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AMD XC3S50AN-5FTG256C
- Part No.:
- XC3S50AN-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S50AN-5FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,497
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Product details
Overview
XC3S50AN-5FTG256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 50,000 system gates, 176 logic cells, 18 KB embedded block RAM, and integrated Flash memory for single-chip configuration. It operates at -5 speed grade (4 ns CLB delay), uses 1.2 V core voltage, and targets low-cost, high-reliability embedded control and interface bridging applications.
For engineers reviewing the XC3S50AN-5FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include its on-chip Flash non-volatility, FTG256 256-pin Fine-Pitch Thin Quad Flatpack package, I/O voltage flexibility (3.3 V/2.5 V/1.8 V), and support for JTAG boundary-scan and IEEE 1149.1 compliance.
Technical Context
The XC3S50AN-5FTG256C integrates Flash-based configuration memory, eliminating external PROM and enabling instant-on operation. Its architecture includes configurable logic blocks (CLBs), distributed RAM, digital clock managers (DCMs), and SelectIO™ technology supporting multiple I/O standards.
It supports dual-selectMAP configuration, boundary-scan testing, and in-system programming via JTAG. The -5 speed grade guarantees maximum operating frequencies up to 280 MHz for internal logic and 333 MHz for I/O, with DCM output jitter under 200 ps (peak-to-peak).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 176 CLBs provide ~50K system gate capacity for medium-complexity glue logic and protocol translation. |
| Block RAM | 18 KB total enables FIFOs, small buffers, or lookup tables without external memory. |
| Speed Grade | -5 grade ensures 4 ns CLB propagation delay and 280 MHz internal clock frequency. |
| I/O Standards | Supports LVCMOS, LVTTL, PCI, HSTL, SSTL - allows direct interfacing with microcontrollers and memory devices. |
| Core Voltage | 1.2 V supply reduces dynamic power vs. older 1.8 V Spartan-3 families. |
| Configuration | On-chip Flash enables single-chip, zero-PROM design with instant-on and secure bitstream storage. |
Pinout & Package
XC3S50AN-5FTG256C is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTG) package with 0.5 mm pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced thermal dissipation in compact industrial modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1–P4, R1–R4 | JTAG TDI/TDO/TMS/TCK | IEEE 1149.1 boundary-scan test and in-system programming interface. |
| A1–A16, B1–B16 | User I/O / Bank 0–3 | Configurable voltage banks (1.8 V/2.5 V/3.3 V) support mixed-voltage system interfacing. |
| E1, E2, F1, F2 | Global Clock Inputs (GCLK) | Dedicated low-skew routing to DCMs for timing-critical clock distribution. |
| H1, H2, J1, J2 | DCM Outputs | Phase-aligned, frequency-multiplied clocks for synchronous peripheral interfaces. |
| T1–T4 | VCCINT / VCCAUX / GND | Separate 1.2 V core and 2.5 V auxiliary supplies ensure stable internal logic and I/O bank operation. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables single-chip configuration with no external PROM, reducing BOM count and boot time. |
| Digital Clock Manager (DCM) | Provides clock doubling, phase shifting, and duty-cycle correction without external PLL components. |
| SelectIO™ Technology | Allows per-bank I/O voltage assignment and supports 12+ signaling standards for flexible peripheral integration. |
| Boundary-Scan Support | Fully compliant with IEEE 1149.1 for automated PCB test and field firmware updates. |
| Instant-On Operation | Configures from internal Flash within 100 µs of power-up, critical for fail-safe industrial controllers. |
Applications
| Industrial PLC I/O Module | Legacy Bus Bridge |
|---|---|
Use Scenario: Replacing discrete logic in programmable logic controller backplanes to manage analog/digital I/O expansion. IC Role / Device Role / Timing Role: Configurable glue logic and real-time signal conditioning engine with deterministic latency. Use Value: Reduces component count by 70% vs. CPLD + PROM solution while maintaining <1 µs I/O response time. | Use Scenario: Bridging ISA or PCI bus peripherals to modern ARM-based host processors in medical imaging systems. IC Role / Device Role / Timing Role: Protocol translator and timing adapter with synchronized read/write handshaking. Use Value: Eliminates need for custom ASIC; supports 33 MHz PCI clock domain and 100 MHz processor interface simultaneously. |
| Secure Boot Controller | Motor Drive Interface |
Use Scenario: Storing and verifying signed firmware images during cold start in industrial gateways. IC Role / Device Role / Timing Role: Trusted execution environment root-of-trust with tamper-resistant Flash bitstream storage. Use Value: Prevents unauthorized firmware loading using on-chip Flash write-protection and CRC-verified configuration. | Use Scenario: Generating PWM waveforms and capturing encoder feedback in brushless DC motor drives. IC Role / Device Role / Timing Role: Real-time motion control co-processor with sub-microsecond interrupt latency. Use Value: Delivers 16-bit resolution PWM at 20 kHz with hardware dead-time insertion and fault monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC3S100AN-5FTG256C | 100K-gate capacity, same FTG256 package and Flash architecture, higher logic density but identical pinout. | Supports larger state machines and more complex protocol stacks; requires same PCB layout. | Choose when additional logic resources are needed without changing board design. |
| Lattice XP2-5E-256FTG | Non-volatile Flash-based FPGA with 5K LUTs, 256-pin FTBGA (not FTG), different I/O bank structure and toolchain. | Targets lower gate-count applications; lacks DCMs and has reduced clock management capability. | Consider only for cost-sensitive, low-complexity designs where Xilinx toolchain independence is prioritized. |
Compared with XC3S50AN-5FTG256C, the XC3S100AN-5FTG256C offers scalable logic headroom in identical packaging, while the Lattice XP2-5E-256FTG provides an alternative non-volatile architecture with trade-offs in clocking precision and I/O flexibility.
Availability
XC3S50AN-5FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical device interface modules, and secure embedded controllers requiring stable component supply across extended product lifecycles.
Supply support for XC3S50AN-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-optimized, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for applications needing instant-on, single-chip FPGA solutions with non-volatile configuration - targeting industrial control, communications infrastructure, and legacy system modernization.
FAQ
What is the configuration method supported by XC3S50AN-5FTG256C?
The XC3S50AN-5FTG256C supports master serial, slave serial, and JTAG configuration modes. Its integrated Flash memory enables master serial mode as the default, allowing autonomous boot without external configuration PROM. JTAG is used for programming, debugging, and boundary-scan testing. The XC3S50AN-5FTG256C does not require external configuration devices for standard operation.
Does XC3S50AN-5FTG256C support hot-swap I/O operation?
Yes, XC3S50AN-5FTG256C supports hot-swap I/O through its I/O bank power sequencing and bus-hold circuitry. Each I/O bank can be powered independently, and inputs retain last-known state during power transitions. This behavior is documented in Xilinx UG380 for Spartan-3AN devices and applies directly to the XC3S50AN-5FTG256C.
What is the maximum operating junction temperature for XC3S50AN-5FTG256C?
The XC3S50AN-5FTG256C has a maximum junction temperature rating of +85 °C for commercial-grade operation (indicated by the 'C' suffix). Thermal performance depends on PCB copper area, airflow, and package mounting; the FTG256 package's exposed thermal pad must be soldered to a thermal plane for reliable operation at full load.
Can XC3S50AN-5FTG256C be reprogrammed in-system?
Yes, XC3S50AN-5FTG256C supports in-system programming (ISP) via JTAG. Its on-chip Flash memory can be erased and reprogrammed multiple times - rated for 20,000 program/erase cycles. Reprogramming does not require device removal or special voltage conditions, making the XC3S50AN-5FTG256C suitable for field firmware updates.
Is XC3S50AN-5FTG256C RoHS compliant?
Yes, XC3S50AN-5FTG256C is RoHS compliant and lead-free, meeting Directive 2011/65/EU. The FTG256 package uses matte tin finish on leads and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requiring bake prior to reflow if exposed beyond floor life.
XC3S50AN-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 195
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S50AN-5FTG256C FAQ
1.How can I place an order for XC3S50AN-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-5FTG256C reliable?
The price and inventory of XC3S50AN-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S50AN-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-5FTG256C?
XC3S50AN-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-5FTG256C?
For technical support, including XC3S50AN-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-5FTG256C requirements.
6.How does Aetrix verify that XC3S50AN-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S50AN-5FTG256C?
All XC3S50AN-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S50AN-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S50AN-5FTG256C Tags
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ICE40LP384-SG32
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ICE40UL640-CM36AI
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ICE40UL1K-CM36AI
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10M02DCV36C8G
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LCMXO2-256HC-4SG32I
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ICE5LP1K-SG48ITR
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ICE40LP1K-CM36
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LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
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LCMXO2-256HC-4SG48I
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ICE40LP1K-CM81
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