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AMD XC3S50-4PQG208C
- Part No.:
- XC3S50-4PQG208C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 208-BFQFP
- Datasheet:
-
XC3S50-4PQG208C.pdf
- Description:
- IC FPGA 124 I/O 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,199
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Product details
Overview
XC3S50-4PQG208C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1728 logic cells, and 128 kB of total block RAM. It features 160 user I/Os, operates at -4 speed grade (tPD = 4.6 ns), and uses a 208-pin PQFP package. It is used in low-cost industrial control logic and reconfigurable digital signal preprocessing.
For engineers reviewing the XC3S50-4PQG208C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing, block RAM capacity, and PQFP thermal and routing constraints.
Technical Context
The XC3S50-4PQG208C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It supports LVCMOS25/LVCMOS33 I/O standards and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.
It requires external configuration via SPI serial PROM or JTAG, and supports boundary-scan testing per IEEE 1149.1. Configuration bitstream security is not integrated; bitstream encryption requires external means.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 CLBs - defines combinational and sequential logic capacity for state machines and datapaths |
| System Gates | 50,000 - legacy metric estimating equivalent ASIC gate count for logic synthesis estimation |
| Block RAM | 128 kB - supports FIFOs, dual-port buffers, and small lookup tables without external memory |
| User I/O Pins | 160 - supports parallel bus interfaces, sensor arrays, and multi-channel control signals |
| Speed Grade | -4 - guarantees maximum clock-to-output delay ≤ 4.6 ns for critical path timing closure |
| Package | PQFP-208 - 28 × 28 mm body, 0.5 mm pitch, suitable for cost-sensitive PCB assembly |
Pinout & Package
XC3S50-4PQG208C is housed in a 208-pin Plastic Quad Flat Package (PQFP) with 0.5 mm lead pitch and exposed thermal pad. The package supports standard reflow profiles and provides mechanical stability for industrial vibration environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for internal logic; decoupling critical for noise-sensitive CLB operation |
| VCCO_0 | I/O bank power | 2.5 V or 3.3 V selectable per bank; sets output voltage level and input threshold |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reload from PROM or JTAG |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1 boundary-scan test and in-system programming pins |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, frequency multiplication/division, and 90° phase shift - enables precise timing control without external PLL ICs |
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, and SSTL I/O standards - allows direct interfacing to diverse peripheral families without level shifters |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs and flip-flops - delivers balanced logic depth and register density for pipelined control logic |
| Embedded Block RAM | 16 × 18-bit dual-port RAM blocks - enables synchronous read/write for buffering and data reordering in real-time streams |
Applications
| Industrial PLC Logic | Video Preprocessing Engine |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for custom motion sequencing and I/O scanning. IC Role / Device Role / Timing Role: Configurable state machine and parallel I/O controller handling 16–32 discrete inputs/outputs with deterministic scan cycle timing. Use Value: Enables field-upgradable control logic without hardware redesign; 160 I/Os support modular expansion backplanes. | Use Scenario: Real-time pixel format conversion and line buffering before HDMI encoder in embedded vision systems. IC Role / Device Role / Timing Role: Synchronous video pipeline engine performing RGB-YUV conversion, horizontal scaling, and frame synchronization. Use Value: 128 kB block RAM provides full-line buffers for 720p@60fps; DCM ensures pixel clock stability across temperature. |
| Communications Protocol Bridge | Test Equipment Pattern Generator |
Use Scenario: Translating between RS-485 Modbus and SPI-based sensor networks in building automation gateways. IC Role / Device Role / Timing Role: Dual-interface protocol translator with UART peripherals and SPI master/slave logic. Use Value: On-chip logic implements CRC-16 calculation and packet framing; eliminates external microcontroller for simple bridging tasks. | Use Scenario: Generating high-speed digital stimulus patterns for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with synchronized multi-channel output and programmable timing offsets. Use Value: -4 speed grade ensures sub-5 ns timing resolution; 160 I/Os drive up to 80 differential test channels via external drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4PQG208C | Higher logic density (2,176 CLBs), same package and speed grade | Supports larger state machines and deeper pipelines; consumes more dynamic power | Choose when additional logic resources are needed without changing PCB layout |
| XC3S50-4TQG144C | Same logic resources but 144-pin TQFP package (smaller footprint, fewer I/Os) | Limited to 102 user I/Os; reduced routing flexibility for dense peripheral interfaces | Choose for space-constrained designs where I/O count can be reduced by 36% |
Compared with XC3S50-4PQG208C, the XC3S100-4PQG208C offers headroom for future logic expansion within identical thermal and board space constraints, while the XC3S50-4TQG144C trades I/O count for compactness - both require verification of timing closure and I/O banking compatibility.
Availability
XC3S50-4PQG208C is available at Aetrix Electronics and suitable for industrial control, video preprocessing, and communications bridging applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3S50-4PQG208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3 family was designed for mainstream logic replacement and glue logic integration in industrial, automotive, and consumer electronics - emphasizing low power, small footprint, and ease of use with mature toolchains.
FAQ
What is the core voltage requirement for XC3S50-4PQG208C?
The XC3S50-4PQG208C requires a regulated 1.2 V ±3% supply on VCCINT for its internal logic array. This voltage must be well-decoupled with low-ESR capacitors placed near the package corners to maintain signal integrity during high-speed switching. Failure to meet this tolerance risks timing violations or configuration corruption. The XC3S50-4PQG208C does not support adaptive voltage scaling or multiple core voltages.
Does XC3S50-4PQG208C support JTAG boundary-scan testing?
Yes, XC3S50-4PQG208C fully supports IEEE 1149.1 JTAG boundary-scan testing using dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit verification of solder joints and interconnect integrity prior to configuration. The XC3S50-4PQG208C also supports JTAG-based in-system programming, allowing field updates without removing the device from the board.
How many Digital Clock Managers (DCMs) are included in XC3S50-4PQG208C?
The XC3S50-4PQG208C integrates two Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, duty-cycle correction, frequency multiplication/division, and phase shifting. These DCMs are essential for generating stable, low-jitter clocks for video timing, communication interfaces, or synchronous logic domains within the XC3S50-4PQG208C design.
Can XC3S50-4PQG208C be configured via SPI serial PROM?
Yes, XC3S50-4PQG208C supports master serial configuration mode using industry-standard SPI PROMs such as XCF02S or third-party compatible devices. The configuration process is initiated automatically after power-up when the MODE pins are set to 01. The XC3S50-4PQG208C reads the bitstream sequentially over the SI pin and loads it into internal SRAM configuration memory.
What I/O standards are supported by XC3S50-4PQG208C?
XC3S50-4PQG208C supports LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and SSTL2 I/O standards across its configurable I/O banks. Voltage levels are set per bank via VCCO pins, enabling mixed-voltage operation. The XC3S50-4PQG208C does not support differential standards like LVDS or RSDS without external termination or conversion circuitry.
XC3S50-4PQG208C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 124
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 208-PQFP (28x28)
XC3S50-4PQG208C FAQ
1.How can I place an order for XC3S50-4PQG208C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4PQG208C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4PQG208C reliable?
The price and inventory of XC3S50-4PQG208C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4PQG208C is usually 5 days.
3.What payment methods are accepted for XC3S50-4PQG208C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4PQG208C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4PQG208C?
XC3S50-4PQG208C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4PQG208C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4PQG208C?
For technical support, including XC3S50-4PQG208C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4PQG208C requirements.
6.How does Aetrix verify that XC3S50-4PQG208C is sourced from the original manufacturer or authorized distributors?
All XC3S50-4PQG208C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4PQG208C meets industry standards.
7.What is the process for return or replacement of XC3S50-4PQG208C?
All XC3S50-4PQG208C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4PQG208C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4PQG208C part is unused and in its original packaging.
Return procedure for XC3S50-4PQG208C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50-4PQG208C Tags
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