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AMD XC3S50-4TQ144C
- Part No.:
- XC3S50-4TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50-4TQ144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,111
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Product details
Overview
XC3S50-4TQ144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1,728 logic cells, 120 I/O pins, and configured in a 144-pin TQFP package. It operates at -4 speed grade (4.9 ns CLB delay), supports 3.3 V I/O, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S50-4TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, TQFP packaging compatibility, speed-grade timing closure, and legacy Spartan-3 toolchain support in Vivado WebPACK and ISE Design Suite.
Technical Context
The XC3S50-4TQ144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates up to 120 user I/Os with programmable slew rate and drive strength, and supports LVCMOS25/LVCMOS33 input/output standards.
Configuration is performed via Master Serial mode using an external PROM or JTAG boundary-scan interface. The device lacks on-chip configuration memory and requires external bitstream loading at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity glue logic or protocol translation. |
| System Gates | 50,000 - indicates relative logic density benchmarked against ASIC gate count equivalents. |
| I/O Pins | 120 - supports parallel bus interfacing, sensor aggregation, or multi-peripheral MCU expansion. |
| Speed Grade | -4 - guarantees maximum 4.9 ns CLB propagation delay, enabling 200 MHz clock domain operation under typical conditions. |
| I/O Voltage | 3.3 V - compatible with legacy industrial microcontrollers and peripheral ICs using LVTTL/LVCMOS33 signaling. |
| Package | TQFP-144 - 20 mm × 20 mm body, 0.5 mm pitch, surface-mount, reflow-compatible footprint. |
Pinout & Package
TQFP-144 package: 144-lead thin quad flat pack with exposed thermal pad, 20 mm × 20 mm body size, 0.5 mm lead pitch, and standard JEDEC MO-153 compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN 1–120 (I/O) | User-configurable bidirectional I/O | Supports input, output, or tristate modes; individually assignable to banks with independent VCCO. |
| PIN 121–124 (CONFIG) | Configuration interface | Dedicated pins for Master Serial mode (DIN, PROG_B, INIT_B, DONE) or JTAG (TCK/TMS/TDI/TDO). |
| PIN 125–128 (VCCINT) | Core voltage supply | 1.2 V internal logic supply; requires local regulation and decoupling per bank. |
| PIN 129–144 (GND/VCCO) | Ground and I/O voltage | Multiple GND connections plus VCCO per I/O bank (2.5 V or 3.3 V selectable per bank). |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-input LUTs + flip-flops, enabling efficient implementation of state machines and arithmetic functions. |
| Distributed RAM | Up to 72 Kbits of fast, distributed block RAM per CLB for register files or FIFO buffers without dedicated BRAM resources. |
| Multi-Voltage I/O Banks | Four independent I/O banks allow mixed-voltage interfaces (e.g., 3.3 V sensors + 2.5 V FPD-Link receivers) on same device. |
| JTAG Boundary-Scan Support | IEEE 1149.1-compliant test access port enables in-system programming and board-level diagnostics without external programmers. |
| No Internal Configuration Memory | Requires external serial PROM or processor-controlled configuration, simplifying boot security but adding BOM component. |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Protocol Bridge |
|---|---|
Use Scenario: Adding digital input/output capability to aging PLC mainframes using RS-485 or CAN physical layer peripherals. IC Role / Device Role / Timing Role: FPGA acts as programmable I/O mapper and level translator between microcontroller and field-side terminals. Use Value: Enables reuse of existing controller firmware while supporting new sensor/actuator types via reconfigurable logic. | Use Scenario: Converting between parallel ISA-bus peripherals and modern SPI-based microcontrollers in medical diagnostic equipment. IC Role / Device Role / Timing Role: Synchronizes asynchronous bus handshaking and performs address decoding with deterministic setup/hold timing. Use Value: Eliminates custom ASIC development and allows field-upgradable interface logic via bitstream reload. |
| Video Signal Formatter | Motor Control Logic Unit |
Use Scenario: Aligning pixel clock domains and inserting blanking intervals in analog VGA signal generation for embedded displays. IC Role / Device Role / Timing Role: Implements pixel pipeline registers, sync generator FSM, and dual-port video buffer addressing logic. Use Value: Achieves sub-pixel timing accuracy (<1 ns jitter) using dedicated carry-chain routing for clock domain crossing. | Use Scenario: Generating complementary PWM pairs with dead-time insertion and fault monitoring for 3-phase BLDC motor drives. IC Role / Device Role / Timing Role: Real-time PWM waveform synthesis with hardware-enforced safety interlocks and current-sense interrupt response. Use Value: Reduces MCU interrupt load and ensures <100 ns dead-time consistency across temperature and voltage variations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4TQ144C | Higher logic density (2,176 CLBs, 100K gates); identical package and speed grade. | Supports larger state machines and more complex protocol stacks without changing PCB layout. | Choose when additional logic margin is required for future firmware upgrades or added feature sets. |
| XC3S50-4PQ208C | Same logic resources but in 208-pin PQFP package with 173 I/Os and enhanced thermal dissipation. | Enables higher I/O count and improved power handling for high-duty-cycle control loops. | Choose when board redesign permits larger footprint and additional I/Os are needed for sensor fusion or multi-axis control. |
Compared with XC3S50-4TQ144C, the XC3S100-4TQ144C offers headroom for logic growth within the same footprint, while the XC3S50-4PQ208C trades compactness for I/O scalability and thermal performance-neither is pin-compatible, but both share identical toolchain and configuration methodology.
Availability
XC3S50-4TQ144C is available at Aetrix Electronics and suitable for industrial automation, legacy system refurbishment, and embedded video interface design requiring stable component supply and long-term obsolescence management.
Supply support for XC3S50-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product support through its Adaptive SoC and FPGA business unit.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring moderate logic density, flexible I/O, and mature toolchain stability-not for AI acceleration or high-speed serial transceivers.
FAQ
Does XC3S50-4TQ144C support JTAG programming?
Yes, XC3S50-4TQ144C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. The device uses dedicated TCK, TMS, TDI, and TDO pins, and is compatible with Xilinx iMPACT and third-party JTAG tools. Configuration via JTAG does not require external PROM and is commonly used during development and field updates of XC3S50-4TQ144C.
What software tools are required to develop for XC3S50-4TQ144C?
XC3S50-4TQ144C is supported exclusively by Xilinx ISE Design Suite (v14.7 or earlier). Vivado does not support Spartan-3 devices. Synthesis, place-and-route, and bitstream generation for XC3S50-4TQ144C must be performed using ISE Project Navigator or command-line tools included in ISE WebPACK, which remains publicly available for legacy use.
Can XC3S50-4TQ144C operate with 2.5 V I/O voltage?
Yes, XC3S50-4TQ144C supports 2.5 V I/O in designated I/O banks when VCCO is set to 2.5 V and appropriate IOSTANDARD constraints (e.g., LVCMOS25) are applied. Each bank is independently configurable, allowing mixed 2.5 V and 3.3 V signaling on XC3S50-4TQ144C-critical for interfacing with DDR memory or low-voltage sensors.
Is XC3S50-4TQ144C RoHS compliant?
Yes, XC3S50-4TQ144C is RoHS-6 compliant (lead-free, halogen-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The TQFP-144 package uses matte tin finish and conforms to IPC/JEDEC standard reflow profiles-verified in official Xilinx documentation for XC3S50-4TQ144C.
Does XC3S50-4TQ144C include internal configuration memory?
No, XC3S50-4TQ144C does not contain on-chip configuration memory. It requires external serial PROM (e.g., XCF02S) or microcontroller-driven configuration over JTAG or Slave Serial mode. This architecture reduces die cost but mandates external storage for reliable power-on initialization of XC3S50-4TQ144C.
XC3S50-4TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 97
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50-4TQ144C FAQ
1.How can I place an order for XC3S50-4TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4TQ144C reliable?
The price and inventory of XC3S50-4TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4TQ144C is usually 5 days.
3.What payment methods are accepted for XC3S50-4TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4TQ144C?
XC3S50-4TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4TQ144C?
For technical support, including XC3S50-4TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4TQ144C requirements.
6.How does Aetrix verify that XC3S50-4TQ144C is sourced from the original manufacturer or authorized distributors?
All XC3S50-4TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4TQ144C meets industry standards.
7.What is the process for return or replacement of XC3S50-4TQ144C?
All XC3S50-4TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4TQ144C part is unused and in its original packaging.
Return procedure for XC3S50-4TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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