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AMD XC3S50AN-4FTG256C
- Part No.:
- XC3S50AN-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50AN-4FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,809
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Product details
Overview
XC3S50AN-4FTG256C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array (FPGA) with 50,000 system gates, 176 logic cells, and embedded flash configuration memory. It operates at -4 speed grade (1.14 ns CLB delay), uses 1.2 V core voltage, and features 172 user I/Os in a 256-pin FTBGA package. It is used in industrial control logic and reconfigurable digital signal preprocessing.
For engineers reviewing the XC3S50AN-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash non-volatility, single-chip configuration, I/O bank voltage flexibility (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and support for JTAG boundary-scan testing.
Technical Context
The XC3S50AN-4FTG256C integrates on-chip Flash for instant-on operation and eliminates external configuration PROMs. Its architecture includes configurable logic blocks (CLBs), distributed RAM, block RAM (176 kbits), and digital clock managers (DCMs) supporting frequency synthesis and phase alignment.
It supports SelectIO standards across five I/O banks, enabling mixed-voltage interfacing without level shifters. Configuration occurs via JTAG, Master Serial, or Slave Parallel modes, with full IEEE 1149.1 compliance and internal oscillator for startup timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 176 - provides combinational and sequential logic capacity for medium-complexity digital functions |
| System Gates | 50,000 - indicates overall logic density suitable for compact control and interface logic |
| Block RAM | 176 kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 172 user I/Os - supports multi-protocol interfacing across five independently biased I/O banks |
| Core Voltage | 1.2 V - reduces dynamic power consumption and thermal load in embedded systems |
| Speed Grade | -4 (1.14 ns CLB delay) - defines maximum operating frequency for synchronous logic paths |
| Configuration Memory | On-chip Flash - enables single-chip, instant-on, and secure configuration without external PROM |
Pinout & Package
XC3S50AN-4FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251AC footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG380.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V power input to FPGA logic fabric; decoupling required within 10 mm of each pin |
| VCCAUX | Auxiliary supply | 2.5 V supply for configuration circuitry, DCMs, and JTAG interface |
| VCCO_0–VCCO_4 | I/O bank supplies | Independent 1.2–3.3 V bias per bank; sets output swing and input threshold for that bank |
| TCK/TMS/TDI/TDO | JTAG boundary-scan | IEEE 1149.1 test access port for programming, debugging, and interconnect verification |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reload |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error during startup |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash memory | Enables single-chip, zero-configuration-time deployment and eliminates external PROM BOM cost |
| Digital Clock Managers (DCMs) | Provide jitter-reduced clock synthesis, 90° phase shift, and frequency doubling for precise timing control |
| SelectIO technology | Supports LVCMOS, LVTTL, PCI, HSTL, and SSTL standards across independent I/O banks |
| Embedded block RAM | 176 kbits distributed as 16 × 18-kbit blocks for dual-port memory and FIFO implementation |
| Boundary-scan (JTAG) | Full IEEE 1149.1 compliance enables board-level testability and in-system programming |
Applications
| Industrial PLC Logic | Automotive Body Control |
|---|---|
Use Scenario: Replacing fixed-function ASICs in programmable logic controllers for real-time I/O scanning and ladder logic execution. IC Role / Device Role / Timing Role: Configurable logic fabric executing deterministic control algorithms with sub-microsecond response latency. Use Value: Field-upgradable logic avoids hardware redesign; embedded Flash ensures immediate startup after power cycle. | Use Scenario: Managing door lock actuation, window lift sequencing, and lighting dimming in automotive body electronics modules. IC Role / Device Role / Timing Role: Interface aggregator and state machine controller coordinating multiple sensors and actuators over LIN and discrete signals. Use Value: Mixed-voltage I/O banks simplify integration with 5 V sensors and 3.3 V microcontrollers without external level shifters. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Consolidating analog sensor signal conditioning, digital filtering, and SPI/I²C protocol bridging in portable diagnostic devices. IC Role / Device Role / Timing Role: Real-time digital signal preprocessing unit synchronizing ADC sampling and applying FIR filters before MCU handoff. Use Value: On-chip block RAM stores filter coefficients and intermediate samples; low-power 1.2 V core extends battery life. | Use Scenario: Generating high-fidelity digital stimulus patterns for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control via DCM-generated clocks. Use Value: -4 speed grade supports >100 MHz pattern rates; JTAG boundary-scan validates interconnect integrity pre-test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100AN-4FTG256C | 100K system gates, 336 logic cells, 352 kbits block RAM - higher density and memory capacity | Supports larger state machines and deeper FIFOs; requires same FTBGA-256 footprint but higher power draw | Choose when design exceeds XC3S50AN-4FTG256C resource limits but retains identical package and pinout |
| XC3S50A-4VQG100C | Same 50K-gate logic, no embedded Flash - requires external configuration PROM and longer startup time | Lacks instant-on capability; uses 100-pin VQFP package with fewer I/Os (63) and no I/O bank flexibility | Consider only if legacy board layout constraints prevent FTBGA use and external configuration is acceptable |
Compared with XC3S50AN-4FTG256C, the XC3S100AN-4FTG256C offers scalable logic density in identical packaging, while the XC3S50A-4VQG100C trades Flash integration and I/O flexibility for legacy package compatibility - both require explicit evaluation of configuration architecture and I/O count fit.
Availability
XC3S50AN-4FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S50AN-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-3AN family was designed for cost-sensitive, space-constrained embedded applications requiring instant-on operation, configuration security, and reduced external components - especially where Flash integration eliminates boot PROMs.
FAQ
What is the configuration method supported by XC3S50AN-4FTG256C?
The XC3S50AN-4FTG256C supports three configuration modes: JTAG (for programming and debugging), Master Serial (using external SPI PROM), and Slave Parallel (synchronized to an external controller). Its integrated Flash allows standalone operation after initial programming, eliminating need for external configuration memory in most deployments of XC3S50AN-4FTG256C.
Does XC3S50AN-4FTG256C require external configuration memory?
No, XC3S50AN-4FTG256C contains on-chip Flash memory sufficient to store full configuration bitstream. This enables instant-on functionality and removes dependency on external PROMs or configuration controllers - a key differentiator of the Spartan-3AN family versus earlier Spartan-3A devices like XC3S50A-4VQG100C.
What I/O standards are supported by XC3S50AN-4FTG256C?
XC3S50AN-4FTG256C supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II across its five independently powered I/O banks. Each bank's VCCO voltage determines compatible signaling standards - for example, 3.3 V VCCO enables LVTTL and LVCMOS33, while 1.8 V supports SSTL18.
Can XC3S50AN-4FTG256C operate without an external clock source?
XC3S50AN-4FTG256C includes an internal oscillator (~4 MHz) used exclusively for configuration startup timing and JTAG operations. However, user logic and DCMs require external clock inputs - the device does not generate system clocks internally for application logic, so XC3S50AN-4FTG256C must be supplied with at least one external clock source for functional operation.
Is XC3S50AN-4FTG256C pin-compatible with other Spartan-3AN devices?
XC3S50AN-4FTG256C shares the FTG256 package and pinout with XC3S100AN-4FTG256C and XC3S200AN-4FTG256C, enabling direct PCB reuse across density variants. However, it is not pin-compatible with non-AN variants (e.g., XC3S50A-4VQG100C) or other package options - pin mapping and bank assignments are specific to the FTG256 footprint used by XC3S50AN-4FTG256C.
XC3S50AN-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 195
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50AN-4FTG256C FAQ
1.How can I place an order for XC3S50AN-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-4FTG256C reliable?
The price and inventory of XC3S50AN-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S50AN-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-4FTG256C?
XC3S50AN-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-4FTG256C?
For technical support, including XC3S50AN-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-4FTG256C requirements.
6.How does Aetrix verify that XC3S50AN-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S50AN-4FTG256C?
All XC3S50AN-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S50AN-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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