AMD XC3S50-5TQG144C
- Part No.:
- XC3S50-5TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50-5TQG144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,493
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Product details
Overview
XC3S50-5TQG144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 50,000 system gates, 1,728 logic cells, 120 I/O pins, and a -5 speed grade operating at up to 333 MHz; used in industrial control logic, digital signal preprocessing, and low-power embedded interface bridging.
For engineers reviewing the XC3S50-5TQG144C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, TQFP-144 package compatibility, LVCMOS25/LVCMOS33 I/O support, and single-ended clock input capability.
Technical Context
The XC3S50-5TQG144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, and PCI, with programmable slew rate and drive strength per I/O bank.
It features four global clock networks, internal DCM (Digital Clock Manager) for frequency synthesis and phase alignment, and configuration via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity state machines and data path logic. |
| System Gates | 50,000 - indicates total equivalent gate count for logic synthesis estimation and resource planning. |
| I/O Pins | 120 - supports parallel bus interfaces, sensor arrays, and multi-peripheral connectivity in compact layouts. |
| Speed Grade | -5 - guarantees timing closure up to 333 MHz for critical paths under worst-case industrial temperature conditions. |
| DCM Units | 2 - enables clock doubling, duty cycle correction, and phase shifting without external PLL components. |
| Voltage Supply | 1.2 V core / 3.3 V I/O - requires dual-rail power design with separate regulation and decoupling for core and I/O domains. |
Pinout & Package
TQFP-144 (Thin Quad Flat Package, 20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad; RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity in LVCMOS33 interfaces. |
| P2 | CLK0 | Dedicated global clock input - connects directly to DCM for low-skew clock distribution and jitter management. |
| R14 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration from external PROM or host processor upon assertion. |
| T13 | DONE | Configuration status output - goes high when bitstream loading completes and device enters user mode. |
| A14 | VCCAUX | 1.2 V auxiliary supply - powers configuration logic, DCM, and internal interconnect; requires tight tolerance regulation. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two independent DCMs provide jitter reduction, frequency synthesis, and phase alignment without external clock ICs. |
| SelectIO Technology | Per-bank voltage selection (1.2 V–3.3 V) enables mixed-voltage interfacing with legacy and modern peripherals. |
| Configurable Logic Blocks | Each CLB contains two 4-input LUTs and flip-flops, supporting efficient implementation of arithmetic and control logic. |
| Block RAM | 176 Kbits distributed across 22 x 8 Kbit blocks - sufficient for FIFOs, lookup tables, and small buffer memory. |
Applications
| Industrial PLC I/O Expansion | Digital Video Preprocessing |
|---|---|
Use Scenario: Adding isolated digital input/output channels to legacy PLC backplanes using field-programmable logic. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O controller with deterministic response under 1 µs. Use Value: Enables retrofitting of analog/digital sensor interfaces without redesigning main CPU board or changing firmware. | Use Scenario: Resizing, color-space conversion, and noise filtering on composite video streams before ADC digitization. IC Role / Device Role / Timing Role: Real-time pixel pipeline processor synchronizing to 27 MHz pixel clock with sub-cycle latency. Use Value: Reduces load on host SoC by offloading fixed-function video tasks while maintaining frame-rate compliance. |
| Medical Sensor Hub Interface | Automotive Diagnostic Gateway |
Use Scenario: Aggregating SPI/I²C outputs from ECG, SpO₂, and temperature sensors into a unified UART/USB stream. IC Role / Device Role / Timing Role: Multi-protocol bridge with independent clock domains and glitch-free signal resynchronization. Use Value: Eliminates need for discrete level shifters and protocol converters, reducing BOM count and PCB area. | Use Scenario: Translating between CAN 2.0A/B and LIN 2.x protocols in vehicle diagnostic modules for service tools. IC Role / Device Role / Timing Role: Protocol-aware packet router with CRC validation, message buffering, and timestamp tagging. Use Value: Supports concurrent diagnostics over multiple vehicle buses without microcontroller intervention or timing conflicts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100-5TQG144C | Higher logic density (2,176 CLBs) and 176 Kbytes block RAM; same package and pinout. | Supports larger state machines and deeper buffers; suitable when XC3S50-5TQG144C resources are insufficient. | Select if future firmware expansion or added peripheral support is anticipated without PCB revision. |
| XC3S200-5PQ208C | 208-pin PQFP package, 4,320 CLBs, 352 Kbytes block RAM; higher I/O count (161) and speed margin. | Enables multi-bus arbitration and full CAN/LIN/UART coexistence; requires board layout change. | Choose when migrating from XC3S50-5TQG144C to accommodate increased interface complexity or performance headroom. |
Compared with XC3S50-5TQG144C, the XC3S100-5TQG144C offers direct pin-compatible scalability within the same footprint, while XC3S200-5PQ208C delivers significantly greater logic and memory resources at the cost of package migration and routing effort.
Availability
XC3S50-5TQG144C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive diagnostics requiring stable component supply and long-term obsolescence management.
Supply support for XC3S50-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3 series, including XC3S50-5TQG144C, was designed for non-volatile, low-power logic replacement in space-constrained industrial and communications equipment.
FAQ
What is the maximum operating frequency of the XC3S50-5TQG144C?
The XC3S50-5TQG144C has a -5 speed grade, guaranteeing timing closure for critical paths up to 333 MHz under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design placement, routing, and clock domain structure. The XC3S50-5TQG144C DCM supports internal multiplication up to 384 MHz for derived clocks.
Does the XC3S50-5TQG144C support JTAG programming?
Yes, the XC3S50-5TQG144C supports IEEE 1149.1 JTAG boundary-scan and configuration through TMS, TCK, TDI, and TDO pins. JTAG mode allows in-system programming, debugging, and verification without requiring external PROM. The XC3S50-5TQG144C also supports Master Serial and Slave Serial configuration methods.
What I/O standards are supported by the XC3S50-5TQG144C?
The XC3S50-5TQG144C supports LVCMOS, LVTTL, PCI, and HSTL I/O standards across its 120 user I/O pins, with per-bank voltage selection (1.2 V to 3.3 V). Each I/O bank can be independently configured, enabling mixed-voltage operation. The XC3S50-5TQG144C does not support differential standards like LVDS or RSDS.
Is the XC3S50-5TQG144C RoHS compliant?
Yes, the XC3S50-5TQG144C is RoHS compliant and manufactured with lead-free finish. It meets EU Directive 2011/65/EU requirements and carries the appropriate marking. The TQFP-144 package uses matte tin plating and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
How many Digital Clock Managers (DCMs) does the XC3S50-5TQG144C include?
The XC3S50-5TQG144C integrates two fully independent Digital Clock Managers (DCMs). Each DCM provides input jitter filtering, frequency synthesis (multiply/divide), phase shifting, and duty cycle correction. These DCMs are essential for managing clock domains in the XC3S50-5TQG144C and eliminate the need for external clock ICs in most designs.
XC3S50-5TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 192
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 73728
- Number of I/O:
- 97
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50-5TQG144C FAQ
1.How can I place an order for XC3S50-5TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50-5TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50-5TQG144C reliable?
The price and inventory of XC3S50-5TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50-5TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S50-5TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50-5TQG144C transactions.
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XC3S50-5TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50-5TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50-5TQG144C?
For technical support, including XC3S50-5TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50-5TQG144C requirements.
6.How does Aetrix verify that XC3S50-5TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S50-5TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50-5TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S50-5TQG144C?
All XC3S50-5TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50-5TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50-5TQG144C part is unused and in its original packaging.
Return procedure for XC3S50-5TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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