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AMD XC3S50-4PQG208I
- Part No.:
- XC3S50-4PQG208I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 208-BFQFP
- Datasheet:
-
XC3S50-4PQG208I.pdf
- Description:
- IC FPGA 124 I/O 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,592
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Product details
Overview
XC3S50-4PQG208I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1728 logic cells, and 128 kB of total block RAM. It features 141 user I/Os, operates at -4 speed grade (tPD = 4.6 ns), and supports LVCMOS25/LVCMOS33 I/O standards. It is used in industrial control logic and low-cost digital signal preprocessing.
For engineers reviewing the XC3S50-4PQG208I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, block RAM depth, and QFP package thermal profile for convection-cooled embedded systems.
Technical Context
The XC3S50-4PQG208I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry chains. It supports SelectIO technology with programmable drive strength (2–24 mA), slew rate control, and input differential termination.
It includes eight global clock networks, DLL-based clock management, and supports JTAG boundary-scan (IEEE 1149.1) for configuration and test. Configuration is performed via master serial mode using external PROM or processor-controlled slave parallel mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 CLBs - provides combinational and sequential logic capacity for medium-complexity state machines and datapaths |
| System Gates | 50,000 - indicates relative ASIC-equivalent gate count for logic synthesis estimation |
| User I/O Pins | 141 - supports multi-bus interfacing, sensor aggregation, or peripheral bridging in compact PCB layouts |
| Block RAM | 128 kbits (16 × 8 kbit blocks) - enables FIFOs, coefficient storage, or small frame buffers without external memory |
| Speed Grade | -4 - guarantees maximum clock frequency up to 210 MHz for critical paths with 4.6 ns propagation delay |
| I/O Standards | LVCMOS25/LVCMOS33 - ensures interoperability with common microcontrollers and ADCs without level-shifting |
Pinout & Package
XC3S50-4PQG208I is housed in a 208-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 28 × 28 mm body size, and standard JEDEC MO-137AC footprint. Thermal resistance (θJA) is 36.5°C/W under 2-layer board conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Input | Dedicated low-skew routing to all CLBs and RAM blocks for synchronous design timing integrity |
| PROGRAM_B | Configuration Initiate | Active-low asynchronous reset that clears configuration memory and restarts startup sequence |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and internal initialization completion |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan | IEEE 1149.1 interface for programming, debugging, and interconnect testing |
| VCCINT | Core Power Supply | 1.2 V supply for internal logic - requires tight regulation (±3%) and local decoupling |
| VCCO_0–VCCO_7 | I/O Bank Power | Independent 2.5 V or 3.3 V supplies per bank - enables mixed-voltage I/O interfacing |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Carry Logic | Fast arithmetic chains for adders, counters, and comparators without LUT resource overhead |
| SelectIO Technology | Per-pin programmable drive strength, slew rate, and input termination for signal integrity tuning |
| Eight Global Clock Nets | Low-jitter distribution to all logic resources - essential for multi-domain clocking and timing closure |
| Configurable I/O Banks | Up to 8 independent voltage domains allow concurrent LVCMOS25 and LVCMOS33 interfaces on one device |
| Embedded Block RAM | 16 × 8 kbit dual-port RAM blocks support simultaneous read/write operations for buffering and lookup tables |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time monitoring of 48 discrete sensors and actuator outputs in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom scan logic, debounce filters, and safety watchdog timers. Use Value: 141 I/Os enable direct connection to field terminals; -4 speed grade ensures deterministic <10 µs response latency. | Use Scenario: Centralized lighting and window control in entry-level vehicle platforms with CAN gateway integration. IC Role / Device Role / Timing Role: Glue logic and protocol translation between microcontroller peripherals and analog/digital subsystems. Use Value: Mixed-voltage I/O banks interface 3.3 V MCU GPIOs and 12 V lamp drivers without external level shifters. |
| Medical Infusion Pump Controller | Test Equipment Pattern Generator |
Use Scenario: Closed-loop motor control and alarm logic for precision fluid delivery with redundant safety checks. IC Role / Device Role / Timing Role: Safety-critical state machine executing fail-safe transitions and real-time fault detection. Use Value: Block RAM stores calibrated flow profiles; DLL-based clock management ensures jitter <50 ps for motor step timing. | Use Scenario: Generating synchronized 100 MHz digital stimulus waveforms across 32 channels for IC validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deep internal memory and precise edge alignment. Use Value: 1728 logic cells implement parallel shift registers and phase-aligned output drivers; 210 MHz max clock sustains 100 MHz data rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4PQG208C | Higher logic density (2,176 CLBs), same package and speed grade, but commercial temperature range (0–70°C) | Suitable for non-industrial environments where extended temperature operation is not required | Select when additional logic resources are needed without changing PCB layout or thermal design |
| XC3S50-4TQG144I | Same logic resources and industrial temp rating, but 144-pin TQFP (smaller footprint, fewer I/Os: 97) | Fits space-constrained designs where I/O count can be reduced by >30% | Choose when board area is critical and peripheral count permits I/O reduction |
Compared with XC3S50-4PQG208I, XC3S100-4PQG208C offers more logic in identical packaging for cost-sensitive upgrades, while XC3S50-4TQG144I trades I/O count for smaller board area - both require no functional redesign but differ in thermal margin and signal routing density.
Availability
XC3S50-4PQG208I is available at Aetrix Electronics and suitable for industrial automation, medical device manufacturing, and test equipment development requiring stable component supply over extended production lifecycles.
Supply support for XC3S50-4PQG208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support legacy Spartan-3 devices through its programmable solutions group. The company specializes in adaptive computing platforms for embedded, data center, and edge applications.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring reliable FPGA functionality with low power and simple configuration - especially in industrial control, communications infrastructure, and consumer electronics.
FAQ
What is the operating temperature range for XC3S50-4PQG208I?
The XC3S50-4PQG208I is rated for industrial temperature operation from –40°C to +85°C. This range is validated per Xilinx DS099 specification and applies to the full speed grade (-4) performance envelope. The PQG208 package's thermal characteristics support sustained operation within this range under specified airflow and PCB copper pour conditions. XC3S50-4PQG208I must be operated within these limits to guarantee timing closure and configuration reliability.
Does XC3S50-4PQG208I support JTAG configuration?
Yes, XC3S50-4PQG208I supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and interconnect testing. Its TCK, TMS, TDI, and TDO pins are dedicated to this interface and function independently of the primary configuration modes (master serial or slave parallel). JTAG access remains available after configuration for runtime visibility into I/O states and internal logic signals. XC3S50-4PQG208I does not require external configuration PROM when using JTAG-only programming.
What power supplies are required for XC3S50-4PQG208I?
XC3S50-4PQG208I requires two separate regulated supplies: 1.2 V ±3% for VCCINT (core logic) and 2.5 V or 3.3 V for each VCCO bank (I/O). Up to eight independent VCCO banks allow mixed-voltage operation. Decoupling capacitors (100 nF ceramic + 10 µF tantalum per supply pair) must be placed within 10 mm of respective power pins. XC3S50-4PQG208I draws peak current up to 520 mA on VCCINT during configuration, dropping to ~180 mA in steady-state logic operation.
Can XC3S50-4PQG208I be reconfigured in-system?
Yes, XC3S50-4PQG208I supports in-system reconfiguration via its JTAG port or slave parallel mode using an external processor. The DONE pin confirms successful reconfiguration, and PROGRAM_B allows safe initiation of a new bitstream load without power cycling. Internal configuration memory is SRAM-based and volatile, so XC3S50-4PQG208I requires persistent storage (e.g., SPI PROM) for automatic boot-up unless managed by host firmware. Partial reconfiguration is not supported.
Is XC3S50-4PQG208I pin-compatible with other Spartan-3 devices in PQG208 package?
No, XC3S50-4PQG208I is not fully pin-compatible with higher-density Spartan-3 devices (e.g., XC3S200 or XC3S400) in the same PQG208 package. While power and ground pin locations match, I/O pin assignments differ significantly due to distinct CLB-to-I/O routing architectures and bank definitions. Migration requires PCB layout revision. XC3S50-4PQG208I shares pinout only with identical-density variants such as XC3S50-5PQG208I (different speed grade) and XC3S50-4PQG208C (commercial temp).
XC3S50-4PQG208I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 124
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 208-PQFP (28x28)
XC3S50-4PQG208I FAQ
1.How can I place an order for XC3S50-4PQG208I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4PQG208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4PQG208I reliable?
The price and inventory of XC3S50-4PQG208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4PQG208I is usually 5 days.
3.What payment methods are accepted for XC3S50-4PQG208I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4PQG208I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4PQG208I?
XC3S50-4PQG208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4PQG208I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4PQG208I?
For technical support, including XC3S50-4PQG208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4PQG208I requirements.
6.How does Aetrix verify that XC3S50-4PQG208I is sourced from the original manufacturer or authorized distributors?
All XC3S50-4PQG208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4PQG208I meets industry standards.
7.What is the process for return or replacement of XC3S50-4PQG208I?
All XC3S50-4PQG208I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4PQG208I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4PQG208I part is unused and in its original packaging.
Return procedure for XC3S50-4PQG208I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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