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AMD XC3S50-4TQ144I
- Part No.:
- XC3S50-4TQ144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50-4TQ144I.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,082
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Product details
Overview
XC3S50-4TQ144I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 176 logic cells, 72 Kbits of block RAM, and operates at -4 speed grade (4.9 ns CLB delay). It features 118 user I/Os in a 144-pin TQFP package and targets low-cost, high-volume embedded control and interface bridging applications.
For engineers reviewing the XC3S50-4TQ144I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, speed grade timing closure, and TQFP thermal profile for industrial temperature operation.
Technical Context
The XC3S50-4TQ144I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2, with programmable slew rate and drive strength per bank.
Configuration is performed via master serial mode using an external PROM or processor, supporting JTAG boundary-scan testing. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - no PLLs or fractional-N synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 50,000 system gates - defines maximum combinational logic density for gate-equivalent synthesis |
| Configurable Logic Blocks | 176 CLBs - each contains two 4-LUTs + two registers, enabling pipelined synchronous design |
| Block RAM | 72 Kbits (18 × 4K-bit blocks) - supports dual-port FIFOs, small buffers, or lookup tables up to 256×256 bits |
| User I/O Pins | 118 - distributed across eight I/O banks, each independently voltage-configurable (1.2V–3.3V) |
| Speed Grade | -4 - guarantees 4.9 ns CLB propagation delay and 210 MHz maximum DCM output frequency |
| Operating Temperature | -40°C to +100°C (Industrial) - validated for extended thermal cycling in non-automotive embedded systems |
| Digital Clock Managers | 2 DCMs - provide fixed-ratio multiplication, 0–255° phase shift, and 50% duty cycle stabilization |
Pinout & Package
XC3S50-4TQ144I is housed in a 144-pin Thin Quad Flat Pack (TQFP), 20 mm × 20 mm, 0.5 mm pitch, with exposed thermal pad (non-electrical). Package meets JEDEC MS-026AC, RoHS-compliant, and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P4, P141–P144 | VCCINT | 1.2 V core supply inputs - must be decoupled locally with ≤10 nF ceramic capacitors |
| P5–P12, P133–P140 | VCCO_0–VCCO_7 | I/O bank voltage supplies - each pair powers one of eight selectable-voltage I/O banks |
| P13–P20, P125–P132 | IO_Lxx | Configurable user I/O - support LVCMOS2/LVCMOS33/LVTTL/PCI/SSTL2_I with programmable pull-up/down |
| P21–P24, P121–P124 | CLKIN_0/1 | Dedicated global clock inputs - routed directly to DCMs with <150 ps skew |
| P25–P28, P117–P120 | PROG_B / INIT_B / DONE | Configuration control signals - active-low PROGRAM, open-drain INIT, and push-pull DONE status indicator |
| P29–P32, P113–P116 | TCK/TMS/TDI/TDO | JTAG boundary-scan interface - IEEE 1149.1 compliant for test and configuration |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Port Block RAM | Enables simultaneous read/write access for FIFO buffering without external memory arbitration logic |
| Eight I/O Banks | Allows mixed-voltage interfaces (e.g., 3.3 V microcontroller ↔ 1.8 V sensor) on single device without level shifters |
| Digital Clock Manager (DCM) | Eliminates need for external clock synthesizers in applications requiring precise phase alignment or jitter reduction |
| Master Serial Configuration | Reduces BOM count by enabling boot from low-cost SPI PROM instead of parallel flash or microcontroller host |
| JTAG Boundary-Scan | Supports in-circuit testing and programming without dedicated debug headers or SWD pins |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital input/output channels to compact programmable logic controllers in factory automation cabinets. IC Role / Device Role / Timing Role: FPGA acts as glue logic and protocol translator between microcontroller bus and opto-isolated I/O drivers. Use Value: 118 I/Os and 72 Kbits RAM enable local status buffering and real-time response within 2 µs cycle time. | Use Scenario: Bridging ISA or PC/104 parallel bus peripherals to modern ARM-based control units via GPIO or SPI. IC Role / Device Role / Timing Role: Configurable logic implements address decoding, handshaking, and data width conversion (8/16-bit). Use Value: DCM-generated clocks synchronize legacy strobes with modern processor timing, eliminating setup/hold violations. |
| Video Signal Formatter | Test Equipment Pattern Generator |
Use Scenario: Converting raw CMOS image sensor output (LVDS or parallel) into standardized BT.656 or HDMI-compatible timing. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, blanking interval insertion, and sync pulse generation. Use Value: 2 DCMs provide independent, phase-aligned clocks for sensor interface and video output domains. | Use Scenario: Generating deterministic digital stimulus waveforms for IC functional validation in ATE environments. IC Role / Device Role / Timing Role: FPGA serves as high-speed pattern sequencer with precise edge placement and repeatable timing. Use Value: -4 speed grade ensures sub-5 ns timing resolution across all 118 I/Os under industrial temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4TQ144I | 100K-gate capacity, 272 CLBs, 128 Kbits block RAM - higher logic density and memory but same package and speed grade | Supports larger state machines and deeper FIFOs; suitable when XC3S50-4TQ144I resource utilization exceeds 90% | Select when design requires >176 CLBs or >72 Kbits RAM while retaining TQFP footprint and industrial temp rating |
| XC3S50-4VQ100I | Same logic resources and speed grade, but in 100-pin VQFP (14 mm × 14 mm) with only 63 user I/Os | Lower I/O count and smaller footprint - appropriate for space-constrained designs where pin count is not limiting | Choose when board area is critical and I/O requirements fit within 63 pins; note different thermal pad and decoupling layout |
Compared with XC3S50-4TQ144I, XC3S100-4TQ144I offers scalable logic headroom without PCB redesign, while XC3S50-4VQ100I trades I/O count for compactness - both maintain identical speed grade timing and industrial temperature operation.
Availability
XC3S50-4TQ144I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and legacy interface bridging applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S50-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now owns the Spartan-3 FPGA product line. Xilinx originally developed these devices for cost-sensitive, high-volume embedded logic applications.
The Spartan-3 family was designed to deliver ASIC-like functionality at CPLD pricing, targeting industrial control, consumer electronics, and communications infrastructure where gate count, I/O flexibility, and thermal robustness matter.
FAQ
What is the maximum operating frequency of the XC3S50-4TQ144I?
The XC3S50-4TQ144I has a -4 speed grade, guaranteeing a maximum CLB propagation delay of 4.9 ns. Its Digital Clock Managers support output frequencies up to 210 MHz. Actual system clock frequency depends on design routing and logic depth - verified timing closure in Xilinx ISE typically achieves 85–120 MHz for balanced register-to-register paths in XC3S50-4TQ144I implementations.
Does the XC3S50-4TQ144I support JTAG programming and debugging?
Yes, the XC3S50-4TQ144I includes full IEEE 1149.1 JTAG boundary-scan support via dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and interconnect testing without requiring additional debug hardware. JTAG is used both for initial PROM programming and runtime visibility into I/O states during development of XC3S50-4TQ144I-based systems.
Can the XC3S50-4TQ144I operate in industrial temperature conditions?
Yes, the XC3S50-4TQ144I is rated for -40°C to +100°C ambient operation (Industrial grade). Its thermal design, including the exposed pad in the TQFP package and specified derating curves, has been validated for continuous operation across this range. This makes XC3S50-4TQ144I suitable for deployment in unventilated enclosures, outdoor kiosks, and factory-floor control panels.
How many Digital Clock Managers (DCMs) does the XC3S50-4TQ144I contain?
The XC3S50-4TQ144I integrates two fully independent Digital Clock Managers (DCMs). Each DCM provides input clock multiplication (2× to 16×), phase shifting (0–255° in 1° steps), and duty cycle correction. These are used to generate synchronized, low-jitter clocks for internal logic and I/O interfaces in XC3S50-4TQ144I designs without external clock ICs.
What configuration methods are supported by the XC3S50-4TQ144I?
The XC3S50-4TQ144I supports master serial (via external SPI PROM), slave serial (host-controlled), JTAG, and boundary-scan configuration modes. Master serial is most common for standalone operation, using a Xilinx-compatible PROM like XC18V02. Configuration bitstream loading is initiated by PROG_B and confirmed by DONE pin assertion - all essential signals are accessible on XC3S50-4TQ144I's TQFP package.
XC3S50-4TQ144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 97
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50-4TQ144I FAQ
1.How can I place an order for XC3S50-4TQ144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4TQ144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4TQ144I reliable?
The price and inventory of XC3S50-4TQ144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4TQ144I is usually 5 days.
3.What payment methods are accepted for XC3S50-4TQ144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4TQ144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4TQ144I?
XC3S50-4TQ144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4TQ144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4TQ144I?
For technical support, including XC3S50-4TQ144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4TQ144I requirements.
6.How does Aetrix verify that XC3S50-4TQ144I is sourced from the original manufacturer or authorized distributors?
All XC3S50-4TQ144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4TQ144I meets industry standards.
7.What is the process for return or replacement of XC3S50-4TQ144I?
All XC3S50-4TQ144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4TQ144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4TQ144I part is unused and in its original packaging.
Return procedure for XC3S50-4TQ144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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