AMD XC3S500E-4PQ208I

Overview

XC3S500E-4PQ208I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and embedded block RAM totaling 360 kbits. It operates at -4 speed grade (t_PD = 4.6 ns), uses 1.2 V core voltage, and is packaged in a 208-pin PQFP. It targets cost-sensitive industrial control and communication interface bridging.

For engineers reviewing the XC3S500E-4PQ208I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (141 user I/Os), differential signaling support (LVDS, LVDSEXT), embedded RAM size, and -4 speed grade timing performance for synchronous logic implementation.

Technical Context

The XC3S500E-4PQ208I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and LVDS.

Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction-supporting input frequencies from 5 MHz to 200 MHz and output jitter < ±150 ps.

Key Specifications

Pinout & Package

XC3S500E-4PQ208I is housed in a 208-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 28 × 28 mm body size, and standard JEDEC MO-137AC footprint. Thermal pad is not present; thermal dissipation relies on PCB copper area and airflow.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S500E-4PQ208I, the XC3S400A-4PQ208C reduces gate count and logic resources while maintaining pin compatibility and timing, whereas the XC3S700A-4PQ208C extends logic capacity and memory without altering layout or power delivery-both share identical thermal profile and configuration interface.

Availability

XC3S500E-4PQ208I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended production lifecycles.

Supply support for XC3S500E-4PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.

The Spartan-3E family was designed for cost-optimized, high-volume applications demanding reliable logic density, low-power operation, and mature process technology-targeting industrial control, consumer video, and communications infrastructure.

FAQ

What is the maximum operating frequency supported by XC3S500E-4PQ208I?

The XC3S500E-4PQ208I has a -4 speed grade specifying a maximum clock frequency of 315 MHz for registered logic paths under typical conditions. This value assumes proper PCB layout, 1.2 V core supply with ≤±3% tolerance, and ambient temperature ≤85°C. Actual achievable frequency depends on design utilization, routing congestion, and DCM configuration settings. The XC3S500E-4PQ208I datasheet defines timing parameters including t_PD = 4.6 ns for internal path delays.

Does XC3S500E-4PQ208I support JTAG programming and debugging?

Yes, XC3S500E-4PQ208I fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TCK, TMS, TDI, and TDO pins. It enables in-system programming, configuration verification, and real-time debugging via Xilinx iMPACT or Vivado Hardware Manager. The XC3S500E-4PQ208I also supports JTAG-based partial reconfiguration and readback of configuration memory for validation purposes.

What I/O standards are supported by XC3S500E-4PQ208I?

XC3S500E-4PQ208I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, and RSDS across its seven I/O banks. Each bank is independently configurable for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCO. Differential standards like LVDS require adjacent pins within the same bank and are terminated internally. The XC3S500E-4PQ208I does not support DDR3 or PCIe Gen2 native signaling.

How is configuration performed for XC3S500E-4PQ208I?

XC3S500E-4PQ208I supports master serial, slave serial, JTAG, and boundary-scan configuration modes. In master serial mode, it automatically loads configuration bitstream from external SPI PROM upon power-up. The XC3S500E-4PQ208I asserts DONE after successful CRC check and initialization; PROGRAM_B can force reconfiguration. Configuration data is stored in SRAM and lost on power cycle.

Is XC3S500E-4PQ208I RoHS compliant and lead-free?

Yes, XC3S500E-4PQ208I is RoHS compliant and manufactured with lead-free (Pb-free) terminations per J-STD-609. The PQ208 package uses matte tin plating over copper leadframe. Full compliance documentation-including substance declarations and test reports-is available from AMD's product change notifications and material content portal for the XC3S500E-4PQ208I.