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AMD XC3S50A-5FTG256C
- Part No.:
- XC3S50A-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50A-5FTG256C.pdf
- Description:
- IC FPGA 144 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,547
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Product details
Overview
XC3S50A-5FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1,728 logic cells, 120 I/O pins, and a 5 ns input/output delay. It integrates up to 180 Kbits of block RAM and supports LVCMOS25/LVCMOS33 I/O standards, used in industrial control logic and low-cost embedded interface bridging.
For engineers reviewing the XC3S50A-5FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, distributed vs. block RAM allocation, global clock routing capability, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S50A-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and programmable interconnect. It features four global clock networks, digital clock managers (DCMs) for frequency synthesis and phase alignment, and support for SelectIO standards including LVTTL, LVCMOS, PCI, and SSTL.
Configuration is performed via Master Serial mode using an external PROM or through JTAG IEEE 1149.1 boundary-scan interface. The device uses 1.2 V core voltage and supports configuration bitstream encryption for IP protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity state machines and data path control. |
| System Gates | 50,000 - indicates total equivalent gate count for logic density estimation in ASIC migration analysis. |
| I/O Pins | 120 - supports multi-protocol interface bridging with bank-wise voltage isolation and slew rate control. |
| Block RAM | 180 Kbits - enables dual-port FIFOs, coefficient storage, or small frame buffers without external memory. |
| DCMs | 2 - delivers jitter-reduced clock outputs, 90° phase shifts, and frequency multiplication/division for synchronous design timing closure. |
| Core Voltage | 1.2 V - defines power delivery requirements and impacts dynamic power consumption in high-toggle applications. |
Pinout & Package
XC3S50A-5FTG256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm pitch, 17 × 17 mm body size, and exposed thermal pad. Pin assignment follows Xilinx Spartan-3A family standard layout with dedicated configuration, clock, JTAG, and I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - sets output voltage level and drive strength for pins in Bank 0. |
| D2 | CLK0 | Primary global clock input - feeds DCM0 and global routing network for synchronous domain timing. |
| T12 | TMS | JTAG test mode select - controls IEEE 1149.1 state machine during boundary-scan programming and debug. |
| R13 | TCK | JTAG test clock - synchronizes TMS/TDI/TDO signals during configuration and verification. |
| P14 | INIT_B | Configuration status indicator - asserted low during bitstream loading and remains high when configuration completes successfully. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Two integrated DCMs provide deterministic clock skew control, duty-cycle correction, and frequency synthesis without external PLL components. |
| SelectIO Technology | Per-bank I/O voltage support (1.2 V–3.3 V) enables mixed-voltage interfacing with legacy and modern peripherals. |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling efficient implementation of arithmetic, counters, and pipeline stages. |
| Boundary-Scan Support | Full IEEE 1149.1 compliance allows in-system programming, interconnect testing, and post-assembly validation without physical probe access. |
Applications
| Industrial PLC I/O Expansion | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Adding isolated digital I/O and protocol translation (e.g., RS-485 to SPI) to compact PLC modules. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for signal conditioning, watchdog supervision, and real-time response to fieldbus events. Use Value: Enables deterministic sub-10 µs I/O update latency and supports dual-voltage I/O banks for direct connection to 5 V sensors and 3.3 V microcontrollers. | Use Scenario: Bridging ISO 9141-2/K-Line and UART-based diagnostic tools in vehicle service equipment. IC Role / Device Role / Timing Role: XC3S50A-5FTG256C acts as a protocol-aware glue logic layer with precise timing control over K-Line edge transitions. Use Value: Delivers accurate 10.4 kbps K-Line timing with ±1% tolerance and supports concurrent UART debug logging via separate I/O bank. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating analog sensor data (via external ADCs) and managing USB HID communication in portable diagnostic devices. IC Role / Device Role / Timing Role: XC3S50A-5FTG256C serves as a real-time data concentrator with on-chip FIFO buffering and USB descriptor handling logic. Use Value: Uses internal block RAM for 2 KB sample buffering and supports 12 Mbps full-speed USB signaling through GPIO-timed bit-banging or soft PHY implementation. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: XC3S50A-5FTG256C implements high-precision pattern sequencers with deterministic setup/hold timing across 120 pins. Use Value: Achieves <5 ns channel-to-channel skew using dedicated global clock routing and per-pin output delay calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-5FTG256C | Higher logic density (2,176 CLBs, 100K gates), same package and pinout. | Supports larger state machines and deeper FIFOs; requires higher static power and more configuration memory. | Choose when additional logic resources are needed without PCB redesign. |
| XC3S50-4PQ208C | Same logic capacity but PQ208 package (208-pin PQFP), no thermal pad, lower I/O count (114 pins). | Limited I/O routing flexibility and reduced thermal performance; lacks fine-pitch BGA manufacturability advantages. | Consider only for legacy board reuse where FTBGA assembly is unavailable. |
Compared with XC3S50A-5FTG256C, the XC3S100A-5FTG256C offers scalable logic headroom within identical footprint and thermal profile, while the XC3S50-4PQ208C trades I/O scalability and thermal efficiency for legacy packaging compatibility-making the original part optimal for new designs balancing cost, density, and manufacturability.
Availability
XC3S50A-5FTG256C is available at Aetrix Electronics and suitable for industrial control, automotive diagnostics, and medical sensor hub applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3S50A-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA product lines for cost-sensitive, high-volume embedded applications.
The Spartan-3A family was designed for non-volatile, low-power logic replacement in industrial interfaces, communications gateways, and instrumentation-emphasizing fast configuration, predictable timing, and broad I/O voltage support.
FAQ
What is the configuration method supported by XC3S50A-5FTG256C?
XC3S50A-5FTG256C supports Master Serial configuration via external PROM and IEEE 1149.1 JTAG boundary-scan. The device boots from external serial configuration memory or accepts bitstream through TDI/TDO pins. Configuration occurs at power-up or upon PROG_B assertion, and XC3S50A-5FTG256C validates CRC checksum before releasing INIT_B to confirm successful load.
Does XC3S50A-5FTG256C support differential I/O standards like LVDS?
No, XC3S50A-5FTG256C does not support true LVDS or other differential I/O standards. It supports single-ended standards only-including LVCMOS, LVTTL, PCI, and SSTL-within its I/O banks. Differential signaling requires external termination or discrete differential receivers, as the XC3S50A-5FTG256C lacks internal differential buffer circuitry.
What is the maximum operating frequency of the DCMs in XC3S50A-5FTG256C?
The Digital Clock Managers (DCMs) in XC3S50A-5FTG256C support input frequencies from 1.5 MHz to 200 MHz and generate output frequencies up to 320 MHz. Each DCM provides frequency synthesis, phase shifting, and duty-cycle correction, with guaranteed jitter performance under specified temperature and voltage conditions per the XC3S50A-5FTG256C datasheet timing tables.
Can XC3S50A-5FTG256C be reprogrammed in-system after soldering?
Yes, XC3S50A-5FTG256C supports in-system programming (ISP) via its JTAG interface. Using standard IEEE 1149.1 tools, the configuration bitstream can be rewritten without removing the device from the PCB. This capability applies to both initial programming and field updates, and XC3S50A-5FTG256C retains full boundary-scan visibility throughout the process.
Is XC3S50A-5FTG256C RoHS compliant and lead-free?
Yes, XC3S50A-5FTG256C is manufactured as a lead-free, RoHS-compliant device. The FTG256 package uses matte tin finish on all I/O balls, meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), and complies with EU Directive 2011/65/EU. Full compliance documentation is available in the official AMD/Xilinx product change notices for the Spartan-3A family.
XC3S50A-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 144
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50A-5FTG256C FAQ
1.How can I place an order for XC3S50A-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-5FTG256C reliable?
The price and inventory of XC3S50A-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S50A-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-5FTG256C?
XC3S50A-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-5FTG256C?
For technical support, including XC3S50A-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-5FTG256C requirements.
6.How does Aetrix verify that XC3S50A-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S50A-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S50A-5FTG256C?
All XC3S50A-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S50A-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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