AMD XC3S50AN-5FT256C

Overview

XC3S50AN-5FT256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA featuring 50,000 system gates, 176 I/O pins, and integrated flash memory for single-chip configuration. It operates at -5 speed grade (4 ns CLB delay), supports 3.3 V/2.5 V/1.2 V mixed-voltage I/O, and targets low-cost embedded control and interface bridging applications.

For engineers reviewing the XC3S50AN-5FT256C datasheet, pinout, applications, or equivalent options, key selection factors include its on-chip flash non-volatility, I/O voltage flexibility, CLB count, distributed RAM capacity, and FT256 package thermal and routing constraints.

Technical Context

The XC3S50AN-5FT256C implements a fine-grained logic architecture with configurable logic blocks (CLBs), each containing two 4-input LUTs and flip-flops. It integrates 1,728 Kbits of total block RAM and 176 user I/Os supporting LVCMOS, LVTTL, PCI, and SSTL-2 standards.

Its embedded Platform Flash technology eliminates external configuration PROMs, enabling instant-on operation and design security via bitstream encryption. The -5 speed grade guarantees timing closure up to 200 MHz for critical paths in synchronous logic designs.

Key Specifications

Pinout & Package

XC3S50AN-5FT256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FT256) package with 0.5 mm pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in industrial environments.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S50AN-5FT256C, the XC3S100AN-5FT256C offers direct pin-compatible headroom for logic growth, while the LCMXO2-7000HE-5TG144C trades flash integration and I/O count for lower footprint and bill-of-materials cost in less demanding control roles.

Availability

XC3S50AN-5FT256C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive diagnostics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XC3S50AN-5FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.

The Spartan-3AN family was designed by Xilinx for cost-sensitive, high-volume embedded applications requiring non-volatile configuration, robust I/O flexibility, and deterministic real-time logic execution.

FAQ

Does XC3S50AN-5FT256C require an external configuration PROM?

No. XC3S50AN-5FT256C integrates 2 Mbit of Platform Flash memory, enabling full bitstream storage and automatic configuration on power-up. This eliminates the need for external PROMs, reduces board space, and improves system reliability. The XC3S50AN-5FT256C supports both master serial and JTAG configuration modes, with flash reprogrammability supported via iMPACT or Vivado tools.

What is the maximum operating frequency for XC3S50AN-5FT256C?

The XC3S50AN-5FT256C is rated at speed grade -5, specifying a 4 ns CLB propagation delay. This supports maximum clock frequencies up to 200 MHz for well-constrained synchronous paths. Actual achievable frequency depends on design topology, routing, and I/O standard selection - verified through static timing analysis in Xilinx ISE 14.7. The XC3S50AN-5FT256C's carry chain and distributed RAM enable high-speed arithmetic and buffering without external memory.

Can XC3S50AN-5FT256C interface with both 3.3 V and 1.2 V peripherals simultaneously?

Yes. XC3S50AN-5FT256C features six independently powered I/O banks, allowing concurrent operation at 3.3 V, 2.5 V, and 1.2 V. Each bank's VCCO is externally supplied, enabling direct connection to mixed-voltage peripherals - for example, 3.3 V USB transceivers and 1.2 V DDR memory interfaces - without level-shifting components. This capability is fully supported in the XC3S50AN-5FT256C pinout and bank assignment documentation.

Is XC3S50AN-5FT256C still in active production?

XC3S50AN-5FT256C is a mature, legacy Spartan-3AN device. While no longer in active new-design promotion by AMD/Xilinx, it remains available through authorized distributors and Aetrix Electronics with controlled-lifecycle sourcing. Aetrix maintains inventory and provides last-time-buy planning, obsolescence monitoring, and cross-reference guidance for migration paths if long-term supply becomes constrained for the XC3S50AN-5FT256C.

Does XC3S50AN-5FT256C support JTAG boundary scan testing?

Yes. XC3S50AN-5FT256C fully complies with IEEE 1149.1 (JTAG) standards. Its TAP controller supports instruction register access, boundary-scan register testing, and INTEST/EXTEST operations for PCB interconnect validation. This capability is integral to the XC3S50AN-5FT256C silicon and does not require external configuration - enabling in-system test and debug without modifying the user logic design.