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AMD XC3S50A-5TQG144C
- Part No.:
- XC3S50A-5TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50A-5TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,685
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Product details
Overview
XC3S50A-5TQG144C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 144-pin TQFP package, -5 speed grade, and commercial temperature range (0°C to 85°C). It integrates 1728 logic cells, 120 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S50A-5TQG144C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage compatibility, internal RAM capacity, and supported configuration modes (JTAG, Master Serial, Slave SelectMAP).
Technical Context
The XC3S50A-5TQG144C implements a fully static, SRAM-based architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It supports multi-voltage I/O banks (1.2V, 1.5V, 1.8V, 2.5V, 3.3V) and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.
Configuration is performed via external PROM, JTAG boundary-scan, or microprocessor interface. The device requires external configuration memory and uses 1.2V core voltage with separate 2.5V or 3.3V I/O supply depending on bank settings.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic resources for state machines and data path implementation |
| System Gates | 50,000 - indicates total equivalent ASIC gate count for logic capacity estimation |
| Block RAM | 120 Kbits - enables FIFOs, buffers, and small lookup tables without external memory |
| Max I/O Pins | 108 - supports parallel bus interfaces, sensor arrays, and multi-protocol connectivity |
| DCM Units | 2 - delivers clock doubling, duty cycle correction, and phase shifting for timing-critical subsystems |
| Speed Grade | -5 - guarantees timing closure up to 520 MHz for internal logic paths under worst-case conditions |
Pinout & Package
XC3S50A-5TQG144C is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad. Package meets JEDEC MO-153AC standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V ±3% required for internal logic and CLB operation |
| VCCO_0 | I/O bank 0 power | Configurable 1.2–3.3 V supply for pins in Bank 0 |
| PROGRAM_B | Active-low configuration initiator | Pulling low forces reconfiguration from external source |
| DONE | Configuration status indicator | Open-drain output that goes high when configuration completes successfully |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant programming and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O banks | Supports mixed-voltage interfacing (e.g., 3.3V MCU ↔ 1.8V sensor) without level shifters |
| Digital Clock Manager (DCM) | Provides jitter-reduced clock outputs and dynamic phase adjustment for synchronous design |
| Embedded block RAM | 120 Kbits distributed across eight 16K-bit blocks for dual-port memory access |
| Configurable I/O standards | LVCMOS, LVTTL, PCI, and SSTL-2 support enables direct connection to diverse peripherals |
Applications
| Industrial PLC I/O Module | Medical Sensor Interface Hub |
|---|---|
Use Scenario: Real-time acquisition and preprocessing of analog/digital sensor signals in modular control cabinets. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and digital filter engine, synchronizing ADC sampling clocks via DCM outputs. Use Value: Reduces host processor load by offloading bit-level signal conditioning and CRC generation using embedded logic. | Use Scenario: Aggregating data from multiple patient monitoring sensors (ECG, SpO₂, NIBP) before transmission to central display unit. IC Role / Device Role / Timing Role: Configurable I/O banks interface disparate sensor buses (I²C, SPI, parallel); DCM aligns timestamps across channels. Use Value: Enables deterministic latency <1 µs between channel sampling triggers using internal clock routing. |
| Automotive Body Control Unit | Test Equipment Pattern Generator |
Use Scenario: Managing door lock actuators, window motors, and lighting sequences in entry-level vehicle platforms. IC Role / Device Role / Timing Role: Implements safety-critical state machines with watchdog timers and failsafe I/O control logic. Use Value: Meets ISO 26262 ASIL-B requirements through dual-lockstep configuration and CRC-protected bitstream loading. | Use Scenario: Generating high-speed digital stimulus patterns for IC validation and board-level functional testing. IC Role / Device Role / Timing Role: Generates synchronized parallel vectors at up to 100 MHz using distributed RAM and fast carry chains. Use Value: Achieves sub-nanosecond edge placement accuracy via DCM-controlled clock domains and output register pipelining. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-5TQG144C | Higher logic density (2,176 CLBs), same package and speed grade | Better suited for designs requiring additional state machine depth or wider datapaths | Select when future scalability or added peripheral integration is anticipated |
| XC6SLX9-2TQG144C | Based on Spartan-6 architecture; 9,152 logic cells, lower static power, enhanced DSP slices | Requires updated toolchain (Vivado vs. ISE) and different configuration flow | Choose for new designs needing higher performance per watt or integrated PCIe endpoints |
Compared with XC3S50A-5TQG144C, XC3S100A-5TQG144C offers incremental logic headroom within identical footprint and tooling, while XC6SLX9-2TQG144C represents a generational upgrade with architectural improvements but mandates migration to newer design tools and constraints handling.
Availability
XC3S50A-5TQG144C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive body electronics requiring stable component supply over extended production lifecycles.
Supply support for XC3S50A-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3A product line was designed for non-volatile, low-power programmable logic in space-constrained systems where predictable timing and mature tooling are critical.
FAQ
What configuration methods does XC3S50A-5TQG144C support?
XC3S50A-5TQG144C supports Master Serial (via external PROM), Slave SelectMAP (parallel loading from microcontroller), and JTAG boundary-scan programming. Configuration bitstream is loaded into on-chip SRAM each power-up, requiring persistent external storage. The XC3S50A-5TQG144C does not include on-die flash memory.
Does XC3S50A-5TQG144C require external voltage regulators?
Yes - XC3S50A-5TQG144C requires two independent supplies: 1.2 V ±3% for VCCINT and a selectable 1.2–3.3 V supply for each I/O bank (VCCO). Decoupling capacitors must be placed per Xilinx UG331 guidelines. The XC3S50A-5TQG144C has no internal regulator.
Can XC3S50A-5TQG144C operate in industrial temperature range?
No - XC3S50A-5TQG144C is rated only for commercial temperature range (0°C to +85°C). For industrial operation (-40°C to +100°C), the XC3S50A-5TQG144I variant must be used. The XC3S50A-5TQG144C part number explicitly denotes commercial-grade qualification.
What software tools are required to develop for XC3S50A-5TQG144C?
Xilinx ISE Design Suite 14.7 is the final supported version for XC3S50A-5TQG144C. Synthesis, place-and-route, and bitstream generation must use ISE - Vivado does not support Spartan-3A devices. The XC3S50A-5TQG144C bitstream format is incompatible with newer toolchains.
Is XC3S50A-5TQG144C RoHS compliant?
Yes - XC3S50A-5TQG144C is manufactured in accordance with EU RoHS Directive 2011/65/EU and is lead-free, halogen-free, and compliant with IPC-1752 material declaration requirements. The XC3S50A-5TQG144C packaging uses matte tin finish on all leads.
XC3S50A-5TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50A-5TQG144C FAQ
1.How can I place an order for XC3S50A-5TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-5TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50A-5TQG144C reliable?
The price and inventory of XC3S50A-5TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-5TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S50A-5TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50A-5TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50A-5TQG144C?
XC3S50A-5TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50A-5TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50A-5TQG144C?
For technical support, including XC3S50A-5TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-5TQG144C requirements.
6.How does Aetrix verify that XC3S50A-5TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S50A-5TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-5TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S50A-5TQG144C?
All XC3S50A-5TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-5TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-5TQG144C part is unused and in its original packaging.
Return procedure for XC3S50A-5TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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