My Inquiry
My Account
AMD XC3S50AN-4TQG144C
- Part No.:
- XC3S50AN-4TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50AN-4TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:7,914
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S50AN-4TQG144C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array with 50,000 system gates, 144-pin TQFP package, -4 speed grade, and integrated flash memory for single-chip configuration. It serves as a reconfigurable logic fabric in industrial control I/O modules requiring deterministic timing and nonvolatile configuration storage.
For engineers reviewing the XC3S50AN-4TQG144C datasheet, pinout, applications, or equivalent options, key selection factors include integrated flash capacity, I/O count (108 user I/Os), differential signaling support (LVDS, LVPECL), embedded block RAM (72 KB), and industrial temperature range (-40°C to +85°C).
Technical Context
The XC3S50AN-4TQG144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic. It integrates 1.5 MB of on-chip flash memory for configuration bitstream storage and supports JTAG, Master Serial, and Slave SelectMAP configuration modes.
It delivers up to 250 MHz system clock performance, includes 108 user-configurable I/O pins compliant with 19 I/O standards (including LVTTL, LVCMOS, PCI, and SSTL), and features internal voltage regulation via on-die DC-DC converter for core voltage (1.2 V) generation from 3.3 V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 CLBs (7,168 logic cells) - determines maximum combinational/sequential logic density |
| Block RAM | 72 KB - supports FIFOs, buffers, and data tables without external memory |
| User I/O Pins | 108 - enables direct interface to sensors, actuators, and communication peripherals |
| Flash Memory | 1.5 MB on-chip - eliminates external configuration PROM and enables instant-on operation |
| Speed Grade | -4 - guarantees timing closure up to 250 MHz system clock frequency |
| Operating Temp | -40°C to +85°C - qualified for industrial ambient environments without derating |
| Core Voltage | 1.2 V - supplied internally via integrated DC-DC converter from 3.3 V rail |
Pinout & Package
XC3S50AN-4TQG144C uses a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad. Pin assignment follows Xilinx Spartan-3AN family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V input for FPGA logic fabric; sourced by internal DC-DC converter |
| VCCAUX | Auxiliary power supply | 3.3 V for configuration circuitry, JTAG, and I/O banks |
| VCCO_0 | I/O bank power | 3.3 V or 2.5 V selectable per bank for interfacing with mixed-voltage peripherals |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables programming, debugging, and IEEE 1149.1-compliant test access |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reload from flash |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | 1.5 MB on-die flash eliminates need for external configuration PROM and reduces BOM count |
| Single-Chip Configuration | Supports instant-on operation with no external boot device required |
| Internal DC-DC Converter | Generates regulated 1.2 V core voltage from 3.3 V supply, reducing external power components |
| Dedicated Clock Management | Four Digital Clock Managers (DCMs) provide phase alignment, frequency synthesis, and duty-cycle correction |
| Multi-Standard I/O Support | 108 pins support 19 I/O standards including LVDS, LVPECL, PCI, and SSTL-2/3 |
Applications
| Industrial PLC I/O Module | Motor Control Interface Unit |
|---|---|
Use Scenario: Real-time digital I/O expansion in programmable logic controller chassis with hot-swap capability. IC Role / Device Role / Timing Role: Reconfigurable logic fabric managing isolation, debounce, and protocol translation between field devices and backplane bus. Use Value: Integrated flash enables firmware updates without external memory replacement; 108 I/Os support 32-channel DI/DO plus encoder feedback inputs. | Use Scenario: Closed-loop servo drive interface handling PWM generation, current sensing, and safety monitoring. IC Role / Device Role / Timing Role: Timing-critical logic for synchronized PWM edge placement, ADC sampling trigger, and fault response within 100 ns. Use Value: DCMs deliver jitter-free 250 MHz clocks for precise PWM timing; LVDS I/Os interface directly with isolated gate drivers. |
| Medical Imaging Data Acq. | Test Equipment Pattern Generator |
Use Scenario: High-speed parallel data capture from CCD/CMOS sensor arrays in portable ultrasound systems. IC Role / Device Role / Timing Role: Synchronized front-end logic for pixel clock domain crossing, line buffering, and DMA handshaking with ARM host. Use Value: 72 KB block RAM stores full-line image buffers; LVDS inputs accept 100+ MHz pixel clocks with sub-nanosecond skew. | Use Scenario: Programmable digital stimulus generator for IC functional validation in ATE platforms. IC Role / Device Role / Timing Role: Deterministic pattern sequencer generating multi-channel, multi-rate digital waveforms with nanosecond-level timing control. Use Value: -4 speed grade ensures setup/hold timing margins at 250 MHz; flash memory retains multiple test vectors onboard. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100AN-4TQG144C | 100K-gate capacity, 128 KB block RAM, same 144-pin TQFP package | Higher logic density and memory for larger state machines or embedded soft-core processors | Select when design requires >1,728 CLBs or >72 KB RAM; pin-compatible but larger die area increases thermal load |
| XC3S50A-4TQG144C | No integrated flash; requires external SPI PROM for configuration | Lower cost where configuration persistence is handled externally or via system-level boot loader | Choose when flash integration is unnecessary and BOM cost optimization is prioritized over instant-on capability |
Compared with XC3S50AN-4TQG144C, the XC3S100AN-4TQG144C offers higher logic capacity and memory at identical footprint, while the XC3S50A-4TQG144C removes flash to reduce unit cost-making it suitable only where external configuration infrastructure already exists.
Availability
XC3S50AN-4TQG144C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC3S50AN-4TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.
The Spartan-3AN family was designed specifically for cost-sensitive, space-constrained industrial and automotive applications requiring nonvolatile configuration, robust I/O, and deterministic logic performance without external configuration devices.
FAQ
What is the configuration method supported by XC3S50AN-4TQG144C?
The XC3S50AN-4TQG144C supports three configuration methods: Master Serial (via on-chip flash), JTAG (for programming and debugging), and Slave SelectMAP (for system-level configuration). Its integrated 1.5 MB flash enables autonomous startup without external PROM, making XC3S50AN-4TQG144C ideal for applications requiring instant-on reliability and reduced board complexity.
Does XC3S50AN-4TQG144C require external configuration memory?
No, XC3S50AN-4TQG144C does not require external configuration memory. It contains 1.5 MB of integrated flash memory that stores the configuration bitstream permanently. This allows XC3S50AN-4TQG144C to power up and configure itself autonomously, eliminating the need for external SPI PROMs or configuration controllers in most designs.
What I/O standards are supported by XC3S50AN-4TQG144C?
XC3S50AN-4TQG144C supports 19 I/O standards including LVTTL, LVCMOS (2.5 V/3.3 V), PCI, SSTL-2, SSTL-3, HSTL, and differential standards such as LVDS and LVPECL. Each of its 108 user I/O pins can be assigned to one of eight I/O banks, with independent VCCO per bank enabling mixed-voltage interface design in XC3S50AN-4TQG144C-based systems.
What is the purpose of the internal DC-DC converter in XC3S50AN-4TQG144C?
The internal DC-DC converter in XC3S50AN-4TQG144C generates the 1.2 V core voltage directly from the 3.3 V auxiliary supply (VCCAUX), eliminating the need for an external core regulator. This simplifies power delivery design and improves efficiency in XC3S50AN-4TQG144C implementations where board space and component count are constrained.
Is XC3S50AN-4TQG144C suitable for industrial temperature operation?
Yes, XC3S50AN-4TQG144C is rated for industrial temperature operation from -40°C to +85°C. It is fully qualified and tested across this range, with timing specifications guaranteed at the -4 speed grade under worst-case voltage and temperature conditions. This makes XC3S50AN-4TQG144C appropriate for deployment in harsh industrial environments without thermal derating.
XC3S50AN-4TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50AN-4TQG144C FAQ
1.How can I place an order for XC3S50AN-4TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-4TQG144C reliable?
The price and inventory of XC3S50AN-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-4TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S50AN-4TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-4TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-4TQG144C?
XC3S50AN-4TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-4TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-4TQG144C?
For technical support, including XC3S50AN-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-4TQG144C requirements.
6.How does Aetrix verify that XC3S50AN-4TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-4TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S50AN-4TQG144C?
All XC3S50AN-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-4TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-4TQG144C part is unused and in its original packaging.
Return procedure for XC3S50AN-4TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50AN-4TQG144C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
