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AMD XC3S500E-4FTG256I
- Part No.:
- XC3S500E-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S500E-4FTG256I.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,763
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Product details
Overview
XC3S500E-4FTG256I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and embedded block RAM totaling 360 kbits. It operates at -4 speed grade (1.14 ns CLB delay), supports LVCMOS25/LVCMOS33 I/O standards, and is packaged in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) with 173 user I/Os. It targets cost-sensitive industrial control and communication interface bridging.
For engineers reviewing the XC3S500E-4FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, embedded RAM capacity, and FTBGA256 thermal/mechanical compatibility with legacy Spartan-3E PCB footprints.
Technical Context
The XC3S500E-4FTG256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and supports SelectIO technology for single-ended and differential signaling including LVDS and SSTL.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty-cycle correction - critical for synchronous digital system timing alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - determines maximum combinational/sequential logic capacity per design |
| System Gates | 500,000 - industry-standard metric for relative logic density vs ASIC equivalents |
| Block RAM | 360 kbits - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| Max User I/O | 173 - defines number of programmable signal interfaces available for peripheral connectivity |
| Speed Grade | -4 - guarantees worst-case CLB propagation delay ≤1.14 ns at 1.2 V core supply |
| DCM Units | 4 - provides independent clock synthesis and skew management for up to four clock domains |
Pinout & Package
XC3S500E-4FTG256I is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and Pb-free (RoHS-compliant) finish. Thermal performance supports industrial temperature operation (-40°C to +100°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for CLBs and DCMs |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and I/O banks |
| A1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| D1 | INIT_B | Open-drain status output indicating configuration completion or error condition |
| E2 | CCLK | Configuration clock input - controls serial bitstream loading rate during Master Serial mode |
| H1 | DONE | Open-drain output confirming successful configuration and enabling I/O release |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable hardware-accelerated DSP functions without external ICs |
| SelectIO Technology | Supports 19 I/O standards including LVCMOS, LVTTL, SSTL, and LVDS - simplifies interface to diverse peripherals |
| Digital Clock Manager (DCM) | Four fully independent DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division |
| Configuration Security | Bitstream encryption option prevents unauthorized readback and cloning of programmed logic design |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation in programmable logic controller backplanes. IC Role / Device Role / Timing Role: FPGA fabric implements custom state machines and parallel I/O controllers; DCMs synchronize fieldbus timing with CPU clock domain. Use Value: Enables deterministic response under 10 µs cycle time using on-chip logic and embedded RAM for register mapping. | Use Scenario: Bridging between PCI and proprietary parallel bus in test equipment chassis. IC Role / Device Role / Timing Role: Acts as synchronous protocol converter with dual-clock FIFO buffering and handshaking logic. Use Value: Eliminates need for discrete glue logic and external FIFOs by integrating 360 kbits block RAM and 173 I/Os. |
| Video Signal Formatter | Motor Control Encoder Interface |
Use Scenario: Pixel clock generation, color space conversion, and sync pulse insertion for analog video output stages. IC Role / Device Role / Timing Role: Configurable logic processes parallel pixel data; DCMs generate precise pixel clocks and blanking intervals. Use Value: Achieves sub-pixel timing accuracy (<1 ns jitter) using DCM phase-shift capability and dedicated carry chains. | Use Scenario: Quadrature decoding and position interpolation for servo motor feedback in CNC systems. IC Role / Device Role / Timing Role: Implements high-speed counter logic with 100 MHz input capture and real-time direction detection. Use Value: Supports 4× quadrature interpolation at >5 MHz encoder edge rate using distributed RAM-based counters and fast carry logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4FTG256C | Lower logic density (8,064 LCs), same FTBGA256 package, commercial temp range (0°C to +85°C) | Suitable for less complex control logic where full 500K-gate capacity is unused | Select when design fits within 8K LCs and ambient operating temperature remains within commercial range |
| XC3S1000-4FTG256I | Higher density (17,280 LCs), same package and industrial temp rating, but larger block RAM (576 kbits) | Required for designs needing >11K LCs or >360 kbits RAM, e.g., multi-channel protocol stacks | Choose when logic utilization exceeds 90% of XC3S500E-4FTG256I resources or additional RAM is needed |
Compared with XC3S500E-4FTG256I, XC3S400A-4FTG256C reduces gate count and thermal margin for cost-sensitive commercial use, while XC3S1000-4FTG256I extends logic and memory headroom for scalable industrial firmware upgrades - both retain identical footprint and I/O compatibility.
Availability
XC3S500E-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and embedded video processing requiring stable component supply across extended product lifecycles.
Supply support for XC3S500E-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3E family was designed for cost-optimized, high-volume embedded logic replacement - targeting industrial control, consumer electronics, and communications infrastructure where gate density and I/O flexibility outweigh advanced features like hard processors or high-speed transceivers.
FAQ
What is the maximum operating junction temperature for XC3S500E-4FTG256I?
The XC3S500E-4FTG256I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under continuous operation with proper PCB thermal design, including recommended copper pour and via placement per Xilinx UG331. The device maintains timing compliance and configuration integrity across this full range.
Does XC3S500E-4FTG256I support JTAG configuration?
Yes, XC3S500E-4FTG256I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. It uses the TCK/TMS/TDI/TDO pins for configuration bitstream loading and allows partial reconfiguration. JTAG mode does not require external PROM and is commonly used during development and in-system programming workflows for the XC3S500E-4FTG256I.
How many Digital Clock Managers (DCMs) are integrated into XC3S500E-4FTG256I?
The XC3S500E-4FTG256I integrates four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty-cycle correction. These are essential for managing multiple clock domains in complex synchronous designs implemented on the XC3S500E-4FTG256I.
Can XC3S500E-4FTG256I be used in place of XC3S500E-4PQ208I?
No, XC3S500E-4FTG256I is not a direct replacement for XC3S500E-4PQ208I due to different packages: FTBGA256 vs PQFP208. Pin count, ball/pad layout, thermal characteristics, and I/O bank organization differ significantly. Migration requires PCB redesign, even though logic resources and speed grade are identical between the two XC3S500E-4 variants.
What I/O standards are supported by XC3S500E-4FTG256I?
XC3S500E-4FTG256I supports 19 SelectIO standards including LVCMOS18/25/33, LVTTL, PCI, GTL, HSTL, SSTL, and differential standards such as LVDS and RSDS. I/O banks are independently configurable, allowing mixed-voltage operation across the 173-user-I/O set - a key capability confirmed in Xilinx DS312 for the XC3S500E-4FTG256I.
XC3S500E-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 190
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S500E-4FTG256I FAQ
1.How can I place an order for XC3S500E-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4FTG256I reliable?
The price and inventory of XC3S500E-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S500E-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4FTG256I?
XC3S500E-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4FTG256I?
For technical support, including XC3S500E-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4FTG256I requirements.
6.How does Aetrix verify that XC3S500E-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S500E-4FTG256I?
All XC3S500E-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S500E-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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