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AMD XC3S50A-4VQ100I
- Part No.:
- XC3S50A-4VQ100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S50A-4VQ100I.pdf
- Description:
- IC FPGA 68 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,506
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Product details
Overview
XC3S50A-4VQ100I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1,728 logic cells, 108 Kbits of block RAM, and configured for -4 speed grade in a 100-pin VQFP package. It targets low-cost, high-volume embedded control and interface bridging applications requiring deterministic timing and I/O flexibility.
For engineers reviewing the XC3S50A-4VQ100I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (63 user I/Os), voltage supply (1.2 V core / 3.3 V I/O), configuration mode support (Master Serial, Slave Serial, JTAG), and industrial temperature range (-40°C to +100°C).
Technical Context
The XC3S50A-4VQ100I implements a fully static, SRAM-based architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It supports multi-voltage I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.
Configuration is performed via external PROM or processor-controlled serial interface, with JTAG boundary-scan support for testing. The device lacks integrated transceivers or hard IP cores-its role is programmable logic implementation only, not protocol acceleration or analog processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 CLBs - determines maximum combinational/sequential logic capacity for custom state machines or data paths |
| Block RAM | 108 Kbits - supports on-chip FIFOs, buffers, or small lookup tables without external memory |
| User I/O Pins | 63 - enables direct connection to microcontrollers, sensors, or display interfaces with flexible voltage assignment per bank |
| Core Voltage | 1.2 V ± 3% - requires precision low-dropout regulator; impacts dynamic power and thermal design |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for internal logic (TPD = 3.2 ns max) |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Configuration Mode | Master Serial, Slave Serial, JTAG - defines boot source and debug accessibility during development and field update |
Pinout & Package
VQ100 (100-pin Very Thin Quad Flat Pack) with 0.5 mm pitch, 14 × 14 mm body size, and exposed pad for thermal relief. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered and decoupled locally; powers CLBs and interconnect |
| VCCO_0 | I/O bank 0 power | Configurable voltage (1.2–3.3 V); sets output swing and input threshold for pins in Bank 0 |
| PROGRAM_B | Active-low configuration initiator | Pulling low resets configuration logic and clears SRAM contents |
| DONE | Configuration status indicator | Drives high when bitstream loading completes successfully and device enters user mode |
| TCK/TMS/TDI/TDO | JTAG test access port | Enables IEEE 1149.1 boundary-scan testing and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, 90° phase shift, and frequency multiplication/division without external PLL components |
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, HSTL, and SSTL standards across independent I/O banks for mixed-voltage system interfacing |
| Multi-Boot Configuration | Allows dual-bitstream storage in external PROM and runtime selection via GPIO, enabling field-upgradable firmware |
| ISE Design Suite Support | Full integration with Xilinx ISE 14.7 for synthesis, place-and-route, and timing analysis-no Vivado compatibility |
| Boundary-Scan Testing | IEEE 1149.1 compliance enables PCB-level fault detection and interconnect verification pre- and post-configuration |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing ASICs in programmable logic controllers to handle discrete sensor inputs and relay outputs across multiple voltage domains. IC Role / Device Role / Timing Role: Configurable glue logic and timing controller managing 24 V DC inputs, 12 V relay drivers, and RS-485 communication handshaking. Use Value: Enables field reconfiguration of I/O mapping and timing without hardware change; 63 user I/Os support expansion up to 48 channels. | Use Scenario: Bridging ISA or PCI bus peripherals to modern microcontroller buses in medical diagnostic equipment upgrades. IC Role / Device Role / Timing Role: Protocol translator and address decoder synchronizing legacy 8/16-bit parallel bus cycles with ARM Cortex-M AHB/APB timing. Use Value: Eliminates custom ASIC redesign; DCM ensures precise setup/hold timing for asynchronous bus handshakes. |
| Automotive Body Control Unit | Test Equipment Pattern Generator |
Use Scenario: Centralized lighting and window control module operating in under-hood junction boxes with extended temperature exposure. IC Role / Device Role / Timing Role: Real-time PWM generator and CAN message filter (via soft-core implementation) coordinating LED dimming and motor actuation sequences. Use Value: Industrial temp rating (-40°C to +100°C) avoids derating; 1.2 V core reduces power dissipation in thermally constrained enclosures. | Use Scenario: Generating synchronized digital stimulus waveforms for IC validation labs using arbitrary pattern memory and variable clock rates. IC Role / Device Role / Timing Role: High-speed pattern sequencer with on-chip RAM storing 1,024 vectors and DCM-derived clocks up to 200 MHz. Use Value: Block RAM and deterministic routing enable sub-nanosecond edge placement accuracy; JTAG allows real-time waveform injection and capture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4VQ100I | Higher logic density (2,176 CLBs), same package and speed grade | Supports larger state machines or additional peripheral interfaces without board redesign | Choose when design requires >1,728 logic cells but must retain identical footprint and thermal profile |
| XC3S50-4VQ100C | Same logic resources, commercial temp range (0°C to +70°C), non-industrial qualification | Limited to office or lab environments; not rated for sustained operation above 70°C | Choose only for cost-sensitive prototyping where extended temperature is not required |
Compared with XC3S50A-4VQ100I, the XC3S100A-4VQ100I offers headroom for future feature expansion within the same PCB layout, while the XC3S50-4VQ100C sacrifices industrial reliability for lower unit cost-neither is pin-compatible with newer Spartan-6 or Artix-7 families.
Availability
XC3S50A-4VQ100I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and automotive body electronics requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S50A-4VQ100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan product lines for industrial and aerospace continuity. Xilinx pioneered FPGA architecture and toolchain integration before the acquisition.
The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reliable programmable logic without transceivers or hard processors-targeting control, interface, and bridging roles in embedded systems.
FAQ
What is the maximum operating frequency supported by the XC3S50A-4VQ100I?
The XC3S50A-4VQ100I is rated for a -4 speed grade, guaranteeing internal logic timing closure up to 333 MHz. Actual achievable frequency depends on design complexity, routing congestion, and clock domain constraints. DCM outputs can generate clocks up to 320 MHz with jitter specifications defined in DS312.
Does the XC3S50A-4VQ100I support JTAG programming and debugging?
Yes, the XC3S50A-4VQ100I includes full IEEE 1149.1 JTAG support via TCK, TMS, TDI, and TDO pins. This enables boundary-scan testing, in-system programming, and configuration verification without requiring external configuration PROM during development.
Can the XC3S50A-4VQ100I operate with mixed I/O voltages on different banks?
Yes, the XC3S50A-4VQ100I supports independent voltage assignment per I/O bank (VCCO). Each bank can be set to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling direct interfacing with diverse peripherals such as 3.3 V sensors and 1.8 V FPGAs or microcontrollers.
Is the XC3S50A-4VQ100I compatible with Xilinx ISE 14.7 software?
Yes, the XC3S50A-4VQ100I is fully supported in Xilinx ISE Design Suite 14.7-the final and only officially supported toolchain. It is not compatible with Vivado, which targets 7-series and newer devices.
What is the configuration memory requirement for the XC3S50A-4VQ100I?
The XC3S50A-4VQ100I requires a 1.1 Mbit external serial PROM (e.g., XCF02S) for Master Serial configuration. Bitstream size is approximately 1.05 Mbits; configuration time is ~100 ms at 33 MHz CCLK, as specified in DS312 Table 13.
XC3S50A-4VQ100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 68
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S50A-4VQ100I FAQ
1.How can I place an order for XC3S50A-4VQ100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4VQ100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-4VQ100I reliable?
The price and inventory of XC3S50A-4VQ100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4VQ100I is usually 5 days.
3.What payment methods are accepted for XC3S50A-4VQ100I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-4VQ100I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-4VQ100I?
XC3S50A-4VQ100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-4VQ100I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-4VQ100I?
For technical support, including XC3S50A-4VQ100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4VQ100I requirements.
6.How does Aetrix verify that XC3S50A-4VQ100I is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4VQ100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4VQ100I meets industry standards.
7.What is the process for return or replacement of XC3S50A-4VQ100I?
All XC3S50A-4VQ100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4VQ100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4VQ100I part is unused and in its original packaging.
Return procedure for XC3S50A-4VQ100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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