My Inquiry
My Account
AMD XC3S50AN-4FT256I
- Part No.:
- XC3S50AN-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50AN-4FT256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,803
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S50AN-4FT256I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 50,000 system gates, embedded Flash configuration memory, and 173 user I/Os in a 256-pin FTBGA package. It operates at -4 speed grade (1.2 V core, industrial temperature range -40°C to +85°C) and targets reconfigurable logic in space-constrained industrial control and communication interface modules.
For engineers reviewing the XC3S50AN-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, single-chip configuration, I/O voltage flexibility (1.2V/1.5V/1.8V/2.5V/3.3V), and industrial-grade thermal reliability.
Technical Context
The XC3S50AN-4FT256I integrates non-volatile Flash memory for instant-on configuration without external PROM, eliminating boot delay and reducing BOM count. Its architecture includes 1,728 logic cells, 12 embedded 18×18 multipliers, and up to 216 Kbits of distributed/block RAM.
It supports SelectIO™ standards across all I/O banks, enabling mixed-voltage interfacing with TTL, LVCMOS, LVTTL, PCI, and SSTL-2. Configuration occurs via JTAG or master serial mode using on-chip oscillator.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity digital control functions |
| System Gates | 50,000 - indicates total equivalent ASIC gate count for logic density estimation |
| User I/Os | 173 - supports high-pin-count peripheral bridging and parallel bus interfacing |
| Embedded RAM | 216 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| Speed Grade | -4 - specifies maximum clock frequency (e.g., 333 MHz for I/O registers, 210 MHz for internal logic) |
| Core Voltage | 1.2 V ±3% - defines power delivery requirement and impacts dynamic power consumption |
| Operating Temp | -40°C to +85°C - qualifies for industrial environment deployment without derating |
Pinout & Package
256-ball Fine-Pitch Thin BGA (FTBGA) package, 1.0 mm ball pitch, 17 mm × 17 mm body size, RoHS-compliant, lead-free solder compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires local decoupling |
| VCCAUX | Auxiliary power supply | 1.2 V or 2.5 V supply for configuration, JTAG, and I/O bank reference |
| VCCO_0 | I/O bank power | Configurable 1.2–3.3 V output driver voltage per bank |
| PROGRAM_B | Configuration reset | Active-low signal initiating FPGA reconfiguration from Flash |
| INIT_B | Configuration status | Open-drain output indicating successful configuration completion |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1 boundary-scan and programming access |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash memory | Enables single-chip, instant-on operation without external configuration PROM or microcontroller boot sequence |
| Multi-voltage I/O banks | Allows simultaneous interfacing to 1.8 V, 2.5 V, and 3.3 V peripherals within one device |
| Embedded 18×18 multipliers | Supports real-time arithmetic operations for motor control PWM generation and basic DSP filtering |
| Full JTAG support | Provides IEEE 1149.1-compliant boundary scan testing and in-system programming capability |
| Industrial temperature rating | Guarantees functional operation across full -40°C to +85°C range without thermal throttling or timing violation |
Applications
| Industrial PLC I/O Module | Serial Protocol Bridge |
|---|---|
Use Scenario: Modular programmable logic controller with isolated analog/digital I/O expansion. IC Role / Device Role / Timing Role: Configurable logic engine handling sensor input sampling, PID loop execution, and fieldbus protocol translation. Use Value: Embedded Flash eliminates boot PROM, reducing component count and startup latency by >100 ms. | Use Scenario: RS-232/RS-485 to SPI/I²C protocol converter in factory automation gateways. IC Role / Device Role / Timing Role: Glue logic and state machine implementing handshaking, framing, and voltage-level translation. Use Value: 173 user I/Os enable concurrent multi-interface support; multi-voltage banks simplify level-shifter elimination. |
| Motor Drive Control Board | Test Equipment Digital Pattern Generator |
Use Scenario: Compact servo drive with position feedback processing and PWM output modulation. IC Role / Device Role / Timing Role: Real-time motion control sequencer generating synchronized 3-phase PWM with dead-time insertion. Use Value: 12 embedded 18×18 multipliers accelerate current-loop calculations; industrial temp rating ensures reliability near power stages. | Use Scenario: Automated test system generating custom digital stimulus waveforms for IC validation. IC Role / Device Role / Timing Role: High-speed pattern generator with programmable timing resolution and deep pattern memory. Use Value: 216 Kbits of block RAM stores >8K 24-bit vectors; 333 MHz I/O register speed supports >100 MHz pattern rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100AN-4FT256I | Higher logic density (100K gates, 2,176 logic cells), same package and Flash integration | Better suited for designs requiring additional state machines or larger data buffers | Select when future scalability or added peripheral logic is anticipated without PCB change |
| XC3S50A-4FT256C | No embedded Flash; requires external configuration PROM; commercial temp range (0°C to +70°C) | Limited to benign environments; adds BOM cost and boot delay | Consider only if Flash retention and instant-on are not required and cost is primary constraint |
Compared with XC3S50AN-4FT256I, the XC3S100AN-4FT256I offers headroom for logic growth while maintaining pin compatibility and Flash functionality, whereas the XC3S50A-4FT256C sacrifices configuration autonomy and industrial reliability for lower unit cost.
Availability
XC3S50AN-4FT256I is available at Aetrix Electronics and suitable for industrial PLCs, motor drive controllers, protocol bridge modules, and automated test equipment requiring stable component supply and long-term manufacturability.
Supply support for XC3S50AN-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for systems needing single-chip, non-volatile FPGA solutions in industrial and communications edge equipment.
FAQ
Does XC3S50AN-4FT256I require an external configuration PROM?
No. XC3S50AN-4FT256I integrates 2 Mbits of on-chip Flash memory, enabling complete configuration storage and instant-on operation without external PROM or microcontroller involvement. This reduces board area, BOM count, and boot time compared to SRAM-based FPGAs like the XC3S50A series.
What is the maximum operating frequency of XC3S50AN-4FT256I?
The XC3S50AN-4FT256I speed grade -4 supports up to 333 MHz for I/O registers and 210 MHz for internal logic paths under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and timing constraints verified during synthesis and place-and-route.
Can XC3S50AN-4FT256I operate with mixed I/O voltages?
Yes. XC3S50AN-4FT256I supports independent VCCO settings per I/O bank, allowing simultaneous 1.8 V, 2.5 V, and 3.3 V signaling on different pins. Each bank must be powered at a single voltage, but multiple banks may use different voltages without level shifters.
Is XC3S50AN-4FT256I qualified for industrial temperature operation?
Yes. XC3S50AN-4FT256I carries the 'I' suffix denoting industrial temperature grade (-40°C to +85°C). Its silicon, packaging, and Flash memory are characterized and guaranteed across this full range, making it suitable for deployment in factory automation, outdoor infrastructure, and motor control enclosures.
What configuration modes does XC3S50AN-4FT256I support?
XC3S50AN-4FT256I supports Master Serial (using internal oscillator), Slave Serial, JTAG, and Boundary Scan configuration modes. The integrated Flash allows automatic loading on power-up in Master Serial mode, eliminating need for external controllers or configuration state machines.
XC3S50AN-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 195
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50AN-4FT256I FAQ
1.How can I place an order for XC3S50AN-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-4FT256I reliable?
The price and inventory of XC3S50AN-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S50AN-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-4FT256I?
XC3S50AN-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-4FT256I?
For technical support, including XC3S50AN-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-4FT256I requirements.
6.How does Aetrix verify that XC3S50AN-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S50AN-4FT256I?
All XC3S50AN-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-4FT256I part is unused and in its original packaging.
Return procedure for XC3S50AN-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50AN-4FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
