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AMD XC3S50A-4FTG256I
- Part No.:
- XC3S50A-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50A-4FTG256I.pdf
- Description:
- IC FPGA 144 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,788
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Product details
Overview
XC3S50A-4FTG256I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1728 logic cells, and 128 kB of total block RAM. It features 191 user I/Os in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade with industrial temperature range (-40°C to +100°C). It is used in low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S50A-4FTG256I datasheet, pinout, applications, or equivalent options, key selection considerations include I/O count, block RAM depth, speed grade timing closure, industrial temperature support, and legacy Spartan-3A toolchain compatibility.
Technical Context
The XC3S50A-4FTG256I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or processor-controlled Slave Parallel mode. Internal configuration memory is volatile and requires reprogramming at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - defines maximum combinational/sequential logic capacity |
| System Gates | 50,000 - gate-equivalent metric aligned with ASIC synthesis reference |
| Block RAM | 128 kB - supports dual-port FIFOs, data buffering, and small lookup tables |
| User I/O Pins | 191 - available for interface expansion, sensor connectivity, or protocol bridging |
| Speed Grade | -4 - guarantees timing closure up to 410 MHz internal clock (DCM output) |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Package | 256-pin FTBGA (17×17 mm, 1.0 mm pitch) - surface-mount, thermal pad compatible |
Pinout & Package
XC3S50A-4FTG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FTBGA) package with exposed thermal pad. Pin assignments follow Xilinx Spartan-3A footprint standard; ball A1 is VCCO_0, and bank-specific voltage domains apply per I/O group.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload |
| P1 | DONE | Open-drain status signal indicating successful configuration completion |
| T3 | CCLK | Configuration clock input for Master Serial mode (driven by FPGA) |
| R2 | M0/M1/M2 | Mode select pins determining boot source (e.g., SPI PROM, JTAG) |
| A14 | VCCINT | 1.2 V core supply - must be filtered and decoupled within 1 cm |
| H17 | VCCO_2 | 3.3 V I/O bank supply - sets voltage level for associated pins in Bank 2 |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable real-time filtering and motor control math |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2 V to 3.3 V) with programmable slew rate and drive strength |
| Digital Clock Manager (DCM) | One DCM provides frequency synthesis, phase shifting, and duty-cycle correction without external PLL |
| Embedded Block RAM | 128 kB distributed across 32 × 4-kB blocks - each independently configurable as single/dual-port RAM or ROM |
| Configuration Security | Bitstream encryption option via external PROM prevents reverse engineering of logic design |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Modular I/O expansion in programmable logic controllers requiring deterministic response and field-reprogrammability. IC Role / Device Role / Timing Role: FPGA acts as parallel-to-serial converter and protocol translator between backplane bus and isolated digital I/O channels. Use Value: 191 user I/Os allow direct connection to 32-channel isolation ICs; -4 speed grade ensures sub-1 µs scan cycle latency. | Use Scenario: Bridging RS-232/RS-485 peripherals to modern microcontroller buses in retrofit instrumentation systems. IC Role / Device Role / Timing Role: Configurable logic implements UART-to-SPI translation and handshaking logic with precise timing control. Use Value: SelectIO support for 3.3 V LVTTL and 5 V-tolerant inputs enables direct interfacing with legacy transceivers without level shifters. |
| Automotive Diagnostic Tool | Low-Cost Video Preprocessor |
Use Scenario: Handheld OBD-II diagnostic interface supporting multiple protocols (SAE J1850, ISO 9141, CAN) with firmware-upgradable logic. IC Role / Device Role / Timing Role: FPGA handles physical layer arbitration, protocol framing, and checksum generation in real time. Use Value: Industrial temperature rating (-40°C to +100°C) permits operation inside vehicle cabins; DCM stabilizes timing across voltage fluctuations. | Use Scenario: Real-time pixel format conversion and sync stripping for analog composite video inputs in security DVRs. IC Role / Device Role / Timing Role: FPGA implements line buffers, color space conversion (YUV to RGB), and horizontal/vertical blanking detection. Use Value: 128 kB block RAM provides sufficient line buffer depth for NTSC/PAL resolution; 18×18 multipliers accelerate chroma subsampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4FTG256I | 100K-gate capacity, 2196 logic cells, same package and speed grade | Higher gate count supports larger state machines or additional peripheral interfaces | Choose when design requires >1728 logic cells but retains identical footprint and thermal profile |
| XC3S50-4PQ208I | Same 50K-gate density but 208-pin PQFP package, lower I/O count (141), no thermal pad | Less board area consumption but reduced routing flexibility and thermal performance | Prefer for cost-sensitive, space-constrained designs where I/O count and thermal management are secondary |
Compared with XC3S50A-4FTG256I, the XC3S100A-4FTG256I offers headroom for logic growth without layout change, while the XC3S50-4PQ208I trades I/O and thermal capability for simpler assembly and lower PCB layer count.
Availability
XC3S50A-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and legacy interface bridging requiring stable component supply and long-term lifecycle support.
Supply support for XC3S50A-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan product lines for industrial and aerospace customers requiring long-lifecycle assurance.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded control and interface applications where predictable timing, low static power, and mature toolchain support are critical.
FAQ
What is the configuration method supported by XC3S50A-4FTG256I?
The XC3S50A-4FTG256I supports Master Serial (via on-chip oscillator driving CCLK), Slave Parallel, and JTAG boundary-scan configuration modes. Master Serial is most common for standalone operation using external SPI PROM. Configuration bitstream is loaded into volatile SRAM fabric and must be reloaded at each power-on event.
Does XC3S50A-4FTG256I include on-chip clock generation?
Yes, XC3S50A-4FTG256I integrates one Digital Clock Manager (DCM) providing frequency synthesis, phase shifting, and duty-cycle correction. It accepts input clocks from 5 MHz to 200 MHz and generates stable outputs without external PLL components, enabling jitter-tolerant system timing.
What I/O standards are supported by XC3S50A-4FTG256I?
XC3S50A-4FTG256I supports LVCMOS, LVTTL, PCI, SSTL18, and HSTL I/O standards across its 10 I/O banks. Each bank is independently powered (VCCO), allowing mixed-voltage operation. Slew rate and drive strength are programmable per pin group to meet signal integrity requirements.
Is XC3S50A-4FTG256I qualified for automotive applications?
XC3S50A-4FTG256I carries an industrial temperature rating (-40°C to +100°C) and is widely deployed in under-hood diagnostic tools and body-control modules. While not AEC-Q100 certified, its qualification scope covers automotive ambient conditions when used within specified voltage and thermal limits.
Can XC3S50A-4FTG256I replace XC3S50-4PQ208I in an existing design?
No direct replacement is possible without PCB revision: XC3S50A-4FTG256I uses a 256-ball FTBGA package versus the 208-pin PQFP of XC3S50-4PQ208I. Though logic capacity and speed grade match, the package change requires new layout, thermal pad integration, and requalification of signal integrity and power delivery.
XC3S50A-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 144
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50A-4FTG256I FAQ
1.How can I place an order for XC3S50A-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-4FTG256I reliable?
The price and inventory of XC3S50A-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S50A-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-4FTG256I?
XC3S50A-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-4FTG256I?
For technical support, including XC3S50A-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4FTG256I requirements.
6.How does Aetrix verify that XC3S50A-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S50A-4FTG256I?
All XC3S50A-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S50A-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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