AMD XC3S50AN-4TQ144I

Overview

XC3S50AN-4TQ144I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 50,000 system gates, 144-pin TQFP package, -4 speed grade, and integrated flash memory for single-chip configuration. It operates at 1.2 V core voltage and supports 3.3 V I/Os, commonly used in industrial control logic and embedded reconfigurable interfaces.

For engineers reviewing the XC3S50AN-4TQ144I datasheet, pinout, applications, or equivalent options, key selection criteria include flash-integrated configuration, TQFP-144 mechanical compatibility, -4 speed timing margin, and 1.2 V/3.3 V dual-voltage operation in space-constrained legacy designs.

Technical Context

The XC3S50AN-4TQ144I implements a non-volatile FPGA architecture with on-chip 2 Mbit serial flash, eliminating external configuration PROMs. Its logic fabric includes 1,728 configurable logic blocks (CLBs), each with two 4-input LUTs and flip-flops, supporting synchronous design flows.

It features 128 kbits of distributed RAM, up to 192 I/O pins with programmable slew rate and drive strength, and supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards. Configuration occurs automatically on power-up via internal flash.

Key Specifications

Pinout & Package

XC3S50AN-4TQ144I uses a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch and 20 mm × 20 mm body size. Thermal pad is not present; standard reflow profile applies.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC3S50AN-4TQ144I, the XC3S100AN-4TQ144I offers headroom for future feature expansion without layout change, while the XC3S50A-4TQ144C trades flash convenience for lower unit cost in controlled environments - both require validation of timing closure and I/O constraint migration.

Availability

XC3S50AN-4TQ144I is available at Aetrix Electronics and suitable for industrial automation, legacy bus adaptation, and medical sensor aggregation requiring stable component supply and long-term obsolescence management.

Supply support for XC3S50AN-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-3AN product line for legacy industrial and aerospace applications requiring flash-based FPGAs.

The Spartan-3AN family was designed specifically for single-chip, instant-on reconfigurable logic in space- and power-constrained systems where external configuration PROMs are undesirable.

FAQ

What is the operating temperature range for XC3S50AN-4TQ144I?

The XC3S50AN-4TQ144I is rated for industrial temperature range: –40°C to +85°C. This specification applies to the entire device, including its integrated flash memory and I/O banks. The part number suffix "I" explicitly denotes industrial grade, and thermal derating curves are provided in the Xilinx DS225 datasheet. XC3S50AN-4TQ144I must be operated within this range to guarantee timing closure and flash retention.

Does XC3S50AN-4TQ144I require an external configuration PROM?

No, XC3S50AN-4TQ144I does not require an external configuration PROM. Its on-chip 2 Mbit serial flash stores the configuration bitstream and auto-initializes the FPGA on power-up. This eliminates external PROM components, reduces board area, and improves system reliability. XC3S50AN-4TQ144I supports in-system programming (ISP) of the flash via JTAG or SelectMAP interface.

Can XC3S50AN-4TQ144I be reprogrammed in the field?

Yes, XC3S50AN-4TQ144I supports field reprogramming of its integrated flash memory using JTAG or SelectMAP interfaces. Reprogramming preserves existing I/O states during configuration reload, enabling hot-swap-capable logic updates. XC3S50AN-4TQ144I flash endurance is rated for 20,000 write/erase cycles per sector, with data retention exceeding 20 years at 85°C.

What I/O standards are supported by XC3S50AN-4TQ144I?

XC3S50AN-4TQ144I supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards across its 192 user I/O pins. Each of the eight I/O banks can be independently configured for different VCCO voltages (3.3 V, 2.5 V, 1.8 V). XC3S50AN-4TQ144I does not support HSTL or differential standards beyond LVDS and RSDS.

Is XC3S50AN-4TQ144I pin-compatible with XC3S50-4TQ144I?

No, XC3S50AN-4TQ144I is not pin-compatible with XC3S50-4TQ144I. Although both use TQFP-144 packaging, XC3S50AN-4TQ144I adds dedicated VCCAUX and flash control pins not present on the non-AN variant. Pinouts differ in functions assigned to pins P137–P144. XC3S50AN-4TQ144I requires updated PCB layout and I/O constraints.