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AMD XC3S500E-5FTG256C
- Part No.:
- XC3S500E-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S500E-5FTG256C.pdf
- Description:
- IC FPGA 190 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,955
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Product details
Overview
XC3S500E-5FTG256C from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 500,000 system gates, 11,200 logic cells, and 224 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at 500 MHz system performance with SelectIO™ technology supporting LVCMOS, LVTTL, PCI, and SSTL standards, used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC3S500E-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded block RAM capacity, DLL-based clock management, and support for JTAG boundary-scan testing in space-constrained PCB layouts.
Technical Context
The XC3S500E-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates eight Digital Clock Managers (DCMs) for phase-matched clock synthesis, duty-cycle correction, and frequency multiplication/division without external PLLs.
It supports IEEE 1149.1 JTAG boundary-scan for in-system programming and verification, and includes internal configuration memory with dual-boot capability via Master Serial mode using external PROM or SPI flash. Configuration bitstream security is not implemented.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 11,200 - provides combinational and sequential logic resources for state machines and data path implementation |
| System Gates | 500,000 - indicates total equivalent gate count for logic density estimation in ASIC migration |
| I/O Pins | 224 - supports high-pin-count peripheral interfacing with programmable slew rate and drive strength |
| Block RAM | 360 kbits - enables on-chip FIFOs, buffers, and lookup tables without external memory |
| DCMs | 8 - delivers jitter-reduced clock outputs, input deskew, and dynamic phase shift for timing-critical interfaces |
| Configuration Mode | Master Serial - allows single-PROM boot with automatic CRC checking and fallback to secondary image if primary fails |
Pinout & Package
Package: 256-pin FTBGA (Fine-Pitch Thin Ball Grid Array), 17 × 17 mm body, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank power supply for Bank 0 - must be set to match connected interface voltage (e.g., 3.3 V or 2.5 V) |
| K1 | GCLK0 | Global clock input - low-skew routing to all CLBs and DCMs for synchronous design timing closure |
| T1 | TCK | JTAG test clock - controls serial scan chain timing during configuration and debug operations |
| R2 | M0 | Mode select - determines configuration source (e.g., Master Serial when pulled low) |
| P2 | INIT_B | Open-drain initialization status - asserted low during configuration, high when complete and error-free |
| N2 | CCLK | Configuration clock output - generated internally during Master Serial mode to drive external PROM |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVTTL, PCI, and SSTL - enables direct interfacing with diverse peripherals without level-shifters |
| Digital Clock Manager (DCM) | Eight independent DCMs provide deterministic clock deskew, frequency synthesis, and 90° phase shift - eliminates need for external clock ICs in timing-sensitive designs |
| Embedded Multipliers | 22 × 18-bit hardwired multipliers - accelerate DSP functions like FIR filtering and motor control algorithms without consuming logic resources |
| Configurable I/O Drive Strength | Programmable 2/4/6/8/12/16 mA per pin - reduces EMI and signal integrity issues across varying trace lengths and loads |
| Boundary-Scan Support | IEEE 1149.1 compliant - enables PCB-level functional test and in-system programming without physical probe access |
Applications
| Industrial PLC Logic | Automotive Camera Interface |
|---|---|
Use Scenario: Real-time ladder logic execution and fieldbus protocol bridging in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom control sequences and deterministic I/O scanning with sub-microsecond response. Use Value: Enables replacement of multiple ASICs or microcontrollers with one reprogrammable device, reducing BOM count and enabling firmware-upgradable logic. | Use Scenario: Pixel data aggregation and parallel-to-serial conversion for rear-view camera modules feeding ADAS processors. IC Role / Device Role / Timing Role: High-speed parallel capture of CMOS sensor output followed by serialized transmission over LVDS or MIPI D-PHY-compatible lanes. Use Value: Provides precise timing alignment between pixel clocks and frame sync signals, minimizing skew-induced image artifacts in safety-critical vision paths. |
| Medical Imaging Front-End | Test Equipment Pattern Generation |
Use Scenario: Time-of-flight signal conditioning and pulse-width modulation generation for ultrasound transducer arrays. IC Role / Device Role / Timing Role: High-resolution timing engine generating synchronized excitation pulses and capturing echo return windows with nanosecond precision. Use Value: Delivers deterministic latency and jitter < 100 ps RMS, meeting Class II medical device timing certification requirements. | Use Scenario: Stimulus pattern generation and response capture for automated PCB functional testing of digital subsystems. IC Role / Device Role / Timing Role: Vector-based stimulus generator with programmable timing edges and real-time pass/fail comparison against expected signatures. Use Value: Reduces test cycle time by 40% compared to microcontroller-based solutions due to parallel vector execution and on-chip signature analysis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-5PQG240C | Lower logic density (8,064 LCs), 240-pin PQFP package, no DCMs - uses Digital Frequency Synthesizers (DFS) only | Limited clock management capability; unsuitable for multi-clock domain synchronization | Choose when board space permits larger footprint and clocking requirements are limited to single-frequency distribution |
| XC6SLX9-2TQG144C | Higher logic density (9,152 LCs), Spartan-6 architecture, integrated PCIe endpoint block, 144-pin TQFP | Includes hard IP for PCI Express Gen1 - adds protocol stack overhead but enables host CPU offload | Prefer when migrating legacy designs toward PCIe connectivity or requiring >100 MHz sustained I/O toggle rates |
Compared with XC3S400A-5PQG240C and XC6SLX9-2TQG144C, the XC3S500E-5FTG256C offers balanced logic capacity, proven DCM-based clocking, and mature toolchain support - making it optimal for cost-sensitive industrial control where predictable timing and long-term availability outweigh protocol acceleration needs.
Availability
XC3S500E-5FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics equipment, and test instrumentation requiring stable component supply and long-lifecycle support.
Supply support for XC3S500E-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.
The Spartan-3E product line was designed for mainstream logic replacement and glue-logic consolidation in industrial, automotive, and communications systems where power efficiency and ease of use are prioritized over ultra-high performance.
FAQ
What is the maximum operating frequency of the XC3S500E-5FTG256C?
The XC3S500E-5FTG256C supports system clock frequencies up to 500 MHz in optimized designs. Its Digital Clock Managers (DCMs) achieve ±1% duty cycle accuracy and < 100 ps peak-to-peak jitter under typical conditions. Actual achievable frequency depends on logic depth, routing congestion, and I/O standard selection - verified timing reports must be generated using Xilinx ISE 14.7 for the XC3S500E-5FTG256C.
Does the XC3S500E-5FTG256C support JTAG programming?
Yes, the XC3S500E-5FTG256C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system verification. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose and require proper pull-up/pull-down biasing per Xilinx UG332. JTAG mode is enabled automatically when M0–M2 pins are set to 000, and the XC3S500E-5FTG256C accepts bitstream loading via iMPACT or ChipScope tools.
What configuration memory options are compatible with the XC3S500E-5FTG256C?
The XC3S500E-5FTG256C supports Master Serial configuration using industry-standard SPI PROMs such as XCF02S, XCF04S, and XCF08P. It also supports Slave Serial and JTAG modes. The CCLK pin outputs a 50 MHz clock during Master Serial boot to drive the PROM, and the INIT_B pin signals configuration success or CRC failure. External flash must be rated for 3.3 V I/O and support fast read access times ≤ 55 ns for reliable startup.
Can the XC3S500E-5FTG256C operate with mixed I/O voltages?
Yes, the XC3S500E-5FTG256C supports bank-wise I/O voltage assignment: each of its eight I/O banks can be independently powered at 3.3 V, 2.5 V, 1.8 V, or 1.5 V. This allows simultaneous interfacing with legacy 3.3 V peripherals and modern low-voltage sensors or memory devices. VCCO settings must match the connected interface standard, and VREF pins must be configured accordingly for SSTL or HSTL signaling - all validated in the XC3S500E-5FTG256C datasheet Table 22.
Is the XC3S500E-5FTG256C still in active production?
The XC3S500E-5FTG256C is listed as "Not Recommended for New Designs" (NRND) by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics with guaranteed long-term supply for existing programs. Last time buy (LTB) notifications have not been issued, and extended lifecycle support agreements are available for qualified industrial and medical customers deploying the XC3S500E-5FTG256C.
XC3S500E-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1164
- Number of Logic Elements/Cells:
- 10476
- Total RAM Bits:
- 368640
- Number of I/O:
- 190
- Number of Gates:
- 500000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S500E-5FTG256C FAQ
1.How can I place an order for XC3S500E-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S500E-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S500E-5FTG256C reliable?
The price and inventory of XC3S500E-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S500E-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S500E-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S500E-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S500E-5FTG256C?
XC3S500E-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S500E-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S500E-5FTG256C?
For technical support, including XC3S500E-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S500E-5FTG256C requirements.
6.How does Aetrix verify that XC3S500E-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S500E-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S500E-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S500E-5FTG256C?
All XC3S500E-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S500E-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S500E-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S500E-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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