3S500E-4FTG256C also supports MultiBoot, allowing up to four distinct bitstreams to be selected dynamically during power-up based on external address pins.
Does the XC3S500E-4FTG256C include built-in memory blocks?
Yes, the XC3S500E-4FTG256C contains 72 distributed 18 Kb block RAMs totaling 360 Kb. Each block supports synchronous dual-port operation with independent read/write clocks, enabling true FIFO or ping-pong buffer implementations. These RAM blocks are physically embedded in the CLB columns and accessible without routing congestion, unlike distributed RAM synthesized from LUTs.
Can the XC3S500E-4FTG256C operate with mixed I/O voltages on different banks?
Yes, the XC3S500E-4FTG256C has six independent I/O banks (Bank 0–5), each with its own VCCO supply. This allows simultaneous operation at 3.3 V, 2.5 V, and 1.8 V on separate banks. For example, Bank 0 can interface with a 3.3 V microcontroller while Bank 2 connects to a 1.8 V ADC-all without level-shifting components. Each bank's VCCO must be within ±5% of its nominal value.
What clock management resources are available in the XC3S500E-4FTG256C?
The XC3S500E-4FTG256C integrates eight Digital Clock Managers (DCMs). Each DCM provides input clock multiplication/division, phase shifting, duty cycle correction, and frequency synthesis. They accept input frequencies from 1 MHz to 200 MHz and generate stable outputs with jitter < ±100 ps. The XC3S500E-4FTG256C does not include PLLs or MMCMs-only DCMs-as confirmed in DS312 v2.5.
Is the XC3S500E-4FTG256C RoHS compliant and lead-free?
Yes, the XC3S500E-4FTG256C is manufactured in a lead-free, RoHS-compliant process. The FTBGA package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation-including substance declarations and test reports-is available under Xilinx document UG331 and AMD Product Change Notices (PCNs) issued post-acquisition.
XC3S500E-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 190
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S500E-4FTG256C FAQ
1.How can I place an order for XC3S500E-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4FTG256C reliable?
The price and inventory of XC3S500E-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S500E-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4FTG256C?
XC3S500E-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4FTG256C?
For technical support, including XC3S500E-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4FTG256C requirements.
6.How does Aetrix verify that XC3S500E-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S500E-4FTG256C?
All XC3S500E-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S500E-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S500E-4FTG256C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
