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AMD XC3S50A-4TQ144I
- Part No.:
- XC3S50A-4TQ144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50A-4TQ144I.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,883
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Product details
Overview
XC3S50A-4TQ144I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1,728 logic cells, and 144-pin TQFP package. It operates at -4 speed grade (1.14 ns CLB delay), supports 3.3V/2.5V/1.2V I/Os, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S50A-4TQ144I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded block RAM capacity, global clock routing resources, and JTAG configuration support.
Technical Context
The XC3S50A-4TQ144I implements a fully SRAM-based configurable logic architecture with dedicated carry chains and fast look-up tables (LUTs). It integrates eight 18-Kb block RAMs (144 Kb total), twelve digital clock managers (DCMs), and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via master serial mode using external PROM or active serial configuration controller. The device includes internal startup circuitry, JTAG boundary-scan testing per IEEE 1149.1, and supports multi-boot through dual-PROM or fallback configuration schemes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity state machines and data path control. |
| System Gates | 50,000 - indicates overall logic density suitable for protocol translation and peripheral interface logic. |
| Block RAM | 144 Kb (8 × 18 Kb) - enables local data buffering, FIFO implementation, and small lookup table storage without external memory. |
| DCMs | 12 - deliver jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous design timing closure. |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing to microcontrollers, memory buses, and legacy peripherals without level shifters. |
| Speed Grade | -4 - guarantees maximum 1.14 ns CLB propagation delay at 1.2V core voltage, enabling 100+ MHz system clock operation. |
Pinout & Package
XC3S50A-4TQ144I is housed in a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (non-electrical). The package supports reflow soldering and meets JEDEC MS-026 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PIN_1 (TCK) | JTAG Test Clock | Drives boundary-scan test clock signal during programming and debug operations. |
| PIN_2 (TMS) | JTAG Test Mode Select | Controls JTAG state machine transitions for configuration and verification. |
| PIN_3 (TDI) | JTAG Test Data In | Serial input for bitstream loading and instruction register programming. |
| PIN_4 (TDO) | JTAG Test Data Out | Serial output for readback, IDCODE, and boundary-scan data capture. |
| PIN_5 (INIT_B) | Configuration Initialization | Open-drain active-low signal indicating configuration status and error detection. |
| PIN_6 (DONE) | Configuration Completion | Open-drain active-high signal confirming successful bitstream load and startup. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | 12 independent DCMs provide deterministic clock skew control, duty-cycle correction, and frequency synthesis without external PLL ICs. |
| Embedded Block RAM | Eight 18-Kb blocks enable dual-port RAM, true dual-port FIFO, and distributed memory mapping with no external SRAM footprint. |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2V–3.3V) with programmable drive strength and slew rate control for EMI reduction and signal integrity. |
| MultiBoot Configuration | Enables field-upgradable firmware via dual-PROM or fallback bitstreams, supporting fail-safe reconfiguration after power loss or corruption. |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol conversion between RS-485 fieldbus and ARM-based controller. IC Role / Device Role / Timing Role: FPGA acts as programmable glue logic and timing bridge, managing handshake signals and clock domain crossing between 10 MHz fieldbus and 66 MHz processor bus. Use Value: Eliminates need for discrete logic and multiple ASICs; enables firmware-defined I/O mapping and hot-swappable module support. | Use Scenario: CAN-to-USB gateway in vehicle service tools, translating OBD-II diagnostics commands between ECU and PC host. IC Role / Device Role / Timing Role: XC3S50A-4TQ144I implements CAN controller logic, USB endpoint buffers, and protocol state machines in single chip. Use Value: Reduces BOM count by integrating CAN transceiver interface logic, USB descriptor handling, and error recovery FSMs. |
| Medical Sensor Hub | Legacy Equipment Emulator |
Use Scenario: Aggregating analog sensor inputs (ECG, SpO₂) and digitizing via external ADCs before streaming over UART/USB. IC Role / Device Role / Timing Role: FPGA manages time-multiplexed ADC sampling, applies digital filtering coefficients, and formats packetized output streams. Use Value: Enables real-time FIR filtering and sample-rate conversion without DSP co-processor; supports FDA Class II device certification via deterministic latency. | Use Scenario: Replacing obsolete ISA-bus industrial controllers by emulating timing-critical address decoding and interrupt response behavior. IC Role / Device Role / Timing Role: XC3S50A-4TQ144I replicates exact 8-bit ISA bus cycle timing, including wait-state insertion and DMA handshaking. Use Value: Extends lifecycle of legacy factory automation hardware without PCB redesign or driver changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4TQ144I | Higher logic density (2,176 LCs, 100K gates), same package and speed grade. | Suitable for designs requiring additional state machines or wider datapaths without layout change. | Select when future scalability or added peripheral integration is required; shares identical pinout and power delivery. |
| LFE5U-12F-6CABGA256 | 5M-gate ECP5 FPGA with embedded SERDES, lower static power, but different BGA package and toolchain. | Preferred for new designs needing PCIe or Gigabit Ethernet PHY integration. | Choose only if migrating to newer architecture; not pin-compatible and requires full schematic/layout revision. |
Compared with XC3S50A-4TQ144I, the XC3S100A-4TQ144I offers headroom for feature expansion within the same footprint, while the LFE5U-12F-6CABGA256 enables high-speed serial interfaces but mandates complete hardware redesign and toolchain migration.
Availability
XC3S50A-4TQ144I is available at Aetrix Electronics and suitable for industrial control, automotive diagnostics, and medical sensor interface applications requiring stable component supply across extended production lifecycles.
Supply support for XC3S50A-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered SRAM-based FPGAs for cost-sensitive, high-volume applications.
The Spartan-3A family was designed specifically for high-performance, low-power, and low-cost embedded logic replacement-targeting industrial I/O, communication bridges, and legacy interface emulation.
FAQ
What is the core voltage requirement for XC3S50A-4TQ144I?
The XC3S50A-4TQ144I requires a nominal 1.2 V ±3% core supply (VCCINT) for proper operation. This voltage powers the internal logic fabric and DCMs. Deviation beyond tolerance risks timing violations or configuration failure. The XC3S50A-4TQ144I does not support adaptive voltage scaling and must be supplied from a tightly regulated LDO or DC-DC converter meeting Xilinx DS312 specification.
Does XC3S50A-4TQ144I support JTAG boundary-scan testing?
Yes, XC3S50A-4TQ144I fully complies with IEEE 1149.1 and supports JTAG boundary-scan for board-level testing and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate independently of configuration mode. The XC3S50A-4TQ144I also supports JTAG IDCODE readback and EXTEST instruction for interconnect verification.
Can XC3S50A-4TQ144I be configured using SPI flash memory?
No, XC3S50A-4TQ144I does not support native SPI flash configuration. It requires master serial mode with XCFxx Platform Flash PROMs or active serial controllers. While third-party SPI-to-serial bridges exist, they add latency and complexity. The XC3S50A-4TQ144I datasheet explicitly lists only XCF01S, XCF02S, and XCF04S as compatible configuration PROMs.
How many global clock networks does XC3S50A-4TQ144I provide?
The XC3S50A-4TQ144I provides eight global clock networks (GCLK lines) routed through dedicated low-skew clock buffers. These networks distribute clock signals to all CLBs, IOBs, and block RAMs with guaranteed skew ≤150 ps. Each DCM output can drive one GCLK line, and the XC3S50A-4TQ144I supports up to four simultaneously active global clocks.
Is XC3S50A-4TQ144I RoHS compliant and lead-free?
Yes, XC3S50A-4TQ144I is RoHS compliant and manufactured with lead-free (Pb-free) terminations per J-STD-609. The TQFP package uses matte tin plating and meets JEDEC JESD201A vibration resistance requirements. Full compliance documentation, including substance declarations and test reports, is available under AMD's Product Change Notification (PCN) #XIL-2018-003 for Spartan-3A devices.
XC3S50A-4TQ144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50A-4TQ144I FAQ
1.How can I place an order for XC3S50A-4TQ144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4TQ144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-4TQ144I reliable?
The price and inventory of XC3S50A-4TQ144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4TQ144I is usually 5 days.
3.What payment methods are accepted for XC3S50A-4TQ144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-4TQ144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-4TQ144I?
XC3S50A-4TQ144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-4TQ144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-4TQ144I?
For technical support, including XC3S50A-4TQ144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4TQ144I requirements.
6.How does Aetrix verify that XC3S50A-4TQ144I is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4TQ144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4TQ144I meets industry standards.
7.What is the process for return or replacement of XC3S50A-4TQ144I?
All XC3S50A-4TQ144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4TQ144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4TQ144I part is unused and in its original packaging.
Return procedure for XC3S50A-4TQ144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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