AMD XC3S50AN-4FTG256I

Overview

XC3S50AN-4FTG256I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 50K system gates, embedded Flash configuration memory, 176 user I/Os, and a 4 ns logic delay. It operates at -4 speed grade and supports industrial temperature range (-40°C to +85°C), used in reconfigurable logic control for industrial automation interfaces.

For engineers reviewing the XC3S50AN-4FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include integrated Flash non-volatility, single-chip configuration, I/O voltage flexibility (1.2V/2.5V/3.3V), and industrial-grade thermal reliability.

Technical Context

The XC3S50AN-4FTG256I integrates on-chip Flash for instant-on operation and eliminates external configuration PROMs. Its architecture includes 1,728 logic cells, 128 Kbits of block RAM, and up to 22 dedicated multipliers.

It supports SelectIO™ technology with programmable drive strength, slew rate, and termination, and features internal oscillator, JTAG boundary-scan, and IEEE 1149.1 compliance for debug and test.

Key Specifications

Pinout & Package

XC3S50AN-4FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm pitch, 17 mm × 17 mm body size, and standard 1.2 V core / 3.3 V I/O supply partitioning.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and configuration-integrated applications.

Compared with XC3S50AN-4FTG256I, the XC3S100AN-4FTG256I offers headroom for logic expansion in identical footprint, while XC3S50A-4FTG256C trades Flash autonomy and industrial rating for lower unit cost in benign environments.

Availability

XC3S50AN-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical diagnostics, and avionics subsystems requiring stable component supply and long-term manufacturability.

Supply support for XC3S50AN-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.

The Spartan-3AN product line was designed specifically for systems needing instant-on, single-chip reconfigurable logic with non-volatile configuration storage in industrial environments.

FAQ

What is the configuration method supported by XC3S50AN-4FTG256I?

The XC3S50AN-4FTG256I uses on-chip Flash memory for master-mode serial configuration at power-up. It does not require an external PROM or processor-controlled loading. Configuration is initiated automatically upon VCCINT and VCCO stabilization, and the DONE pin signals completion. This enables true instant-on behavior critical for industrial control applications where boot latency must be minimized.

Does XC3S50AN-4FTG256I support JTAG programming and debugging?

Yes, XC3S50AN-4FTG256I fully supports IEEE 1149.1 JTAG boundary-scan via TCK, TMS, TDI, and TDO pins. It enables in-system programming, configuration verification, and real-time debugging of implemented logic. The JTAG interface also supports partial reconfiguration and secure bitstream download using Xilinx iMPACT or Vivado tools, making XC3S50AN-4FTG256I suitable for field-upgradable embedded systems.

What I/O voltage standards are compatible with XC3S50AN-4FTG256I?

XC3S50AN-4FTG256I supports 1.2 V, 2.5 V, and 3.3 V I/O standards per bank, with each of its eight I/O banks independently configurable. This allows mixed-voltage operation-for example, interfacing 3.3 V RS-485 transceivers and 1.2 V LVCMOS sensors simultaneously. VCCO per bank must match the selected I/O standard, and bank-specific termination resistors are programmable in hardware.

Is XC3S50AN-4FTG256I qualified for industrial temperature operation?

Yes, XC3S50AN-4FTG256I is explicitly rated for industrial temperature range (–40°C to +85°C) and undergoes full characterization across this range. Its Flash memory retention, timing closure, and I/O drive strength are validated under thermal stress. This qualification makes XC3S50AN-4FTG256I appropriate for deployment in factory automation, outdoor kiosks, and transportation infrastructure where ambient conditions exceed commercial limits.

How does the internal oscillator in XC3S50AN-4FTG256I function?

The XC3S50AN-4FTG256I includes a factory-calibrated internal oscillator running at approximately 48 MHz. It powers the JTAG TCK signal, configuration state machine, and optional user logic clocks. While not precision-timed, it eliminates need for external crystals in non-critical timing paths. Its frequency tolerance is ±10%, and it remains active during all configuration modes-making XC3S50AN-4FTG256I viable for space-constrained or cost-sensitive designs where crystal BOM reduction is essential.