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AMD XC3S500E-5CPG132C
- Part No.:
- XC3S500E-5CPG132C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 132-TFBGA, CSPBGA
- Datasheet:
-
XC3S500E-5CPG132C.pdf
- Description:
- IC FPGA 92 I/O 132CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,718
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Product details
Overview
XC3S500E-5CPG132C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 500,000 system gates, 11,840 logic cells, and 228 I/O pins in a 132-pin CSBGA package. It operates at -5 speed grade (100 MHz system clock), supports SelectIO standards including LVCMOS, LVTTL, and PCI, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S500E-5CPG132C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, supported I/O standards, configuration mode compatibility, and thermal performance in compact PCB layouts.
Technical Context
The XC3S500E-5CPG132C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (36 Kbits), and dedicated digital clock managers (DCMs) for phase alignment and frequency synthesis. It supports JTAG, Master Serial, and Slave Parallel configuration modes.
Its I/O bank structure allows mixed-voltage operation across four banks, with programmable drive strength (2–24 mA), slew rate control, and input differential termination. The -5 speed grade guarantees timing closure up to 100 MHz for synchronous logic paths under worst-case industrial conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,840 - defines maximum combinational and sequential logic capacity for custom state machines or protocol engines |
| System Gates | 500,000 - indicates relative ASIC-equivalent gate count for high-level architectural estimation |
| I/O Pins | 228 - usable user-defined bidirectional pins with per-bank voltage and standard assignment |
| Block RAM | 36 Kbits - distributed across 20 x 18-Kbit blocks for FIFOs, buffers, or lookup tables |
| DCMs | 4 - digital clock managers enabling jitter-reduced clock multiplication, division, and phase shift |
| Speed Grade | -5 - guarantees 100 MHz system clock timing margin under industrial temperature and voltage extremes |
| Package | 132-pin CSBGA (8×8 mm, 0.5 mm pitch) - surface-mount, thermally enhanced, suitable for automated assembly |
Pinout & Package
The XC3S500E-5CPG132C is housed in a 132-pin Chip Scale Ball Grid Array (CSBGA) package with 8×8 mm body size, 0.5 mm ball pitch, and Pb-free construction. Thermal pad on underside improves power dissipation in sustained logic activity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V internal logic rail; requires low-noise regulation and local decoupling |
| VCCO_0–VCCO_3 | I/O bank supplies | Separate 1.2–3.3 V supplies per bank enable mixed-voltage interface design |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reconfiguration from external PROM or host processor |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test and programming access without requiring dedicated configuration hardware |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DCMs | Four independent digital clock managers provide deterministic clock synthesis without external PLL components |
| SelectIO Technology | Per-pin programmable I/O standards support direct interfacing to legacy and modern peripherals without level-shifter ICs |
| Multi-Bank I/O | Four isolated I/O banks allow concurrent 1.8 V, 2.5 V, and 3.3 V signaling on same device |
| Configurable Drive/Slew | Programmable output drive (2–24 mA) and slew rate reduce EMI and improve signal integrity on dense PCBs |
| Embedded Block RAM | 20 × 18-Kbit blocks enable dual-port memory structures for real-time data buffering and processing pipelines |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital input/output expansion with protocol translation between field sensors and CAN bus. IC Role / Device Role / Timing Role: FPGA acts as programmable logic controller core handling GPIO scanning, debounce, and serial protocol conversion. Use Value: XC3S500E-5CPG132C provides sufficient logic cells and I/O to replace multiple discrete glue logic ICs while supporting industrial temperature range and fast configuration recovery. | Use Scenario: Bridging between microcontroller UART and vehicle OBD-II diagnostic lines using custom timing and error-checking logic. IC Role / Device Role / Timing Role: XC3S500E-5CPG132C serves as a flexible protocol adapter implementing ISO 9141-2 and SAE J1850 physical layer handshaking. Use Value: Its 228 I/O pins and SelectIO support allow direct connection to multiple voltage domains found in automotive ECUs without external translators. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating analog sensor data via ADC interfaces and performing real-time filtering before transmission over USB or SPI. IC Role / Device Role / Timing Role: XC3S500E-5CPG132C functions as a deterministic data preprocessing engine with precise sample timing control via DCMs. Use Value: Embedded block RAM enables multi-stage FIR filter implementation, and the -5 speed grade ensures stable 80 MHz sampling clock generation. | Use Scenario: Generating synchronized digital stimulus waveforms for IC functional testing with variable timing resolution. IC Role / Device Role / Timing Role: XC3S500E-5CPG132C operates as a high-speed pattern sequencer with programmable delay chains and parallel output drivers. Use Value: Configurable I/O drive strength and slew rate allow clean edge control at 50–100 MHz, critical for accurate timing margin verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4VQG100C | Lower density (400K gates, 8,064 logic cells), 100-pin VQFP package, no DCMs | Limited clock management and I/O count restrict use to simpler glue logic or low-pin-count interfaces | Choose when board space permits larger footprint and clock flexibility is not required |
| XC6SLX9-2TQG144I | Higher logic density (9,152 LUTs), 144-pin TQFP, integrated DSP slices and more block RAM (576 Kbits) | Better suited for math-intensive tasks like motor control or video preprocessing but consumes more power | Prefer when migrating to Spartan-6 architecture with need for arithmetic acceleration and larger memory buffers |
Compared with XC3S400A-4VQG100C and XC6SLX9-2TQG144I, the XC3S500E-5CPG132C delivers balanced I/O count, proven DCM-based clocking, and industrial-grade thermal performance in a compact BGA-making it optimal for cost-constrained, mixed-signal interface consolidation where moderate logic depth and deterministic timing are essential.
Availability
XC3S500E-5CPG132C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor systems requiring stable component supply and long-term manufacturability.
Supply support for XC3S500E-5CPG132C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-3E family was designed for cost-optimized, high-volume embedded applications demanding reliable logic integration, flexible I/O, and low-power programmable logic without advanced DSP or high-speed transceivers.
FAQ
What configuration modes does the XC3S500E-5CPG132C support?
The XC3S500E-5CPG132C supports Master Serial (via on-board PROM), Slave Parallel (controlled by external microprocessor), and JTAG boundary-scan configuration. All three modes are electrically and functionally verified per Xilinx DS312 v2.5. Configuration bitstream loading time varies by mode: ~100 ms for Master Serial, ~50 ms for Slave Parallel, and <1 s for JTAG programming.
Does the XC3S500E-5CPG132C include internal oscillators for startup clocking?
No, the XC3S500E-5CPG132C does not contain internal oscillators. It relies on external clock sources for configuration and user logic. During configuration, the FPGA uses the CCLK signal from the PROM or host; after configuration, user logic must supply clocks to DCMs or logic fabric. This design ensures timing predictability and avoids process/voltage/temperature drift inherent in RC oscillators.
What is the maximum operating junction temperature for the XC3S500E-5CPG132C?
The XC3S500E-5CPG132C has a maximum junction temperature of +100°C, specified for industrial-grade operation (–40°C to +100°C ambient). Thermal performance depends on PCB copper area, airflow, and solder joint quality. The 132-pin CSBGA package includes an exposed thermal pad that must be soldered to a solid ground plane for effective heat conduction.
Can the XC3S500E-5CPG132C interface directly with 5 V TTL logic?
No, the XC3S500E-5CPG132C I/O banks are not 5 V tolerant. Its VCCO rails support only 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V. Direct connection to 5 V TTL outputs risks damaging input buffers. Level translation is required-for example, using TI SN74AVC4T245 or similar dual-supply translators-when interfacing with legacy 5 V systems.
How many global clock networks does the XC3S500E-5CPG132C provide?
The XC3S500E-5CPG132C provides eight global clock networks (GCLKs), each driven by dedicated routing resources to minimize skew across the device. These networks distribute clocks from DCM outputs or external inputs to all CLBs, I/Os, and block RAMs. Each GCLK can drive up to 1,000 loads, supporting synchronous designs with multiple clock domains and high fanout requirements.
XC3S500E-5CPG132C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 132-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 92
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 132-CSPBGA (8x8)
XC3S500E-5CPG132C FAQ
1.How can I place an order for XC3S500E-5CPG132C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-5CPG132C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-5CPG132C reliable?
The price and inventory of XC3S500E-5CPG132C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-5CPG132C is usually 5 days.
3.What payment methods are accepted for XC3S500E-5CPG132C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-5CPG132C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-5CPG132C?
XC3S500E-5CPG132C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-5CPG132C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-5CPG132C?
For technical support, including XC3S500E-5CPG132C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-5CPG132C requirements.
6.How does Aetrix verify that XC3S500E-5CPG132C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-5CPG132C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-5CPG132C meets industry standards.
7.What is the process for return or replacement of XC3S500E-5CPG132C?
All XC3S500E-5CPG132C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-5CPG132C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-5CPG132C part is unused and in its original packaging.
Return procedure for XC3S500E-5CPG132C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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