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AMD XC3S50-4TQG144I
- Part No.:
- XC3S50-4TQG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50-4TQG144I.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,926
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Product details
Overview
XC3S50-4TQG144I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1,728 logic cells, and 144-pin TQFP packaging. It operates at -4 speed grade (tPD = 4.6 ns), supports 3.3 V I/O, and includes embedded block RAM (176 Kbits) and DLL clock management. It is used in industrial control logic and low-cost communication interface bridging.
For engineers reviewing the XC3S50-4TQG144I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage compatibility, DLL-based clock deskew capability, and commercial vs. industrial temperature range suitability.
Technical Context
The XC3S50-4TQG144I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18-bit multipliers and supports SelectIO standards including LVCMOS, LVTTL, and PCI.
Its Digital Clock Manager (DCM) provides input jitter filtering, frequency synthesis (multiply/divide), and phase shifting - all without external components. Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - defines maximum combinational/sequential logic capacity per device |
| System Gates | 50,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| Block RAM | 176 Kbits - distributed across 22 × 8 Kbit blocks for FIFO, buffer, or lookup table use |
| I/O Pins | 118 user-configurable - supports mixed-voltage operation with bank-wise VCCO assignment |
| DCM Units | 2 - each provides independent clock deskew, duty-cycle correction, and frequency synthesis |
| Speed Grade | -4 - guarantees tPD ≤ 4.6 ns for internal logic paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial temperature applications |
Pinout & Package
XC3S50-4TQG144I uses a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20×20 mm body size, and exposed thermal pad (non-electrical). Pin assignments follow Xilinx Spartan-3 family conventions with dedicated configuration, JTAG, DCM, and global clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status output confirming successful configuration completion |
| P14 | PROGRAM_B | Active-low input initiating FPGA reconfiguration and clearing internal SRAM |
| T13 | TCK | JTAG test clock input for boundary-scan and debug access |
| R14 | TMS | JTAG test mode select controlling state machine progression |
| V13 | TDO | JTAG test data output carrying scan-out results |
| U14 | TDI | JTAG test data input feeding scan chain serially |
| M13 | INIT_B | Open-drain output indicating configuration memory readiness or error |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multiplier Blocks | Twelve 18×18-bit hardwired multipliers enable efficient DSP datapath implementation without LUT resource consumption |
| Digital Clock Manager (DCM) | Two fully independent DCMs support zero-delay buffering, ±180° phase shift, and 2×–16× frequency multiplication for timing-critical interfaces |
| SelectIO Technology | Per-bank I/O support for LVCMOS 3.3/2.5/1.8 V, LVTTL, and PCI ensures interoperability with legacy and mixed-voltage systems |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic functionality |
| Low-Power Operation | Core voltage of 1.2 V reduces dynamic power versus prior 2.5 V FPGA families while maintaining performance |
Applications
| Industrial PLC Logic | Serial Protocol Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for real-time I/O scanning and ladder logic execution. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic control algorithms with sub-microsecond response latency. Use Value: Enables field-upgradable control firmware and hardware reuse across multiple machine variants without PCB redesign. | Use Scenario: Translating between RS-232, RS-485, and CAN physical layers in gateway devices for factory automation networks. IC Role / Device Role / Timing Role: Interface protocol converter implementing UART-to-CAN message framing and timing synchronization. Use Value: Supports concurrent multi-protocol handling using dedicated I/O banks and DCM-controlled baud rate generation. |
| Video Timing Controller | Test Equipment Pattern Generator |
Use Scenario: Generating precise pixel clocks, HSYNC/VSYNC signals, and data enable windows for LCD panel drivers in medical imaging displays. IC Role / Device Role / Timing Role: Timing generator synchronizing video data streams with display refresh cycles using DCM-derived clocks. Use Value: Achieves <±50 ppm clock accuracy and <1 ns skew between parallel timing outputs for stable image rendering. | Use Scenario: Producing high-speed digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: Programmable pattern source generating synchronized multi-channel test vectors with adjustable timing margins. Use Value: Delivers deterministic setup/hold timing control down to 2.5 ns resolution using internal DCM delay taps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and clock management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4TQG144I | Higher logic density (2,176 LCs), same package and speed grade | Supports more complex state machines and larger data buffers | Select when additional LUTs or block RAM are required without changing PCB layout |
| XC3S50-4VQG100I | Same logic resources but 100-pin VQFP package (smaller footprint, fewer I/Os) | Limited to designs requiring ≤63 user I/Os and space-constrained layouts | Choose for cost-sensitive, lower-I/O applications where board area is critical |
Compared with XC3S50-4TQG144I, the XC3S100-4TQG144I offers headroom for design growth within identical mechanical and thermal constraints, while the XC3S50-4VQG100I trades I/O count for compactness - both require verification of signal integrity and thermal dissipation in final layout.
Availability
XC3S50-4TQG144I is available at Aetrix Electronics and suitable for industrial control, protocol bridging, and video timing applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S50-4TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic with integrated clock management and multi-standard I/O.
FAQ
What is the maximum operating frequency supported by the XC3S50-4TQG144I?
The XC3S50-4TQG144I supports internal logic paths up to 210 MHz under worst-case industrial conditions, as guaranteed by its -4 speed grade (tPD ≤ 4.6 ns). This applies to synchronous logic paths with proper timing closure; actual system frequency depends on design topology, routing, and DCM usage. The XC3S50-4TQG144I's two DCMs can generate higher-frequency clocks (up to 320 MHz) from lower-frequency inputs via multiplication.
Does the XC3S50-4TQG144I support JTAG boundary-scan testing?
Yes, the XC3S50-4TQG144I fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing and in-system programming. JTAG access enables configuration verification, interconnect testing, and debug visibility without requiring external logic analyzers. The XC3S50-4TQG144I also supports JTAG-based partial reconfiguration in compatible toolchains.
Can the XC3S50-4TQG144I operate with 2.5 V I/O signaling?
Yes, the XC3S50-4TQG144I supports 2.5 V I/O in dedicated I/O banks configured with VCCO = 2.5 V, alongside 3.3 V and 1.8 V operation. Each bank is independently powered, allowing mixed-voltage interfaces on a single device. This capability is documented in the Spartan-3 DC and Switching Characteristics datasheet for XC3S50-4TQG144I and verified in Xilinx UG331.
Is the XC3S50-4TQG144I pin-compatible with other Spartan-3 devices in TQFP-144 packaging?
The XC3S50-4TQG144I shares identical pinout and package dimensions with other Spartan-3 devices rated for TQFP-144, including XC3S100-4TQG144I and XC3S200-4TQG144I. Power, ground, configuration, JTAG, and global clock pins are functionally and physically aligned. However, I/O bank assignments and unused pin states differ - full compatibility requires verifying I/O standard support and bank voltage constraints in the target design.
What configuration modes does the XC3S50-4TQG144I support?
The XC3S50-4TQG144I supports Master Serial (via external PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial is most common for production deployment, while JTAG is used for development and debugging. Configuration bitstreams are loaded into on-chip SRAM and must be reloaded after power cycle. The XC3S50-4TQG144I does not include on-die nonvolatile storage.
XC3S50-4TQG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 97
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50-4TQG144I FAQ
1.How can I place an order for XC3S50-4TQG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4TQG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4TQG144I reliable?
The price and inventory of XC3S50-4TQG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4TQG144I is usually 5 days.
3.What payment methods are accepted for XC3S50-4TQG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4TQG144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4TQG144I?
XC3S50-4TQG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4TQG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4TQG144I?
For technical support, including XC3S50-4TQG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4TQG144I requirements.
6.How does Aetrix verify that XC3S50-4TQG144I is sourced from the original manufacturer or authorized distributors?
All XC3S50-4TQG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4TQG144I meets industry standards.
7.What is the process for return or replacement of XC3S50-4TQG144I?
All XC3S50-4TQG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4TQG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4TQG144I part is unused and in its original packaging.
Return procedure for XC3S50-4TQG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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