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AMD XC3S50-4TQG144C

Part No.:
XC3S50-4TQG144C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-LQFP
Datasheet:
AetrixXC3S50-4TQG144C.pdf
Description:
IC FPGA 97 I/O 144TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,278

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Product details

Overview

XC3S50-4TQG144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1,728 logic cells, and 144-pin TQFP package. It operates at -4 speed grade (100 MHz system clock), supports 3.3V I/O, and includes embedded block RAM and DLLs for clock management. It is used in industrial control logic and low-cost communication interface bridging.

For engineers reviewing the XC3S50-4TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, DLL-based clock deskew capability, and TQFP-144 thermal and routing constraints.

Technical Context

The XC3S50-4TQG144C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve 18-kbit block RAMs (total 216 kbits), four digital clock managers (DCMs), and supports SelectIO standards including LVCMOS, LVTTL, and PCI.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device requires separate VCCINT (1.2V) and VCCO (3.3V) supplies, and supports multi-voltage I/O banks with independent bank voltage assignment.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells1,728 - provides combinational and sequential logic capacity for medium-complexity control and data-path functions
System Gates50,000 - industry-standard metric estimating equivalent gate count for ASIC comparison
Block RAM216 kbits across twelve 18-kbit blocks - supports FIFOs, dual-port buffers, and small lookup tables
DCMs4 - enable clock multiplication, division, phase shifting, and duty-cycle correction without external PLLs
I/O Pins108 user I/Os - supports mixed-voltage interfaces with per-bank VCCO selection
Speed Grade-4 - guarantees 100 MHz system clock operation under worst-case commercial temperature and voltage conditions
VCCINT / VCCO1.2V / 3.3V - mandates separate power domains and decoupling strategies for core and I/O

Pinout & Package

XC3S50-4TQG144C is housed in a 144-lead Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20×20 mm body, and exposed thermal pad. Package meets JEDEC MS-026 standard and supports reflow soldering.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2V core supply input - requires local ceramic decoupling near pin
P2VCCO_03.3V I/O supply for Bank 0 - sets voltage level for pins A1–D12
T14PROGRAM_BActive-low configuration initiation - pulled high externally to enable startup
R13DONEOpen-drain status output - goes high when configuration completes successfully
M13INIT_BActive-low configuration status - indicates readiness to accept bitstream
A14TCKJTAG test clock input - required for boundary-scan and in-system programming

Key Features

FeatureDesign Value
Four DCMsEnable precise clock synthesis and skew control without external timing ICs or discrete PLLs
12 × 18-kbit Block RAMsProvide on-chip memory sufficient for protocol stacks, buffering, and state-machine storage
Multi-voltage I/O BanksAllow interfacing with 3.3V, 2.5V, and 1.8V peripherals without level shifters
Master Serial ConfigurationSupports single-PROM boot with automatic loading on power-up, reducing firmware dependency
JTAG Boundary-ScanEnables IEEE 1149.1-compliant testing and in-circuit programming without dedicated debug headers

Applications

Industrial PLC LogicLegacy Bus Interface Bridge

Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for motion sequencing and sensor polling.

IC Role / Device Role / Timing Role: Configurable state machine and parallel I/O controller with deterministic timing via DCM-synchronized outputs.

Use Value: Reduces redesign cycles by enabling field-upgradable control logic without hardware changes.

Use Scenario: Bridging RS-232/RS-485 physical layers to modern microcontroller UARTs in legacy instrumentation systems.

IC Role / Device Role / Timing Role: Protocol translation engine with baud-rate generation and framing logic synchronized to internal DCM clocks.

Use Value: Eliminates need for custom PCB-level level-shifting and timing circuitry while maintaining ESD robustness.

Low-Cost Video Timing ControllerConfigurable Sensor Hub

Use Scenario: Generating VGA/HDTV sync signals and pixel clock gating in entry-level display subsystems.

IC Role / Device Role / Timing Role: Pixel-clock generator and horizontal/vertical blanking interval sequencer using DCM-derived frequencies.

Use Value: Supports multiple resolutions from a single BOM item via configuration bitstream updates.

Use Scenario: Aggregating I²C/SPI sensor data (temperature, humidity, accelerometer) for edge preprocessing before MCU transfer.

IC Role / Device Role / Timing Role: Multi-protocol sensor interface hub with on-FPGA filtering and timestamping using internal counters.

Use Value: Offloads MCU real-time processing burden and enables deterministic sensor sampling intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and clock management applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S100-4TQG144CHigher logic density (2,176 CLBs), same package and speed gradeSupports larger state machines and deeper FIFOs without board changeChoose when additional logic resources are needed but footprint and thermal envelope must remain identical
XC3S50-4PQ208CSame logic resources, but 208-pin PQFP package with more I/Os (141 user I/Os)Enables expanded peripheral connectivity and higher pin-count interface supportChoose when additional I/O bandwidth or mixed-voltage bank expansion is required over TQFP-144 limits

Compared with XC3S50-4TQG144C, the XC3S100-4TQG144C offers headroom for logic growth within the same footprint, while XC3S50-4PQ208C trades compactness for I/O scalability-neither is pin-compatible, but both share identical configuration and DCM architecture.

Availability

XC3S50-4TQG144C is available at Aetrix Electronics and suitable for industrial automation, legacy interface modernization, and entry-level video timing applications requiring stable component supply and long-term obsolescence planning.

Supply support for XC3S50-4TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.

The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring predictable performance, low power, and ease of integration-especially in industrial and communications edge devices.

FAQ

What is the maximum operating frequency supported by XC3S50-4TQG144C?

The XC3S50-4TQG144C is rated for 100 MHz system clock operation under worst-case commercial conditions (0°C to 85°C, VCCINT = 1.14V–1.26V). This speed grade (-4) applies to internal logic paths and DCM outputs, though actual achievable frequency depends on design placement, routing, and timing closure during implementation.

Does XC3S50-4TQG144C support JTAG programming and debugging?

Yes, XC3S50-4TQG144C fully supports IEEE 1149.1 JTAG boundary-scan for in-system programming, configuration verification, and debug access. Pins TCK, TMS, TDI, and TDO are dedicated for this purpose and require proper pull-up/pull-down biasing per Xilinx UG332 guidelines.

What power supply voltages does XC3S50-4TQG144C require?

XC3S50-4TQG144C requires two independent supplies: VCCINT = 1.2V ±5% for the core logic and VCCO = 3.3V ±10% for I/O banks. Each I/O bank may be set to different VCCO voltages, but all pins in a given bank must share the same VCCO value.

Can XC3S50-4TQG144C be configured using a serial PROM?

Yes, XC3S50-4TQG144C supports Master Serial configuration mode using standard Xilinx Platform Flash PROMs (e.g., XCF02S). The configuration bitstream loads automatically on power-up when PROGRAM_B is asserted and DONE goes high, enabling unattended boot without host processor involvement.

How many block RAMs does XC3S50-4TQG144C contain?

XC3S50-4TQG144C contains twelve 18-kbit block RAMs, totaling 216 kbits of true dual-port synchronous memory. These are distributed across the device fabric and can be instantiated as single-port RAM, dual-port RAM, ROM, or shift registers using Xilinx ISE primitives.

XC3S50-4TQG144C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
144-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
192
Number of Logic Elements/Cells:
1728
Total RAM Bits:
73728
Number of I/O:
97
Number of Gates:
50000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-TQFP (20x20)

XC3S50-4TQG144C FAQ

1.How can I place an order for XC3S50-4TQG144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S50-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S50-4TQG144C reliable?

The price and inventory of XC3S50-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4TQG144C is usually 5 days.

3.What payment methods are accepted for XC3S50-4TQG144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4TQG144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S50-4TQG144C?

XC3S50-4TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S50-4TQG144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S50-4TQG144C?

For technical support, including XC3S50-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4TQG144C requirements.

6.How does Aetrix verify that XC3S50-4TQG144C is sourced from the original manufacturer or authorized distributors?

All XC3S50-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4TQG144C meets industry standards.

7.What is the process for return or replacement of XC3S50-4TQG144C?

All XC3S50-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4TQG144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S50-4TQG144C part is unused and in its original packaging.

Return procedure for XC3S50-4TQG144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S50-4TQG144C Tags

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