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AMD XC3S500E-4VQG100C
- Part No.:
- XC3S500E-4VQG100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S500E-4VQG100C.pdf
- Description:
- IC FPGA 66 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,368
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Product details
Overview
XC3S500E-4VQG100C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and 228 I/O pins in a 100-pin VQFP package. It operates at 400 MHz system clock speed and integrates 360 Kb of block RAM, targeting low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-4VQG100C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, DLL support, voltage tolerance (3.3V/2.5V), and configuration mode compatibility (Master Serial, Slave SelectMAP).
Technical Context
The XC3S500E-4VQG100C implements a hierarchical logic architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains. It supports LVCMOS25/LVCMOS33 I/O standards and includes four Digital Clock Managers (DCMs) for phase alignment, duty cycle correction, and frequency synthesis.
Configuration is performed via serial PROM or microprocessor interface using IEEE 1532-compliant boundary-scan. The device uses internal 1.2V core voltage with separate 2.5V or 3.3V I/O supply, enabling mixed-voltage system integration without level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| System Gates | 500,000 - indicates total equivalent gate count for ASIC comparison and resource estimation |
| Block RAM | 360 Kb - supports dual-port FIFOs, frame buffers, or lookup tables up to 18 Kb per block |
| I/O Pins | 228 - enables high-pin-count peripheral interfacing including parallel buses and multi-channel ADCs |
| DCMs | 4 - delivers jitter-reduced clocks, input deskew, and frequency multiplication/division |
| Max System Frequency | 400 MHz - defines highest achievable synchronous logic operating speed under typical conditions |
| Core Voltage | 1.2 V ±3% - requires precision regulation; impacts dynamic power and thermal design |
Pinout & Package
XC3S500E-4VQG100C is housed in a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14 mm × 14 mm body size, and exposed pad for thermal dissipation. Pin assignment follows Xilinx Spartan-3E family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | VCCO_0 | I/O bank 0 power supply - must be set to 2.5V or 3.3V matching connected peripherals |
| P2 | IO_L0N_0 | Differential pair negative input - used with P3 for LVDS or RSDS signaling |
| P3 | IO_L0P_0 | Differential pair positive input - pairs with P2 for noise-immune high-speed interfaces |
| P4 | GND | Ground reference - required for signal integrity and decoupling near I/O banks |
| P5 | IO_L1N_0 | Secondary differential input - supports additional LVDS channels in bank 0 |
| P99 | CCLK | Configuration clock input - drives internal configuration shift register during Master Serial mode |
| P100 | DONE | Configuration status output - goes high when bitstream loading completes and device enters user mode |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Four independent DCMs enable precise clock synthesis, phase shifting, and jitter reduction without external PLL ICs |
| SelectIO Technology | Supports 17 I/O standards including LVCMOS, LVTTL, PCI, and LVDS - eliminates need for external level translators |
| Embedded Block RAM | 360 Kb distributed across 20 blocks - allows implementation of on-chip memory buffers without external SRAM |
| MultiBoot Configuration | Enables dual-bitstream storage and runtime selection - supports field-upgradable firmware and fail-safe boot modes |
| IEEE 1149.1 JTAG Boundary Scan | Provides full visibility into I/O states and internal logic for board-level test and debug without physical probes |
Applications
| Industrial Motion Control | Automotive Camera Interface |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and PLC-based actuators. IC Role / Device Role / Timing Role: FPGA fabric executes deterministic logic with sub-microsecond latency; DCMs synchronize encoder sampling and PWM generation. Use Value: 228 I/O pins directly interface quadrature encoders, analog input modules, and isolated digital outputs without glue logic. | Use Scenario: Aggregating and preprocessing video data from multiple CMOS image sensors in ADAS camera modules. IC Role / Device Role / Timing Role: Acts as a pixel-data concentrator and format converter between MIPI CSI-2 receivers and parallel video output to SoC. Use Value: Embedded block RAM buffers frame data while logic implements line-synchronous stitching and metadata tagging. |
| Medical Imaging Front-End | Communications Protocol Bridge |
Use Scenario: Digitizing and conditioning analog signals from ultrasound transducer arrays before transmission to DSP subsystems. IC Role / Device Role / Timing Role: Configurable logic routes ADC samples, applies real-time FIR filtering, and manages DMA handshaking with host processor. Use Value: 360 Kb block RAM stores filter coefficients and intermediate sample buffers, reducing external memory bandwidth demand. | Use Scenario: Translating legacy industrial protocols (e.g., RS-485 Modbus) to Ethernet/IP or CAN FD for edge gateway integration. IC Role / Device Role / Timing Role: Implements protocol state machines, packet assembly/disassembly, and timing-critical UART-to-Ethernet bridging logic. Use Value: Four DCMs independently clock UART, MAC, and memory interfaces at optimal frequencies without skew-induced framing errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4VQG100C | 400K system gates, 9,104 logic cells, 288 Kb block RAM - lower density and reduced I/O count (214 pins) | Suitable for less complex control tasks where 228 I/O and 360 Kb RAM are not required | Select when cost sensitivity outweighs need for margin in logic resources or memory depth |
| XC6SLX9-2TQG144C | 9,152 logic cells, 576 Kb block RAM, 102 I/O pins, 1.2V core - Spartan-6 generation with improved DSP slices and lower static power | Better suited for designs requiring arithmetic acceleration or longer product lifecycle support | Choose for new designs needing extended availability, enhanced power efficiency, or integrated DSP capability |
Compared with XC3S500E-4VQG100C, the XC3S400A-4VQG100C offers reduced resources at lower cost, while the XC6SLX9-2TQG144C provides architectural upgrades and longer-term supply assurance - both require PCB redesign due to different pin counts and package footprints.
Availability
XC3S500E-4VQG100C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-end, and automotive camera interface applications requiring stable component supply and long-lifecycle sourcing.
Supply support for XC3S500E-4VQG100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and AI solutions. Following its acquisition of Xilinx in 2022, AMD maintains legacy Spartan-3E product support and documentation.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded applications requiring flexible logic density, robust I/O, and proven configuration reliability - especially in industrial and automotive subsystems.
FAQ
What is the maximum operating temperature for XC3S500E-4VQG100C?
The XC3S500E-4VQG100C is rated for commercial temperature range (0°C to +70°C). Its VQFP package supports thermal dissipation up to 1.2 W typical power consumption. Derating curves in DS312 specify junction temperature limits under varying airflow and PCB copper area - XC3S500E-4VQG100C must not exceed 100°C junction temperature in continuous operation.
Does XC3S500E-4VQG100C support JTAG programming?
Yes, XC3S500E-4VQG100C fully supports IEEE 1149.1 JTAG boundary scan for programming, debugging, and testing. The TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG adapters. XC3S500E-4VQG100C also allows concurrent JTAG configuration and background logic operation after initial bitstream load.
What configuration modes does XC3S500E-4VQG100C support?
XC3S500E-4VQG100C supports Master Serial, Slave Serial, Slave SelectMAP, and Boundary Scan (JTAG) configuration modes. Master Serial uses internal oscillator and CCLK to drive external PROM; Slave SelectMAP enables microprocessor-controlled parallel loading. XC3S500E-4VQG100C does not support Master SelectMAP or System ACE.
Can XC3S500E-4VQG100C operate with 2.5V I/O voltage only?
Yes, XC3S500E-4VQG100C supports 2.5V I/O operation in all banks when VCCO is set to 2.5V. Each I/O bank has independent VCCO, allowing mixed 2.5V and 3.3V interfaces on the same device. XC3S500E-4VQG100C does not support 1.8V or 1.5V I/O standards - those require Spartan-6 or later families.
Is XC3S500E-4VQG100C still in active production?
XC3S500E-4VQG100C is in mature lifecycle status with no announced discontinuance. AMD continues to fulfill orders through authorized distribution channels and provides archived documentation, bitstream tools, and ISE Design Suite 14.7 support. XC3S500E-4VQG100C remains available for legacy design refresh and repair programs.
XC3S500E-4VQG100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 66
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S500E-4VQG100C FAQ
1.How can I place an order for XC3S500E-4VQG100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4VQG100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4VQG100C reliable?
The price and inventory of XC3S500E-4VQG100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4VQG100C is usually 5 days.
3.What payment methods are accepted for XC3S500E-4VQG100C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4VQG100C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4VQG100C?
XC3S500E-4VQG100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4VQG100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4VQG100C?
For technical support, including XC3S500E-4VQG100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4VQG100C requirements.
6.How does Aetrix verify that XC3S500E-4VQG100C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4VQG100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4VQG100C meets industry standards.
7.What is the process for return or replacement of XC3S500E-4VQG100C?
All XC3S500E-4VQG100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4VQG100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4VQG100C part is unused and in its original packaging.
Return procedure for XC3S500E-4VQG100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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