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AMD XC3S50A-4FTG256C
- Part No.:
- XC3S50A-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50A-4FTG256C.pdf
- Description:
- IC FPGA 144 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,267
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Product details
Overview
XC3S50A-4FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1728 logic cells, and 128 kB of total block RAM. It features 191 user I/Os, operates at -4 speed grade (1.14 ns CLB delay), and uses a 256-pin FTBGA package. It is used in industrial control logic and low-cost embedded interface bridging.
For engineers reviewing the XC3S50A-4FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, speed grade timing closure, and FTBGA thermal/mechanical compatibility with existing PCB footprints.
Technical Context
The XC3S50A-4FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, and PCI up to 33 MHz.
Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. It includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - supporting input frequencies from 1.5 MHz to 200 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - defines maximum combinational/sequential logic capacity per design |
| System Gates | 50,000 - legacy metric estimating equivalent NAND gate count for logic density |
| Block RAM | 128 kB - supports FIFOs, buffers, and small lookup tables without external memory |
| User I/O Pins | 191 - usable for parallel interfaces, sensor buses, or multi-protocol GPIO expansion |
| Speed Grade | -4 - guarantees 1.14 ns CLB propagation delay under worst-case conditions |
| Package | 256-pin FTBGA (17×17 mm, 1.0 mm pitch) - enables high I/O density with standard reflow assembly |
Pinout & Package
XC3S50A-4FTG256C is housed in a 256-ball fine-pitch thin BGA (FTBGA) package with 17×17 ball array and 1.0 mm pitch. Thermal pad on underside requires solder paste stencil design per Xilinx UG380.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; decoupling required within 10 mm of each pin |
| VCCO_0 | I/O bank power | 3.3 V or 2.5 V selectable per bank; sets voltage standard for associated pins |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and restarts boot |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port for programming and boundary-scan verification |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, 0–255° phase shift, and 50% duty cycle correction |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate control |
| Embedded Multipliers | Four 18×18-bit two's complement multipliers enable basic DSP functions without external ICs |
| Configurable Logic Blocks | Each CLB contains two 4-input LUTs and flip-flops, enabling efficient state machine and pipeline implementation |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable glue logic implementing opto-isolated input sampling and relay driver timing control. Use Value: Replaces discrete logic and microcontroller firmware with deterministic, low-latency hardware state machines. | Use Scenario: Bridging RS-232/RS-485 physical layers to modern microcontroller UART peripherals. IC Role / Device Role / Timing Role: Protocol translator and baud-rate domain crossing synchronizer between legacy and embedded domains. Use Value: Eliminates software-based bit-banging and enables simultaneous multi-port conversion with fixed latency. |
| Automated Test Equipment (ATE) Fixture Control | Low-Cost Video Signal Formatter |
Use Scenario: Controlling solenoid valves, LED indicators, and DUT power sequencing in benchtop test fixtures. IC Role / Device Role / Timing Role: Deterministic sequencer managing timed power-up/down sequences and interlock monitoring. Use Value: Guarantees sub-microsecond response to safety signals and eliminates MCU interrupt latency variability. | Use Scenario: Converting parallel CMOS camera sensor output to BT.656-compatible YUV stream for SoC video input. IC Role / Device Role / Timing Role: Pixel clock domain adapter with line buffering and sync pulse generation. Use Value: Enables direct connection of unprocessed image sensors to media processors without external frame buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4FTG256C | Higher logic density (2,176 CLBs), same package and speed grade | Supports larger state machines and deeper FIFOs without board redesign | Choose when additional logic resources are needed but footprint and thermal envelope must be preserved |
| XC6SLX9-2TQG144C | Smaller package (144-pin TQFP), lower power, Spartan-6 architecture with enhanced DSP slices | Limited I/O count (102) and no native PCI support; better for cost-sensitive, low-power designs | Choose for new designs prioritizing power efficiency and toolchain longevity over legacy interface compatibility |
Compared with XC3S50A-4FTG256C, the XC3S100A-4FTG256C offers headroom for logic growth within identical mechanical constraints, while the XC6SLX9-2TQG144C trades I/O and legacy interface support for lower static power and modern synthesis flow compatibility.
Availability
XC3S50A-4FTG256C is available at Aetrix Electronics and suitable for industrial control, test equipment, and legacy interface bridging requiring stable component supply across extended production lifecycles.
Supply support for XC3S50A-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product lines for cost-sensitive, high-volume embedded applications.
The Spartan-3A family was designed for non-volatile, low-power logic replacement in industrial and automotive subsystems where programmability and I/O flexibility outweigh advanced processing features.
FAQ
What is the maximum operating frequency supported by the XC3S50A-4FTG256C?
The XC3S50A-4FTG256C supports input clock frequencies up to 200 MHz when using its Digital Clock Manager (DCM). Its -4 speed grade guarantees 1.14 ns CLB propagation delay, enabling reliable operation of synchronous logic at system clock frequencies up to approximately 125 MHz depending on routing and resource utilization.
Does the XC3S50A-4FTG256C support JTAG programming?
Yes, the XC3S50A-4FTG256C includes full IEEE 1149.1 JTAG boundary-scan support via dedicated TCK, TMS, TDI, and TDO pins. This enables in-system programming, configuration verification, and debug access without requiring external configuration PROMs during development.
Can the XC3S50A-4FTG256C operate with multiple I/O voltage standards simultaneously?
Yes, the XC3S50A-4FTG256C supports SelectIO technology with independent VCCO banks. Each bank can be powered at 3.3 V, 2.5 V, or 1.8 V, allowing concurrent LVCMOS33, LVCMOS25, and LVCMOS18 signaling on different pin groups without level-shifting components.
Is the XC3S50A-4FTG256C RoHS compliant?
Yes, the XC3S50A-4FTG256C is manufactured in accordance with RoHS Directive 2011/65/EU. It contains no lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE), and meets Xilinx's lead-free packaging requirements for commercial temperature grade devices.
What configuration modes does the XC3S50A-4FTG256C support?
The XC3S50A-4FTG256C supports Master Serial (via external PROM), Slave Serial, JTAG, and Boundary Scan configuration modes. Configuration data is loaded into SRAM-based CLBs on power-up, making it volatile - persistent storage requires external SPI or x8 PROM or flash memory.
XC3S50A-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 144
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50A-4FTG256C FAQ
1.How can I place an order for XC3S50A-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-4FTG256C reliable?
The price and inventory of XC3S50A-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S50A-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-4FTG256C?
XC3S50A-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-4FTG256C?
For technical support, including XC3S50A-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4FTG256C requirements.
6.How does Aetrix verify that XC3S50A-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S50A-4FTG256C?
All XC3S50A-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S50A-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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