AMD XC3S50-4VQ100I
- Part No.:
- XC3S50-4VQ100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S50-4VQ100I.pdf
- Description:
- IC FPGA 63 I/O 100VQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S50-4VQ100I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 176 logic cells, and 100-pin VQFP package. It operates at -4 speed grade (4.9 ns CLB delay), supports 3.3 V I/O, and includes embedded block RAM and DLLs for clock management. It is used in low-cost industrial control and communication interface logic.
For engineers reviewing the XC3S50-4VQ100I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, DLL-based clock deskew capability, and VQFP thermal and routing constraints for cost-sensitive PCB designs.
Technical Context
The XC3S50-4VQ100I implements a configurable logic fabric based on 4-input LUTs and flip-flops per CLB, with dedicated carry logic for arithmetic. It integrates eight 18-kbit block RAMs (total 144 kbits), twelve 18-bit multipliers, and four Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2, with programmable drive strength and slew rate per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 176 CLBs, each with two 4-LUTs + 2 FFs - defines combinational and sequential logic capacity |
| System Gates | 50,000 - industry-standard metric for relative logic density vs ASIC equivalents |
| Block RAM | 8 × 18 kbit = 144 kbits - supports FIFO, buffer, or small lookup table implementation |
| DCMs | 4 DCMs - enable jitter-reduced clock synthesis, phase alignment, and input deskew |
| I/O Standards | LVCMOS/LVTTL/PCI/SSTL-2 - allows direct interfacing to common microcontrollers and memory devices |
| Speed Grade | -4 (4.9 ns CLB delay) - specifies worst-case propagation timing for critical path synthesis |
Pinout & Package
100-pin Very Thin Quad Flat Pack (VQFP), 0.5 mm pitch, 14 mm × 14 mm body size. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P12, R1–R12, T1–T12, U1–U12 | Configurable I/O Banks (Bank 0–3) | Support independent VCCO and VREF per bank; enable mixed-voltage interface design |
| P13, P14, R13, R14 | JTAG TDI/TDO/TMS/TCK | Enable IEEE 1149.1 boundary-scan testing and in-system configuration |
| U13, U14, V13, V14 | Global Clock Inputs (GCLK0–GCLK3) | Dedicated low-skew routing to all DCMs and CLBs for synchronous timing integrity |
| V1, V2, W1, W2 | Configuration Pins (INIT_B, PROGRAM_B, DONE, CCLK) | Control serial PROM-based startup sequence and status reporting |
| V3, V4, W3, W4 | VCCINT / GND | 1.2 V core supply pins - require local decoupling within 10 mm of package edge |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Four fully independent DCMs provide deterministic clock deskew, frequency multiplication/division, and 90° phase shift without external PLL components |
| SelectIO Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) enables direct connection to legacy and modern peripherals without level-shifting circuitry |
| Embedded Multipliers | Twelve 18 × 18-bit signed multipliers accelerate DSP functions such as FIR filtering and motor control loop computation |
| Configuration Security | Bitstream encryption option prevents reverse engineering of logic design when using external PROM configuration |
Applications
| Industrial PLC I/O Expansion | Serial Protocol Bridge |
|---|---|
Use Scenario: Adding isolated RS-485 and CAN bus interfaces to legacy PLC backplanes. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing coordinator between fieldbus controllers and internal CPU bus. Use Value: Enables dual-bus concurrency with <10 ns inter-channel skew using DCM-controlled clock domains. | Use Scenario: Converting UART commands from HMI panels into SPI bursts for sensor array readout. IC Role / Device Role / Timing Role: Configurable state machine synchronizes asynchronous UART input with precise SPI clock generation. Use Value: Achieves 12 Mbps SPI output with jitter <50 ps RMS using DCM-derived clock and I/O delay calibration. |
| Low-Cost Video Timing Controller | Motor Drive Gate Signal Generator |
Use Scenario: Generating VGA sync signals and pixel clock for embedded display subsystems. IC Role / Device Role / Timing Role: FPGA generates precise HSYNC/VSYS/DE timing with programmable blanking intervals and pixel clock division. Use Value: Supports 800×600@60 Hz with ±0.5 pixel jitter via DCM-based clock synthesis and I/O register alignment. | Use Scenario: Producing six-channel complementary PWM with dead-time insertion for 3-phase inverter drives. IC Role / Device Role / Timing Role: FPGA implements real-time PWM modulation, fault detection, and gate driver enable sequencing. Use Value: Delivers <150 ns dead-time accuracy and <200 ns channel-to-channel skew across all six outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and clock management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4VQ100I | Higher logic density (256 CLBs, 100k gates), same package and speed grade | Supports larger state machines and deeper FIFOs; requires identical PCB layout | Choose when additional logic resources are needed without changing board footprint |
| XC3S50A-4VQ100C | Same logic count but improved process node (90 nm vs 130 nm), commercial temp range (0–70°C) | Lacks industrial temperature rating (-40 to 100°C); lower static power consumption | Prefer for non-industrial environments where power efficiency outweighs extended temperature operation |
Compared with XC3S50-4VQ100I, XC3S100-4VQ100I offers headroom for future firmware expansion while maintaining pin compatibility, whereas XC3S50A-4VQ100C trades industrial reliability for reduced quiescent current and higher maximum operating frequency in benign environments.
Availability
XC3S50-4VQ100I is available at Aetrix Electronics and suitable for industrial automation, communications infrastructure, and embedded display control requiring stable component supply across long-lifecycle programs.
Supply support for XC3S50-4VQ100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered SRAM-based FPGA architecture and configurable logic technology.
The Spartan-3 family was designed for high-volume, cost-sensitive applications requiring reliable logic density, integrated clock management, and flexible I/O - targeting industrial control, video, and communications endpoints.
FAQ
What is the maximum operating junction temperature for XC3S50-4VQ100I?
The XC3S50-4VQ100I is rated for industrial temperature range: –40°C to +100°C junction temperature. This specification is validated per Xilinx DS099 v2.5 and applies under specified thermal conditions with appropriate PCB copper pour and airflow. The XC3S50-4VQ100I must be operated within this range to ensure timing compliance and long-term reliability.
Does XC3S50-4VQ100I support JTAG programming in-system?
Yes, XC3S50-4VQ100I supports IEEE 1149.1 JTAG boundary-scan for in-system programming and debugging. Pins TCK, TMS, TDI, and TDO are dedicated for this function and remain active during configuration and normal operation. The XC3S50-4VQ100I allows full device programming, verification, and test access without requiring external configuration PROM.
How many user I/O pins does XC3S50-4VQ100I provide?
The XC3S50-4VQ100I provides 63 user-configurable I/O pins across four banks. Each bank supports independent VCCO voltage selection (1.2 V to 3.3 V) and programmable drive strength. Unused pins may be configured as inputs with weak pull-up or left unconnected, per Xilinx UG331 guidelines for the XC3S50-4VQ100I.
Can XC3S50-4VQ100I implement a 100 MHz DDR SDRAM controller?
Yes, XC3S50-4VQ100I can implement a 100 MHz DDR SDRAM controller using its DCMs for clock deskew and I/O registers for precise timing alignment. Reference design xapp466 demonstrates this functionality with verified timing closure. The XC3S50-4VQ100I's 63 I/O pins and 144 kbits of block RAM provide sufficient resources for address/command/data paths and command FIFOs.
Is bitstream encryption supported on XC3S50-4VQ100I?
Yes, XC3S50-4VQ100I supports optional AES-128 bitstream encryption when configured via external PROM using the Xilinx iMPACT toolchain. Encryption prevents unauthorized readback and cloning of the programmed logic design. This feature requires enabling security bits during bitstream generation and is documented in Xilinx UG332 for the XC3S50-4VQ100I.
XC3S50-4VQ100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 100-TQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 63
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S50-4VQ100I FAQ
1.How can I place an order for XC3S50-4VQ100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4VQ100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4VQ100I reliable?
The price and inventory of XC3S50-4VQ100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4VQ100I is usually 5 days.
3.What payment methods are accepted for XC3S50-4VQ100I?
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XC3S50-4VQ100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4VQ100I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4VQ100I?
For technical support, including XC3S50-4VQ100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4VQ100I requirements.
6.How does Aetrix verify that XC3S50-4VQ100I is sourced from the original manufacturer or authorized distributors?
All XC3S50-4VQ100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4VQ100I meets industry standards.
7.What is the process for return or replacement of XC3S50-4VQ100I?
All XC3S50-4VQ100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4VQ100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4VQ100I part is unused and in its original packaging.
Return procedure for XC3S50-4VQ100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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