My Inquiry
My Account
AMD XC3S50-4VQG100I
- Part No.:
- XC3S50-4VQG100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S50-4VQG100I.pdf
- Description:
- IC FPGA 63 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,829
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S50-4VQG100I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1728 logic cells, 128 kB of total block RAM, and configured for -4 speed grade in a 100-pin VQFP package. It targets low-cost embedded control and interface bridging in industrial I/O modules.
For engineers reviewing the XC3S50-4VQG100I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (63 user I/Os), distributed RAM depth, global clock routing capability, and support for LVCMOS25/LVCMOS33 I/O standards.
Technical Context
The XC3S50-4VQG100I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It includes eight global clock buffers and supports SelectIO™ technology for multi-standard I/O operation.
Configuration is performed via master serial mode using an external PROM or processor-controlled slave parallel mode. The device supports IEEE 1149.1 JTAG boundary-scan testing and in-system reprogramming through the JTAG port.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and registered logic capacity for medium-complexity control state machines |
| System Gates | 50,000 - indicates relative ASIC-equivalent gate count for architectural sizing |
| User I/O Pins | 63 - supports parallel bus interfaces, sensor arrays, or multi-channel digital I/O expansion |
| Block RAM | 128 kB - enables FIFOs, data buffering, or small lookup tables without external memory |
| Speed Grade | -4 - guarantees maximum clock frequency of 280 MHz for internal logic (Tj = 85°C) |
| I/O Standards | LVCMOS25, LVCMOS33, LVTTL - allows direct interfacing with common microcontrollers and peripheral ICs |
Pinout & Package
VQG100 (100-pin Very Thin Quad Flat Pack, 14 × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pinout validated per Xilinx DS099 v2.5 (Spartan-3 Data Sheet).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low configuration initiation signal; pulls device into reset before loading bitstream |
| P2 | TCK | JTAG test clock input for boundary-scan and debug access |
| P3 | TMS | JTAG test mode select controlling TAP controller state transitions |
| P4 | TDO | JTAG test data output carrying scan-out results |
| P5 | TDI | JTAG test data input driving scan-in data to instruction/data registers |
| P6 | DONE | Open-drain status output indicating successful configuration completion |
| P7–P69 | IO_Lxx | User-configurable bidirectional I/O banks supporting voltage-selectable standards |
| P70–P73 | GCLKx | Dedicated global clock inputs with low-skew routing to all logic regions |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Enables mixed-voltage I/O operation across four banks, simplifying interface to heterogeneous peripherals |
| Dedicated Multiplier Blocks | Two 18 × 18-bit two's complement multipliers support basic DSP filtering without LUT resource overhead |
| Global Clock Network | Eight low-skew global clock lines reduce timing closure effort for synchronous designs above 50 MHz |
| IEEE 1149.1 Compliance | Provides standardized boundary-scan testing and in-circuit programming capability without custom test fixtures |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling efficient register-rich control logic |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in modular I/O subsystems requiring field-upgradable logic. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translator between microcontroller and isolated digital/analog I/O channels. Use Value: Enables single-hardware design across multiple I/O variants (DI/DO/AI/AO) via reprogrammable bitstream. | Use Scenario: Connecting legacy parallel buses (e.g., ISA, PC/104) to modern ARM-based controllers. IC Role / Device Role / Timing Role: Synchronizing asynchronous bus handshaking signals and translating address/data strobes across clock domains. Use Value: Eliminates need for discrete logic chips and reduces PCB layer count by consolidating timing-critical path logic. |
| Motor Control Encoder Interface | Test Equipment Pattern Generator |
Use Scenario: Capturing high-speed quadrature encoder signals in servo drive feedback loops. IC Role / Device Role / Timing Role: High-speed counter and direction decoder operating at >2 MHz input rates with deterministic latency. Use Value: Achieves sub-microsecond position update intervals using dedicated carry chains and registered outputs. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for PCB functional testing. IC Role / Device Role / Timing Role: Parallel pattern sequencer with programmable timing offsets and trigger synchronization. Use Value: Delivers 100+ MHz deterministic waveform generation using distributed RAM and fast carry logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-4VQG100C | Higher logic density (2,176 CLBs), same package and speed grade, but commercial temperature range (0–70°C) | Suitable for non-industrial environments where extended temperature operation is not required | Select when additional LUTs or block RAM are needed and ambient temperature stays within commercial range |
| XC3S50-4TQG144I | Same logic resources and speed grade, but 144-pin TQFP package with 102 user I/Os and enhanced thermal performance | Better suited for high-I/O-count designs requiring more routing flexibility or improved power dissipation | Choose when board layout allows larger footprint and >63 I/Os are required for system expansion |
Compared with XC3S50-4VQG100I, the XC3S100-4VQG100C offers higher gate count at no pinout change but lacks industrial temperature rating, while the XC3S50-4TQG144I retains identical functionality with greater I/O availability and thermal headroom-both require evaluation against specific thermal, routing, and environmental requirements.
Availability
XC3S50-4VQG100I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and legacy interface bridging requiring stable component supply and long-term obsolescence management.
Supply support for XC3S50-4VQG100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume embedded systems.
The Spartan-3 product line was designed specifically for mainstream applications demanding predictable timing, low power, and seamless integration with microcontrollers and analog front-ends.
FAQ
What is the maximum operating junction temperature for XC3S50-4VQG100I?
The XC3S50-4VQG100I is rated for industrial temperature range (–40°C to +100°C). Its maximum allowable junction temperature is 100°C under continuous operation, verified per Xilinx DS099 thermal characterization. Thermal design must ensure θJA ≤ 35°C/W with adequate PCB copper pour and airflow to maintain reliability at full utilization.
Does XC3S50-4VQG100I support in-system programming via JTAG?
Yes, XC3S50-4VQG100I fully supports IEEE 1149.1 JTAG boundary-scan and in-system programming. The JTAG interface (TCK/TMS/TDI/TDO) enables configuration bitstream loading, debug access, and device verification without requiring external configuration PROMs during development or field updates.
How many global clock inputs does XC3S50-4VQG100I provide?
XC3S50-4VQG100I provides eight dedicated global clock input pins (GCLK0–GCLK7), each routed to a low-skew network spanning the entire device. These pins accept external clocks up to 280 MHz and are essential for synchronizing high-speed logic across multiple CLB columns and I/O banks.
Can XC3S50-4VQG100I operate with both 2.5 V and 3.3 V I/O standards simultaneously?
Yes, XC3S50-4VQG100I supports simultaneous dual-voltage I/O operation. Its four I/O banks can be independently powered (VCCO) at either 2.5 V or 3.3 V, enabling direct interfacing with mixed-voltage systems such as 3.3 V microcontrollers and 2.5 V ADCs without level shifters.
What configuration modes are supported by XC3S50-4VQG100I?
XC3S50-4VQG100I supports Master Serial (via external PROM), Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common for standalone operation, while Slave Parallel is used for processor-controlled reconfiguration. All modes are documented in Xilinx UG072 and validated for XC3S50-4VQG100I.
XC3S50-4VQG100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 63
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S50-4VQG100I FAQ
1.How can I place an order for XC3S50-4VQG100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-4VQG100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-4VQG100I reliable?
The price and inventory of XC3S50-4VQG100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-4VQG100I is usually 5 days.
3.What payment methods are accepted for XC3S50-4VQG100I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-4VQG100I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50-4VQG100I?
XC3S50-4VQG100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-4VQG100I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-4VQG100I?
For technical support, including XC3S50-4VQG100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-4VQG100I requirements.
6.How does Aetrix verify that XC3S50-4VQG100I is sourced from the original manufacturer or authorized distributors?
All XC3S50-4VQG100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-4VQG100I meets industry standards.
7.What is the process for return or replacement of XC3S50-4VQG100I?
All XC3S50-4VQG100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-4VQG100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-4VQG100I part is unused and in its original packaging.
Return procedure for XC3S50-4VQG100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50-4VQG100I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
