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AMD XC3S50AN-4TQG144I
- Part No.:
- XC3S50AN-4TQG144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50AN-4TQG144I.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,165
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Product details
Overview
XC3S50AN-4TQG144I from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array with 50,000 system gates, embedded Flash configuration memory, and 144-pin TQFP packaging. It operates at -4 speed grade (1.14 ns CLB delay), supports 3.3 V I/O, and integrates 1728 logic cells for digital logic implementation in space-constrained industrial control systems.
For engineers reviewing the XC3S50AN-4TQG144I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, single-chip configuration capability, I/O voltage compatibility, and industrial temperature range (-40°C to +100°C).
Technical Context
The XC3S50AN-4TQG144I integrates on-chip Flash memory enabling instant-on operation without external configuration PROMs. Its architecture includes 1728 configurable logic blocks (CLBs), 12 embedded 18×18 multipliers, and up to 108 user I/O pins supporting LVCMOS, LVTTL, PCI, and SSTL-2 standards.
It features internal oscillator, JTAG boundary-scan, and full IEEE 1149.1 compliance. Configuration occurs via Master Serial, Slave Serial, or JTAG modes - all supported natively without external controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1728 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 50,000 - indicates relative logic density benchmarked against ASIC gate count |
| I/O Pins | 108 - number of user-configurable bidirectional signal terminals available in TQG144 package |
| Speed Grade | -4 - specifies 1.14 ns CLB propagation delay, enabling 87.7 MHz maximum clock frequency |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| VCCINT | 1.2 V - core supply voltage required for internal FPGA logic and routing resources |
| VCCO | 3.3 V - I/O bank supply voltage compatible with legacy TTL and PCI signaling |
Pinout & Package
XC3S50AN-4TQG144I uses a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed pad not present. Pin assignments follow Xilinx Spartan-3AN family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for FPGA logic fabric |
| P2 | VCCO_0 | 3.3 V I/O bank power for Bank 0 (pins A1–D12) |
| T14 | PROGRAM_B | Active-low asynchronous configuration reset; pulls device into reconfiguration state |
| R15 | DONE | Open-drain status output indicating successful configuration completion |
| M13 | TCK | JTAG test clock input per IEEE 1149.1 boundary-scan protocol |
| L14 | TMS | JTAG test mode select controlling TAP controller state transitions |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables single-chip, zero-PROM configuration with 20-year data retention at 85°C |
| Embedded Oscillator | Provides 48 MHz internal clock source for configuration and auxiliary logic, eliminating external crystal |
| Multi-Voltage I/O Banks | Supports mixed-voltage interfaces (3.3 V, 2.5 V, 1.8 V, 1.5 V) across independent banks for flexible system interfacing |
| IEEE 1149.1 Boundary Scan | Allows in-system verification of PCB interconnects and FPGA I/O pin functionality without external test fixtures |
| Single Event Upset (SEU) Mitigation | Includes built-in CRC checking and automatic reconfiguration recovery for enhanced reliability in radiation-prone environments |
Applications
| Industrial PLC Logic Controller | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Real-time deterministic logic execution for motion control sequencing and sensor feedback processing in factory automation cabinets. IC Role / Device Role / Timing Role: Configurable digital state machine implementing custom ladder logic and PID loop coordination. Use Value: Embedded Flash eliminates boot PROM dependency, reducing BOM count and startup latency to <100 µs. | Use Scenario: Generating high-fidelity digital stimulus waveforms synchronized to DUT clock domains in semiconductor wafer testing. IC Role / Device Role / Timing Role: High-speed pattern sequencer with precise timing alignment using internal PLL and programmable delays. Use Value: 108 user I/O pins support parallel 32-bit vector buses at 87.7 MHz, enabling >2.8 Gbps aggregate pattern throughput. |
| Medical Imaging Front-End Interface | Avionics Data Acquisition Module |
Use Scenario: Aggregating and preprocessing analog-to-digital converter outputs from ultrasound transducer arrays before transmission to DSP subsystems. IC Role / Device Role / Timing Role: Synchronized data formatter and channel multiplexer with real-time FIFO buffering. Use Value: Industrial temperature rating (-40°C to +100°C) ensures stable operation inside sealed imaging chassis without forced cooling. | Use Scenario: Collecting discrete sensor signals (temperature, pressure, vibration) and converting them to ARINC 429 or MIL-STD-1553 compliant outputs. IC Role / Device Role / Timing Role: Protocol-aware interface bridge with deterministic latency and error detection logic. Use Value: SEU mitigation and CRC-based configuration integrity provide fault containment essential for DO-254 Level A compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100AN-4TQG144I | Higher logic density (100K gates, 3312 CLBs), same package and speed grade | Supports larger state machines and wider datapaths; requires identical PCB layout | Select when design scalability or future firmware expansion is required without board revision |
| XC6SLX9-2TQG144C | Spartan-6 generation; lower static power, higher DSP slice count, but no embedded Flash | Requires external SPI Flash for configuration; better suited for low-power portable systems | Choose for new designs prioritizing power efficiency over instant-on capability and legacy footprint compatibility |
Compared with XC3S50AN-4TQG144I, the XC3S100AN-4TQG144I offers direct pin-compatible upgrade path with doubled logic resources, while the XC6SLX9-2TQG144C trades embedded Flash for improved power-performance ratio and modern toolchain support - requiring configuration redesign but enabling longer product lifecycle.
Availability
XC3S50AN-4TQG144I is available at Aetrix Electronics and suitable for industrial control, automated test equipment, and medical imaging systems requiring stable component supply, long-term availability, and guaranteed obsolescence management.
Supply support for XC3S50AN-4TQG144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3AN family was designed specifically for systems needing instant-on, single-chip FPGA solutions with nonvolatile configuration - targeting industrial, medical, and aerospace edge devices where boot reliability and board space are critical.
FAQ
What is the configuration method supported by XC3S50AN-4TQG144I?
The XC3S50AN-4TQG144I supports Master Serial, Slave Serial, and JTAG configuration modes. Its integrated Flash allows autonomous startup without external configuration devices. The XC3S50AN-4TQG144I automatically loads configuration bitstream from on-chip Flash upon power-up, achieving sub-100 µs initialization time.
Does XC3S50AN-4TQG144I require an external oscillator?
No - the XC3S50AN-4TQG144I includes an internal 48 MHz oscillator used for configuration and general-purpose clocking. External oscillators are optional and only needed when precise frequency accuracy, low jitter, or frequencies outside the internal oscillator's range are required for the XC3S50AN-4TQG144I application.
What is the maximum operating junction temperature for XC3S50AN-4TQG144I?
The XC3S50AN-4TQG144I is rated for industrial temperature range with a maximum junction temperature of +125°C. Its specified operating ambient temperature is -40°C to +100°C, validated under full load conditions with appropriate PCB thermal design per Xilinx UG331 guidelines.
Can XC3S50AN-4TQG144I be reprogrammed in-system?
Yes - the XC3S50AN-4TQG144I supports in-system programming (ISP) via JTAG or serial interface. Its Flash memory can be erased and reprogrammed over 20,000 cycles, and retains configuration data for 20 years at 85°C. Reprogramming the XC3S50AN-4TQG144I does not require removal from the PCB.
Is XC3S50AN-4TQG144I RoHS compliant?
Yes - the XC3S50AN-4TQG144I is manufactured in accordance with EU RoHS Directive 2011/65/EU and is lead-free, halogen-free, and compliant with IPC/JEDEC J-STD-609A Class 1 moisture sensitivity level (MSL-1). Full compliance documentation is available for the XC3S50AN-4TQG144I upon request.
XC3S50AN-4TQG144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50AN-4TQG144I FAQ
1.How can I place an order for XC3S50AN-4TQG144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-4TQG144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-4TQG144I reliable?
The price and inventory of XC3S50AN-4TQG144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-4TQG144I is usually 5 days.
3.What payment methods are accepted for XC3S50AN-4TQG144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-4TQG144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-4TQG144I?
XC3S50AN-4TQG144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-4TQG144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-4TQG144I?
For technical support, including XC3S50AN-4TQG144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-4TQG144I requirements.
6.How does Aetrix verify that XC3S50AN-4TQG144I is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-4TQG144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-4TQG144I meets industry standards.
7.What is the process for return or replacement of XC3S50AN-4TQG144I?
All XC3S50AN-4TQG144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-4TQG144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-4TQG144I part is unused and in its original packaging.
Return procedure for XC3S50AN-4TQG144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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