AMD XC3S50A-5VQG100C
- Part No.:
- XC3S50A-5VQG100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S50A-5VQG100C.pdf
- Description:
- IC FPGA 68 I/O 100VQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S50A-5VQG100C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 50,000 system gates, 1,728 logic cells, 108 Kbits of block RAM, and configured in a 100-pin VQFP package with 63 user I/O pins. It operates at 500 MHz system clock speed and supports LVCMOS25/LVCMOS33 I/O standards for industrial control interface applications.
For engineers reviewing the XC3S50A-5VQG100C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded RAM capacity, single-ended I/O voltage support, and commercial temperature grade operation.
Technical Context
The XC3S50A-5VQG100C implements a fully reconfigurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry chains for arithmetic functions. It integrates twelve 18×18 multipliers and supports Digital Clock Manager (DCM) blocks for clock synthesis, phase shifting, and duty cycle correction.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with full IEEE 1149.1 compliance. The device supports SelectIO technology with programmable drive strength, slew rate control, and input differential termination for signal integrity in mixed-voltage systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic resources for medium-complexity digital control and glue logic |
| System Gates | 50,000 - indicates total equivalent gate count for logic synthesis and resource estimation |
| Block RAM | 108 Kbits - enables FIFOs, buffers, and small lookup tables without external memory |
| User I/O Pins | 63 - supports parallel bus interfaces, sensor arrays, and discrete control signals |
| I/O Standards | LVCMOS25/LVCMOS33 - allows direct interfacing with 2.5 V and 3.3 V microcontrollers and peripherals |
| DCM Blocks | 4 - delivers jitter-reduced clocks, frequency multiplication/division, and phase alignment |
| Operating Temp | 0°C to +70°C - qualified for commercial-grade embedded systems and test equipment |
Pinout & Package
VQFP (Very Thin Quad Flat Package), 100-lead, 0.5 mm pitch, body size 14 mm × 14 mm, exposed pad not present, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for stable 2.5/3.3 V output signaling |
| P2 | IO_L0N_0 | Differential pair negative input - used with P3 for LVDS or RSDS receiver inputs |
| P3 | IO_L0P_0 | Differential pair positive input - paired with P2 for high-speed serial data acquisition |
| P4 | GND | Ground reference - connects to PCB ground plane to minimize noise coupling |
| P5 | IO_L1N_0 | Secondary differential input - supports dual-channel LVDS input in same I/O bank |
| P6 | IO_L1P_0 | Secondary differential output - complements P5 for stereo or dual-signal capture |
| P7 | VCCINT | Core voltage supply - requires clean 1.2 V regulated source with tight tolerance |
| P8 | TCK | JTAG test clock - drives boundary-scan chain during programming and debug |
| P9 | TMS | JTAG test mode select - controls state transitions of TAP controller |
| P10 | TDO | JTAG test data out - outputs scan chain data during readback operations |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-LUTs and associated flip-flops - enables efficient implementation of state machines and pipelined datapaths |
| Digital Clock Managers (DCMs) | Four independent DCMs - allow simultaneous clock domain translation, skew compensation, and jitter filtering |
| SelectIO Technology | Programmable drive strength (2–24 mA) and slew rate - reduces EMI and improves signal integrity across varying trace lengths |
| Embedded Multipliers | Twelve 18×18 signed multipliers - accelerate DSP functions like FIR filtering and motor control algorithms |
| Boundary-Scan Support | Full IEEE 1149.1 compliance - enables in-circuit testing and FPGA configuration verification without physical probes |
Applications
| Industrial PLC I/O Module | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and host controllers. IC Role / Device Role / Timing Role: Configurable logic fabric handles custom timing sequences, level-shifting, and parallel-to-serial conversion. Use Value: 63 user I/O pins and LVCMOS25/33 support enable direct connection to diverse sensor outputs and legacy industrial buses. | Use Scenario: High-speed pattern generation and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: FPGA acts as deterministic timing engine and vector sequencer synchronized to system master clock. Use Value: Four DCMs provide sub-nanosecond clock alignment across multiple test channels, improving measurement repeatability. |
| Medical Imaging Front-End | Communications Baseband Processing |
Use Scenario: Acquisition and preprocessing of analog-to-digital converter streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Implements real-time beamforming delay lines and channel gain calibration logic. Use Value: 108 Kbits of block RAM stores per-channel delay coefficients; 18×18 multipliers execute gain compensation in pipeline stages. | Use Scenario: Modem subsystem for low-latency packet framing, CRC insertion, and burst-mode demodulation. IC Role / Device Role / Timing Role: Performs baseband symbol mapping, interleaving, and soft-decision decoding acceleration. Use Value: Reconfigurable logic accommodates multiple modulation schemes (QPSK, 16-QAM); 500 MHz clock capability sustains >20 Mbps throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100A-5VQG100C | Higher logic density (2,176 CLBs, 100K gates), same package and I/O count | Better suited for designs requiring additional state machine depth or larger FIFOs | Select when future scalability or increased algorithm complexity is anticipated |
| XC3S200A-5VQG100C | 2,720 CLBs, 200K gates, identical pinout and I/O voltage support | Enables more complex protocol stacks and concurrent peripheral interfaces | Choose for applications needing higher gate count without changing PCB layout |
Compared with XC3S50A-5VQG100C, the XC3S100A-5VQG100C and XC3S200A-5VQG100C offer incremental logic capacity while preserving pin compatibility, I/O voltage flexibility, and DCM functionality-making them viable upgrades for design expansion without board redesign.
Availability
XC3S50A-5VQG100C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and medical imaging systems requiring stable component supply and long-term manufacturability.
Supply support for XC3S50A-5VQG100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3A family, including XC3S50A-5VQG100C, was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with integrated clock management and I/O flexibility.
FAQ
What is the core voltage requirement for XC3S50A-5VQG100C?
The XC3S50A-5VQG100C requires a tightly regulated 1.2 V ±3% core supply (VCCINT) delivered to Pin P7. This voltage powers the internal logic fabric and CLBs. Deviation beyond tolerance risks timing violations or configuration loss. Decoupling capacitors must be placed within 10 mm of the pin per Xilinx UG331 guidelines.
Does XC3S50A-5VQG100C support JTAG programming?
Yes, XC3S50A-5VQG100C supports IEEE 1149.1 JTAG boundary-scan programming via Pins P8 (TCK), P9 (TMS), P10 (TDO), and P11 (TDI). This enables in-system configuration, debugging, and verification without requiring external PROM. JTAG mode is selected by pulling PROGRAM_B low during power-up.
Can XC3S50A-5VQG100C operate with 2.5 V I/O signals?
Yes, XC3S50A-5VQG100C supports LVCMOS25 I/O standard in designated banks. Each I/O bank has its own VCCO supply (e.g., Pin P1 for Bank 0), which must be set to 2.5 V. Input thresholds and output drive levels automatically adapt to this voltage, enabling interoperability with 2.5 V microcontrollers and ADCs.
How many Digital Clock Managers does XC3S50A-5VQG100C include?
XC3S50A-5VQG100C includes four Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, and duty cycle correction. They operate independently and can drive separate clock domains, supporting multi-clock system architectures common in industrial control and communications.
Is XC3S50A-5VQG100C qualified for automotive applications?
No, XC3S50A-5VQG100C is rated for commercial temperature range (0°C to +70°C) and is not AEC-Q100 qualified. It is intended for industrial, medical, and test equipment use. For automotive applications, AMD/Xilinx offers Spartan-3A Automotive (XA) variants with extended temperature range and qualification documentation.
XC3S50A-5VQG100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 68
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S50A-5VQG100C FAQ
1.How can I place an order for XC3S50A-5VQG100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50A-5VQG100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC3S50A-5VQG100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50A-5VQG100C is usually 5 days.
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5.How can I obtain technical support or documentation for XC3S50A-5VQG100C?
For technical support, including XC3S50A-5VQG100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50A-5VQG100C requirements.
6.How does Aetrix verify that XC3S50A-5VQG100C is sourced from the original manufacturer or authorized distributors?
All XC3S50A-5VQG100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50A-5VQG100C meets industry standards.
7.What is the process for return or replacement of XC3S50A-5VQG100C?
All XC3S50A-5VQG100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50A-5VQG100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50A-5VQG100C part is unused and in its original packaging.
Return procedure for XC3S50A-5VQG100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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