AMD XC3S50A-4VQG100I
- Part No.:
- XC3S50A-4VQG100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S50A-4VQG100I.pdf
- Description:
- IC FPGA 68 I/O 100VQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S50A-4VQG100I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 50,000 system gates, 1,728 logic cells, 108 Kbits of block RAM, and operation at -4 speed grade with industrial temperature range (-40°C to +100°C). It is used in low-cost embedded control, motor drive logic, and digital power management systems.
For engineers reviewing the XC3S50A-4VQG100I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (66 user I/Os), VCCINT/VCCAUX supply requirements (1.2 V / 3.3 V), configuration interface support (JTAG, Master Serial), and package thermal profile (VQG100).
Technical Context
The XC3S50A-4VQG100I implements a fully reconfigurable logic fabric based on SRAM-based Look-Up Tables (LUTs) and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports distributed RAM and shift register functionality within CLBs.
Configuration is performed via JTAG boundary-scan or Master Serial mode using external PROM or processor. The device supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity control state machines |
| System Gates | 50,000 - indicates relative logic density versus ASIC gate equivalents |
| Block RAM | 108 Kbits - supports FIFOs, buffers, and small lookup tables without external memory |
| User I/O Pins | 66 - enables direct interfacing with microcontrollers, ADCs, and peripheral ICs |
| VCCINT / VCCAUX | 1.2 V / 3.3 V - requires dual-regulated supplies; VCCAUX powers I/O banks and configuration circuitry |
| Speed Grade | -4 - guarantees timing performance up to 425 MHz internal clock frequency under worst-case conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial environments with extended thermal cycling |
Pinout & Package
VQG100 is a 100-pin Very Thin Quad Flatpack (VQFP) package with 0.5 mm pitch, 14 × 14 mm body size, and exposed pad for thermal dissipation. It supports lead-free (Pb-free) assembly and meets JEDEC standard MO-220.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for logic fabric and CLBs |
| H2 | VCCAUX | 3.3 V auxiliary supply for configuration, clocking, and I/O banks |
| K1 | GND | Ground reference for core and I/O domains |
| P1 | TCK | JTAG test clock input for boundary-scan and programming |
| P2 | TMS | JTAG test mode select controlling TAP controller state transitions |
| R1 | TDO | JTAG test data output for serial readback and verification |
| R2 | TDI | JTAG test data input for instruction and configuration data loading |
| A1–A10, B1–B10, etc. | IO_Lxx | Configurable bidirectional I/O pins grouped into banks with independent VCCO and reference voltage |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 multipliers | Twelve hardwired multipliers enable efficient DSP filtering and motor control algorithms without LUT resource overhead |
| SelectIO technology | Per-bank I/O standards support mixed-voltage interfaces (LVCMOS, LVTTL, PCI) with programmable drive/slew settings |
| Embedded block RAM | 108 Kbits distributed across eight 18-Kbit blocks allow dual-port access for simultaneous read/write operations |
| Four global clock networks | Low-skew routing resources distribute clocks to all logic regions, supporting synchronous design with <150 ps skew |
| Master Serial configuration | Supports single-bit serial PROM loading for simplified boot-up without external controller involvement |
Applications
| Industrial Motor Control | Digital Power Supply Monitoring |
|---|---|
Use Scenario: Real-time PWM generation and current-loop feedback processing in brushless DC motor drives. IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop control state machine and high-speed I/O interfacing with gate drivers and current sensors. Use Value: Enables deterministic sub-microsecond response latency and flexible algorithm updates without hardware redesign. | Use Scenario: Voltage/current monitoring, fault detection, and adaptive compensation in isolated DC-DC converters. IC Role / Device Role / Timing Role: FPGA acts as intelligent power management unit coordinating ADC sampling, digital PID computation, and PMBus communication. Use Value: Integrates analog interface, control logic, and serial protocol handling in one device, reducing BOM count and PCB area. |
| Programmable Logic Controller (PLC) I/O Module | Legacy Interface Bridge |
Use Scenario: Digital I/O expansion and protocol translation in modular PLC backplanes. IC Role / Device Role / Timing Role: FPGA implements custom parallel-to-serial conversion, isolation interface timing, and watchdog logic for field-side I/O conditioning. Use Value: Supports hot-swappable module design with configurable debounce, edge detection, and status reporting per channel. | Use Scenario: Bridging RS-232/RS-485 peripherals to modern microcontroller buses in legacy industrial equipment upgrades. IC Role / Device Role / Timing Role: Protocol converter and level shifter with programmable timing alignment for asynchronous serial handshaking. Use Value: Eliminates need for discrete logic glue and allows firmware-driven adaptation to varying baud rates and framing formats. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-4VQG100I | Higher logic density (2,176 CLBs, 100K gates), same package and speed grade | Better suited for designs requiring additional state machines or larger FIFOs without changing PCB layout | Select when future scalability or added peripheral integration is anticipated |
| XC3S50-4VQG100C | Same logic resources but commercial temperature range (0°C to +70°C) and non-Pb-free packaging | Limited to non-industrial ambient environments; lacks extended thermal qualification | Choose only for cost-sensitive consumer or lab-grade prototypes where industrial reliability is not required |
Compared with XC3S50A-4VQG100I, the XC3S100A-4VQG100I offers headroom for feature expansion while maintaining pin compatibility, whereas the XC3S50-4VQG100C sacrifices operating temperature range and RoHS compliance for lower acquisition cost.
Availability
XC3S50A-4VQG100I is available at Aetrix Electronics and suitable for industrial motor control, digital power management, and programmable logic controller (PLC) I/O modules requiring stable component supply across extended product lifecycles.
Supply support for XC3S50A-4VQG100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA family as part of its adaptive computing portfolio.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with industrial temperature tolerance and low-power operation.
FAQ
What is the maximum operating frequency of the XC3S50A-4VQG100I?
The XC3S50A-4VQG100I is rated for a maximum internal clock frequency of 425 MHz under worst-case industrial temperature and voltage conditions, as defined by its -4 speed grade. This applies to logic paths meeting timing closure with proper constraints; actual system-level clock rates depend on design implementation and I/O interface speeds.
Does the XC3S50A-4VQG100I support JTAG programming?
Yes, the XC3S50A-4VQG100I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. Pins TCK, TMS, TDI, and TDO are dedicated for this interface and are located on the VQG100 package's corner pins for reliable signal integrity during configuration.
What power supply voltages does the XC3S50A-4VQG100I require?
The XC3S50A-4VQG100I requires two separate supply voltages: 1.2 V ±3% for VCCINT (core logic) and 3.3 V ±5% for VCCAUX (I/O banks and configuration circuitry). Decoupling capacitors must be placed near respective power pins to ensure stable operation across temperature and load transients.
Can the XC3S50A-4VQG100I be used in place of the XC3S50-4VQG100C?
The XC3S50A-4VQG100I is functionally compatible with the XC3S50-4VQG100C but adds industrial temperature rating (-40°C to +100°C) and Pb-free packaging. Pinout and logic resources are identical, making it a drop-in replacement where extended environmental qualification is needed.
How many block RAMs does the XC3S50A-4VQG100I contain?
The XC3S50A-4VQG100I contains eight 18-Kbit block RAMs, totaling 108 Kbits of dedicated memory. Each block supports synchronous read/write, dual-port operation, and can be configured as 18K × 1, 9K × 2, or other combinations depending on address depth and width requirements.
XC3S50A-4VQG100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 68
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S50A-4VQG100I FAQ
1.How can I place an order for XC3S50A-4VQG100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-4VQG100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC3S50A-4VQG100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-4VQG100I is usually 5 days.
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5.How can I obtain technical support or documentation for XC3S50A-4VQG100I?
For technical support, including XC3S50A-4VQG100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-4VQG100I requirements.
6.How does Aetrix verify that XC3S50A-4VQG100I is sourced from the original manufacturer or authorized distributors?
All XC3S50A-4VQG100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-4VQG100I meets industry standards.
7.What is the process for return or replacement of XC3S50A-4VQG100I?
All XC3S50A-4VQG100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-4VQG100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-4VQG100I part is unused and in its original packaging.
Return procedure for XC3S50A-4VQG100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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