AMD XC3S50AN-4FT256C

Overview

XC3S50AN-4FT256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 50,000 system gates, 176 logic cells, and embedded flash configuration memory. It operates at -4 speed grade (1.2 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 256-pin FTBGA. It targets low-cost, high-reliability embedded control and interface bridging applications.

For engineers reviewing the XC3S50AN-4FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include its integrated flash-based single-chip configuration, I/O voltage flexibility (1.2 V to 3.3 V), and industrial temperature range support.

Technical Context

The XC3S50AN-4FT256C integrates on-chip flash memory for instant-on operation and eliminates external configuration PROMs. Its architecture includes 176 configurable logic blocks (CLBs), 128 Kbits of block RAM, and up to 173 user I/Os with programmable slew rate and drive strength.

It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, and features internal digital clock managers (DCMs) for clock synthesis, phase shifting, and frequency multiplication - all without requiring external PLL components.

Key Specifications

Pinout & Package

Package: 256-pin Fine-Pitch Thin BGA (FTBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S50AN-4FT256C, the XC3S100AN-4FT256C offers headroom for future feature expansion within identical footprint and power envelope, while the Lattice XP2-5T144C trades configuration robustness for marginal cost reduction and reduced logic scale.

Availability

XC3S50AN-4FT256C is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, and medical device manufacturing requiring stable component supply across long production lifecycles.

Supply support for XC3S50AN-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered SRAM-based FPGAs with integrated configuration memory solutions.

The Spartan-3AN product line was designed specifically for cost-sensitive, high-reliability embedded systems needing instant-on operation, reduced board area, and elimination of external configuration memory.

FAQ

What is the configuration method used by the XC3S50AN-4FT256C?

The XC3S50AN-4FT256C uses on-chip flash memory for master-mode serial configuration, enabling power-on initialization without external PROMs or controllers. Configuration occurs automatically after power-up or PROGRAM_B assertion, and the XC3S50AN-4FT256C supports in-system programming via JTAG for field updates.

Does the XC3S50AN-4FT256C support JTAG boundary scan testing?

Yes, the XC3S50AN-4FT256C fully complies with IEEE 1149.1 and provides complete boundary-scan capability across all user I/O pins and internal logic. This allows PCB-level interconnect testing, in-circuit debugging, and verification of solder joint integrity without requiring custom test infrastructure.

What clocking resources are available inside the XC3S50AN-4FT256C?

The XC3S50AN-4FT256C contains two Digital Clock Managers (DCMs) that provide clock synthesis, duty-cycle correction, phase shifting, and frequency multiplication/division. Each DCM accepts input clocks up to 250 MHz and supports multiple independent output clocks with programmable delays and jitter suppression.

Can the XC3S50AN-4FT256C operate in extended temperature ranges?

No - the XC3S50AN-4FT256C is rated for industrial temperature range only (0 °C to +85 °C). It is not qualified for extended (-40 °C to +100 °C) or automotive AEC-Q100 temperature grades. Designs requiring wider thermal margins must select alternate Spartan-3A or Spartan-6 derivatives.

How many I/O standards does the XC3S50AN-4FT256C support per bank?

The XC3S50AN-4FT256C supports mixed I/O standards within each bank, including LVCMOS, LVTTL, PCI, and SSTL, provided all signals in a given bank share the same VCCO voltage. Each of the six I/O banks can be independently assigned a VCCO level from 1.2 V to 3.3 V, enabling protocol coexistence on a single device.