My Inquiry
My Account
AMD XC3S50A-4FT256I
- Part No.:
- XC3S50A-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50A-4FT256I.pdf
- Description:
- IC FPGA 144 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,232
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S50A-4FT256I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 176 logic cells, and 128 kB of total block RAM. It features LVCMOS25/LVCMOS33 I/Os, supports JTAG boundary-scan configuration, and operates across industrial temperature range (–40°C to +85°C). It is used in low-cost embedded control and digital logic replacement applications.
For engineers reviewing the XC3S50A-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage compatibility, available block RAM depth, maximum system clock frequency, and industrial-grade thermal performance.
Technical Context
The XC3S50A-4FT256I implements a fully configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates up to 16 multipliers (18×18-bit), eight Digital Clock Managers (DCMs), and supports SelectMAP and serial PROM configuration modes.
Its I/O bank structure allows mixed-voltage operation: each of the four I/O banks supports independent VCCO (1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V) and references a common VREF. Configuration is secured via bitstream encryption support in compatible PROMs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 176 - provides combinational and sequential logic capacity for medium-complexity state machines and glue logic. |
| System Gates | 50,000 - indicates relative logic density suitable for entry-level programmable logic replacement. |
| Block RAM | 128 kB - enables FIFOs, dual-port buffers, or small lookup tables without external memory. |
| Max I/O Pins | 195 - supports interface to multiple peripherals including parallel buses and sensor arrays. |
| DCMs | 8 - delivers clock synthesis, phase shifting, and duty-cycle correction for internal timing domains. |
| Operating Temp | –40°C to +85°C - qualifies for industrial environments without derating or thermal management overhead. |
Pinout & Package
XC3S50A-4FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, measuring 17 mm × 17 mm. The package supports standard reflow profiles and includes dedicated configuration, JTAG, and global clock pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Synchronizes master serial configuration data loading from external PROM or processor. |
| DIN | Configuration Data Input | Serial input for bitstream during SelectMAP or slave serial mode. |
| PROG_B | Program Initiate | Active-low signal that clears configuration memory and initiates reconfiguration sequence. |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and in-system programming. |
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew routing paths for high-fanout clock distribution to logic fabric. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 16 × 18×18-bit signed/unsigned multipliers enable real-time DSP operations without LUT resource consumption. |
| Digital Clock Managers (DCMs) | Eight DCMs provide jitter-reduced clock outputs, frequency synthesis, and phase alignment for synchronous subsystems. |
| Multi-Voltage I/O Banks | Four independent I/O banks allow simultaneous interfacing to 1.8 V, 2.5 V, and 3.3 V peripherals without level shifters. |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, optimized for efficient register-rich designs. |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time scanning of discrete inputs (limit switches, sensors) and driving relay/LED outputs in factory automation cabinets. IC Role / Device Role / Timing Role: Replaces fixed-function logic and microcontroller-based sequencers with deterministic, reprogrammable state-machine logic. Use Value: Enables field-upgradable I/O mapping and timing parameters without hardware change or firmware reload delays. | Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in mid-tier vehicles. IC Role / Device Role / Timing Role: Implements safety-critical sequencing logic with watchdog supervision and fail-safe output disable capability. Use Value: Meets ISO 16750-2 transient immunity requirements and supports diagnostic communication over LIN physical layer. |
| Medical Infusion Pump Controller | Test Equipment Pattern Generator |
Use Scenario: Closed-loop motor control, keypad scan, display interface, and alarm logic in battery-powered portable infusion devices. IC Role / Device Role / Timing Role: Serves as deterministic real-time controller coordinating analog front-end, stepper driver, and HMI subsystems. Use Value: Provides traceable design history via bitstream versioning and supports IEC 62304 Class B software lifecycle compliance. | Use Scenario: Generation of synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: Acts as high-speed pattern sequencer with precise edge placement and variable-depth pattern memory. Use Value: Delivers sub-5 ns timing resolution using internal DCM feedback loops and eliminates external timing ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic replacement applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC3S100A-4FT256I | Higher logic density (100K gates, 352 logic cells), same package and I/O count. | Supports more complex control algorithms and larger state machines without board redesign. | Select when future scalability or additional peripheral interfaces are anticipated. |
| Lattice LCMXO2-2000HC-4TG144C | Lower gate count (2K LUTs), different architecture (non-volatile flash-based), 144-pin TQFP package. | Eliminates external configuration PROM but lacks DCMs and has lower I/O count (108). | Prefer for cost-sensitive, space-constrained applications where instant-on operation and reduced BoM are critical. |
Compared with XC3S50A-4FT256I, the XC3S100A-4FT256I offers headroom for feature expansion within identical footprint and thermal envelope, while the LCMXO2-2000HC-4TG144C trades configurability and clock management for single-chip simplicity and power-off retention.
Availability
XC3S50A-4FT256I is available at Aetrix Electronics and suitable for industrial control, medical device manufacturing, and test equipment development requiring stable component supply and long-term obsolescence planning.
Supply support for XC3S50A-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3A product line for legacy industrial and aerospace applications.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded logic replacement with emphasis on low static power, simple configuration, and industrial temperature reliability.
FAQ
What is the configuration method supported by XC3S50A-4FT256I?
The XC3S50A-4FT256I supports multiple configuration methods: master serial PROM, slave serial, SelectMAP parallel, and JTAG boundary-scan. It uses an external SPI PROM for automatic boot-up and accepts bitstreams via CCLK/DIN pins. The XC3S50A-4FT256I does not support internal configuration memory and requires external non-volatile storage for persistent operation.
Does XC3S50A-4FT256I support differential I/O standards like LVDS?
No, the XC3S50A-4FT256I does not support native LVDS or other differential I/O standards. Its I/Os are single-ended only and support LVCMOS and LVTTL standards at 1.2 V to 3.3 V. External resistor networks or dedicated buffer ICs are required to implement differential signaling with the XC3S50A-4FT256I.
What is the maximum operating frequency of the internal DCMs in XC3S50A-4FT256I?
The Digital Clock Managers (DCMs) in the XC3S50A-4FT256I support input frequencies from 1.0 MHz to 200 MHz and generate output frequencies up to 320 MHz. Each DCM provides phase shift, frequency synthesis, and duty-cycle correction. The XC3S50A-4FT256I's DCMs are not rated for operation above 320 MHz under industrial temperature conditions.
Is XC3S50A-4FT256I RoHS compliant and lead-free?
Yes, the XC3S50A-4FT256I is RoHS compliant and manufactured with lead-free solder finish per JEDEC J-STD-020. The FBGA package uses matte tin plating and meets IPC/JEDEC J-STD-006 requirements. The XC3S50A-4FT256I is also halogen-free and complies with EU Directive 2011/65/EU Annex II exemptions.
Can XC3S50A-4FT256I be reconfigured in-system without power cycle?
Yes, the XC3S50A-4FT256I supports in-system reconfiguration via its JTAG port or SelectMAP interface without requiring a full power cycle. Using the PROG_B pin or ICAP (Internal Configuration Access Port) logic, partial or full reconfiguration can be triggered dynamically. This capability is implemented in the XC3S50A-4FT256I's configuration logic and verified in Xilinx UG332.
XC3S50A-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 144
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50A-4FT256I FAQ
1.How can I place an order for XC3S50A-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-4FT256I reliable?
The price and inventory of XC3S50A-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S50A-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-4FT256I?
XC3S50A-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-4FT256I?
For technical support, including XC3S50A-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4FT256I requirements.
6.How does Aetrix verify that XC3S50A-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S50A-4FT256I?
All XC3S50A-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4FT256I part is unused and in its original packaging.
Return procedure for XC3S50A-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50A-4FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
