AMD XC3S50A-4TQG144C
- Part No.:
- XC3S50A-4TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50A-4TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:9,334
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Product details
Overview
XC3S50A-4TQG144C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 144-pin TQFP package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates 1728 logic cells, 120 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S50A-4TQG144C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and availability of dedicated DSP slices for low-latency arithmetic.
Technical Context
The XC3S50A-4TQG144C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry chains for arithmetic. It includes eight global clock buffers and supports up to four independent clock domains.
Configuration is performed via external SPI PROM (Master Serial mode) or parallel data bus (Slave Parallel mode); internal startup circuitry manages power-on reset and configuration verification using CRC checksum.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity state machines and protocol engines. |
| Block RAM | 120 Kbits - enables dual-port FIFOs, lookup tables, or small buffer memory without external SRAM. |
| I/O Pins | 108 user I/O - supports mixed-voltage operation (LVCMOS25/LVCMOS33) with programmable slew rate and drive strength. |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for internal logic paths under worst-case commercial conditions. |
| Configuration Mode | Master Serial / Slave Parallel - allows flexible boot sources including SPI flash or host processor-controlled loading. |
| Operating Temp | 0°C to +85°C - validated for use in industrial control panels and commercial-grade instrumentation. |
Pinout & Package
XC3S50A-4TQG144C uses a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (GND-connected). Pin assignment follows Xilinx Spartan-3A family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low asynchronous reset input that initiates reconfiguration sequence when asserted. |
| P2 | CCLK | Configuration clock output during Master Serial mode; driven by FPGA during PROM readback. |
| P3 | DIN | Serial data input from SPI PROM during Master Serial configuration. |
| P4 | INIT_B | Open-drain status signal indicating configuration status (low = error or incomplete). |
| P5–P112 | IO_Lxx_yy | User-configurable bidirectional I/O banks supporting multiple voltage standards and termination options. |
| P113–P144 | VCCO / GND / VCCAUX / DONE | Power supply pins per bank, auxiliary 2.5 V supply, and configuration completion indicator. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multiplier Blocks | Four 18×18-bit multipliers enable fixed-point filtering and motor control loop acceleration without LUT resource overhead. |
| SelectIO Technology | Per-bank I/O voltage selection (1.2 V to 3.3 V) allows direct interfacing with legacy and modern peripherals without level shifters. |
| Embedded Block RAM | 120 Kbits distributed across 20 blocks (each 4 Kbits) supports true dual-port access for concurrent read/write operations. |
| Global Clock Network | Eight low-skew global clock buffers distribute synchronous signals with < ±100 ps skew across full device area. |
| Configuration Security | Bitstream encryption option prevents reverse engineering of design logic in deployed systems. |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O channels to legacy PLC backplanes using RS-485 or CAN physical layers. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and GPIO expander, synchronizing fieldbus timing with internal controller clocks. Use Value: Enables reuse of existing HMI software while supporting 16-channel high-speed sampling at 10 kHz per channel. | Use Scenario: Converting HDMI 1.3a pixel data to parallel RGB+DE+HS+VS for LCD panel driver ICs in medical displays. IC Role / Device Role / Timing Role: Timing-critical video pipeline engine performing color space conversion and pixel clock domain crossing. Use Value: Achieves sub-pixel jitter (< 0.5 ns RMS) and zero-frame-drop operation at 1280×1024@60 Hz resolution. |
| Automotive Diagnostic Tool | Test Equipment Pattern Generator |
Use Scenario: Implementing UDS (ISO 14229) and KWP2000 protocol stacks for handheld OBD-II scanners. IC Role / Device Role / Timing Role: Real-time protocol state machine with deterministic response latency (< 2 ms) to diagnostic request frames. Use Value: Meets ISO 15765-2 timing requirements for flow control and frame segmentation without microcontroller intervention. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for ASIC validation in ATE environments. IC Role / Device Role / Timing Role: High-precision pattern sequencer with 100 MHz maximum output rate and adjustable phase alignment per channel. Use Value: Reduces test setup time by 40% compared to PC-based waveform generators due to deterministic hardware timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4TQG144C | Higher logic density (2,176 CLBs), same package and speed grade; requires identical PCB footprint. | Supports larger state machines and additional peripheral interfaces without board redesign. | Choose when future firmware expansion or added protocol support (e.g., USB 2.0 PHY glue logic) is anticipated. |
| LFE5U-12F-6BG256C | Low-power 5G Lattice FPGA with 12K LUTs, different pinout, no native SPI configuration interface. | Requires external configuration controller and board-level voltage translation for 3.3 V I/O compatibility. | Prefer for battery-powered portable tools where static power must remain below 25 mW at idle. |
Compared with XC3S50A-4TQG144C, the XC3S100A-4TQG144C offers headroom for logic growth within the same footprint, while the LFE5U-12F-6BG256C trades configurability and ease of integration for ultra-low static power-making it suitable only where thermal constraints override design reuse priorities.
Availability
XC3S50A-4TQG144C is available at Aetrix Electronics and suitable for industrial automation, medical display interface, and automotive diagnostics requiring stable component supply over extended production lifecycles.
Supply support for XC3S50A-4TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product line for cost-sensitive, high-volume embedded applications.
The Spartan-3A family was designed for non-volatile, low-cost logic replacement in industrial control, video processing, and communications infrastructure where performance-per-watt and rapid time-to-market are critical.
FAQ
What configuration modes does the XC3S50A-4TQG144C support?
The XC3S50A-4TQG144C supports Master Serial (SPI PROM), Slave Parallel (host CPU), and JTAG boundary-scan configuration. Master Serial is most common for standalone operation, while Slave Parallel enables dynamic reconfiguration from an embedded processor. All modes are verified in the Xilinx UG332 documentation.
Does the XC3S50A-4TQG144C include built-in configuration memory?
No, the XC3S50A-4TQG144C does not include on-chip non-volatile configuration memory. It requires external SPI PROM or parallel EEPROM for bitstream storage. The FPGA loads configuration data on power-up using its internal startup sequence, which validates integrity via CRC check before enabling user logic.
Can the XC3S50A-4TQG144C operate with mixed I/O voltage standards?
Yes, the XC3S50A-4TQG144C supports mixed I/O standards per bank: each of its six I/O banks can be independently set to LVCMOS25 or LVCMOS33. This allows simultaneous connection to 2.5 V sensors and 3.3 V microcontrollers without external level shifters, provided VCCO and VREF are correctly routed per bank.
What is the maximum operating frequency of internal logic in XC3S50A-4TQG144C?
The XC3S50A-4TQG144C -4 speed grade guarantees 333 MHz maximum clock frequency for internal logic paths under worst-case commercial temperature and voltage conditions. Actual achievable frequency depends on design routing, logic depth, and clock domain crossings, but timing analysis tools confirm this limit for fully constrained designs.
Is bitstream encryption supported on XC3S50A-4TQG144C?
Yes, the XC3S50A-4TQG144C supports optional AES-128 bitstream encryption using a user-provided key stored in on-chip eFUSE. When enabled, the encrypted bitstream prevents unauthorized readback or cloning. Decryption occurs transparently during configuration, and the feature is activated via BitGen tool settings in the Xilinx ISE design suite.
XC3S50A-4TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50A-4TQG144C FAQ
1.How can I place an order for XC3S50A-4TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC3S50A-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4TQG144C is usually 5 days.
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5.How can I obtain technical support or documentation for XC3S50A-4TQG144C?
For technical support, including XC3S50A-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4TQG144C requirements.
6.How does Aetrix verify that XC3S50A-4TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S50A-4TQG144C?
All XC3S50A-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4TQG144C part is unused and in its original packaging.
Return procedure for XC3S50A-4TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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