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AMD XC3S500E-4VQG100I
- Part No.:
- XC3S500E-4VQG100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S500E-4VQG100I.pdf
- Description:
- IC FPGA 66 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,213
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Product details
Overview
XC3S500E-4VQG100I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,200 logic cells, and embedded block RAM totaling 360 kbits. It operates at -4 speed grade, supports 1.2 V core voltage, and is packaged in a 100-pin VQFP with industrial temperature range (-40°C to +100°C). It targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-4VQG100I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (81 user I/Os), differential signaling support (LVDS, RSDS), embedded multiplier capability (16×16), and configuration via SPI serial PROM or JTAG.
Technical Context
The XC3S500E-4VQG100I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates twelve 18×18 multipliers and supports up to 81 single-ended or 40 differential user I/Os.
Configuration is performed through Master Serial mode using external SPI PROM or JTAG boundary-scan, with optional fallback to Slave SelectMAP for parallel programming. The device includes internal oscillator for startup and supports Digital Clock Manager (DCM) for clock synthesis and phase alignment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 500,000 - industry-standard metric approximating equivalent NAND gate count for logic density comparison |
| User I/O Pins | 81 - supports mixed-voltage interfaces (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) with programmable drive strength |
| Block RAM | 360 kbits - distributed across 20 embedded RAM blocks (18 kbits each) for FIFO, buffer, or lookup table use |
| Multipliers | 12 × 16×16-bit - enables hardware-accelerated arithmetic for filtering, motor control, or protocol processing |
| DCM Units | 4 - provides clock doubling, duty-cycle correction, phase shifting, and frequency synthesis without external PLL |
| Speed Grade | -4 - guarantees timing performance up to 375 MHz for internal logic and 280 MHz for I/Os under industrial conditions |
Pinout & Package
XC3S500E-4VQG100I is housed in a 100-pin Very Thin Quad Flat Pack (VQFP), measuring 14 mm × 14 mm with 0.5 mm lead pitch. The package supports fine-pitch PCB assembly and thermal dissipation suitable for industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P10, P12–P20, P22–P30, P32–P40, P42–P50, P52–P60, P62–P70, P72–P80, P82–P90, P92–P100 | User I/O / Configuration I/O | Programmable bidirectional pins supporting LVCMOS, LVTTL, PCI, LVDS, and RSDS standards |
| T1, T2, U1, U2, V1, V2, W1, W2 | Dedicated Configuration Pins | Hardwired to boot sequence: INIT_B, PROGRAM_B, DONE, CCLK, DIN, M0–M2 for mode selection |
| R1, R2, T3, U3, V3, W3 | Power & Ground | VCCINT (1.2 V core), VCCAUX (2.5 V auxiliary), VCCO (I/O bank voltage), GND - require local decoupling |
| Y1, Y2, A1, A2 | JTAG Boundary-Scan | TCK, TMS, TDI, TDO - enable IEEE 1149.1-compliant test, debug, and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multiplier Blocks | 12 × 16×16-bit hard macros accelerate arithmetic-intensive tasks without consuming logic resources |
| Digital Clock Manager (DCM) | 4 independent DCMs provide jitter-free clock synthesis, phase alignment, and frequency multiplication for synchronous design stability |
| SelectIO Technology | Supports 12 I/O standards including LVDS and RSDS with programmable slew rate and drive strength per bank |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling high-density register-rich logic implementation |
| Internal Oscillator | ~4 MHz on-chip RC oscillator enables configuration startup without external clock source |
Applications
| Industrial Motor Control Interface | Legacy Bus Protocol Bridge |
|---|---|
Use Scenario: Real-time translation between RS-485 Modbus RTU and SPI-based sensor subsystems in PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as deterministic protocol converter with cycle-accurate timing control and dual-bank I/O voltage support. Use Value: Enables interoperability between legacy field devices and modern microcontroller-based edge nodes without ASIC redesign. | Use Scenario: Bridging ISA bus peripherals to ARM-based host controllers in medical diagnostic equipment. IC Role / Device Role / Timing Role: XC3S500E-4VQG100I implements synchronous bus arbitration, address decoding, and data buffering with sub-50 ns latency. Use Value: Extends service life of certified analog front-end modules by replacing obsolete interface ASICs with field-upgradable logic. |
| Automotive Diagnostic Tool Adapter | Test Equipment Pattern Generator |
Use Scenario: USB-to-ISO 15765-4 (CAN) and K-Line adapter for OEM-level vehicle ECU reprogramming. IC Role / Device Role / Timing Role: FPGA handles physical layer timing, bit-stuffing, and protocol state machines while isolating host USB controller from automotive bus transients. Use Value: Meets ISO 11898-2 electrical compliance and supports concurrent CAN channel monitoring and K-Line diagnostics. | Use Scenario: Generating high-fidelity digital stimulus waveforms for IC validation in ATE environments. IC Role / Device Role / Timing Role: XC3S500E-4VQG100I drives 81 synchronized outputs with programmable edge placement (±1 ns resolution via DCM feedback). Use Value: Replaces fixed-pattern PROM-based generators with reconfigurable timing engines adaptable to new DUT protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-5VQG100C | Faster -5 speed grade; commercial temperature range (0°C to +85°C); identical pinout and logic resources | Suitable for non-industrial environments where higher clock margins are needed but extended temperature is not required | Select when timing closure requires >375 MHz internal operation and ambient conditions remain within commercial range |
| XC3S200A-4VQG100I | Lower density: 4,160 logic cells, 200,000 system gates, 240 kbits block RAM; same VQFP-100 package and industrial temp rating | Better fit for simpler glue logic or low-complexity state machines where full 500E resources are unused | Choose when BOM cost reduction is prioritized and design fits within reduced logic and memory footprint |
Compared with XC3S500E-4VQG100I, the -5VQG100C offers tighter timing margins at lower cost in commercial settings, while the XC3S200A-4VQG100I reduces power and bill-of-materials cost for less demanding control tasks-both retain identical PCB layout and I/O compatibility.
Availability
XC3S500E-4VQG100I is available at Aetrix Electronics and suitable for industrial motor control, automotive diagnostics, legacy bus bridging, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S500E-4VQG100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3E family was designed by Xilinx to deliver high logic density and I/O flexibility at lowest possible cost for high-volume, cost-sensitive embedded systems - especially where reconfigurable logic replaces ASICs or CPLDs.
FAQ
What is the maximum operating frequency of the XC3S500E-4VQG100I?
The XC3S500E-4VQG100I has a -4 speed grade, guaranteeing internal logic performance up to 375 MHz and I/O toggle rates up to 280 MHz under industrial temperature conditions. Actual achievable frequency depends on design complexity, routing, and DCM usage. The device includes four Digital Clock Managers that support frequency synthesis and phase alignment to meet timing constraints without external PLLs.
Does the XC3S500E-4VQG100I support JTAG programming and debugging?
Yes, the XC3S500E-4VQG100I supports IEEE 1149.1-compliant JTAG boundary-scan via dedicated pins TCK, TMS, TDI, and TDO (located at Y1, Y2, A1, A2). This enables in-system programming, configuration verification, and real-time debugging. JTAG can be used independently of the primary configuration mode (Master Serial or Slave SelectMAP), making it essential for development and field updates.
What I/O standards are supported by the XC3S500E-4VQG100I?
The XC3S500E-4VQG100I supports 12 I/O standards including LVCMOS, LVTTL, PCI, HSTL-I, SSTL2, and differential standards LVDS and RSDS. Each of its 12 I/O banks is independently configurable for voltage (1.2 V to 3.3 V), drive strength, and slew rate. This allows mixed-voltage interfacing critical for bridging legacy and modern subsystems without level-shifters.
How is the XC3S500E-4VQG100I configured after power-up?
The XC3S500E-4VQG100I supports multiple configuration modes. In Master Serial mode, it automatically loads configuration data from an external SPI PROM upon power-up. Alternatively, it can be configured via JTAG or Slave SelectMAP (parallel) mode using a microcontroller or host processor. Configuration status is monitored via DONE, INIT_B, and PROGRAM_B pins.
Is the XC3S500E-4VQG100I suitable for automotive applications?
The XC3S500E-4VQG100I carries an industrial temperature rating (-40°C to +100°C) and meets AEC-Q100 stress test requirements when used within specified voltage and derating guidelines. It is deployed in automotive diagnostic tools and ECU reprogramming adapters. However, it is not qualified as an automotive-grade part per AEC-Q100 Grade 2 or Grade 1, so system-level qualification remains the responsibility of the end designer.
XC3S500E-4VQG100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 66
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S500E-4VQG100I FAQ
1.How can I place an order for XC3S500E-4VQG100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-4VQG100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-4VQG100I reliable?
The price and inventory of XC3S500E-4VQG100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-4VQG100I is usually 5 days.
3.What payment methods are accepted for XC3S500E-4VQG100I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-4VQG100I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-4VQG100I?
XC3S500E-4VQG100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-4VQG100I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-4VQG100I?
For technical support, including XC3S500E-4VQG100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-4VQG100I requirements.
6.How does Aetrix verify that XC3S500E-4VQG100I is sourced from the original manufacturer or authorized distributors?
All XC3S500E-4VQG100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-4VQG100I meets industry standards.
7.What is the process for return or replacement of XC3S500E-4VQG100I?
All XC3S500E-4VQG100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-4VQG100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-4VQG100I part is unused and in its original packaging.
Return procedure for XC3S500E-4VQG100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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