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AMD XC3S50AN-5TQG144C
- Part No.:
- XC3S50AN-5TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S50AN-5TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:132
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Product details
Overview
XC3S50AN-5TQG144C from AMD (formerly Xilinx) is a Spartan-3AN field-programmable gate array featuring 50,000 system gates, 144-pin TQFP package, -5 speed grade, and integrated flash memory for single-chip configuration. It operates at 1.2 V core voltage and supports 3.3 V I/Os, enabling use in industrial control logic and embedded interface bridging.
For engineers reviewing the XC3S50AN-5TQG144C datasheet, pinout, applications, or equivalent options, key selection considerations include flash-based configuration persistence, TQFP-144 mechanical compatibility, I/O bank voltage flexibility, and -5 timing performance for deterministic logic paths.
Technical Context
The XC3S50AN-5TQG144C integrates non-volatile flash configuration memory with SRAM-based FPGA fabric, eliminating external boot PROMs. Its architecture includes 1,728 logic cells, 12 embedded 18×18 multipliers, and up to 192 kbits of block RAM.
It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per I/O bank. Configuration occurs via JTAG or master serial mode using on-chip flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,728 - provides combinational and sequential logic capacity for medium-complexity control and data-path functions |
| System Gates | 50,000 - indicates total equivalent ASIC gate count for logic density estimation |
| Block RAM | 192 kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 108 - usable user I/Os in TQFP-144 package, supporting multiple voltage standards per bank |
| Core Voltage | 1.2 V ± 3% - defines power delivery requirement and impacts dynamic power consumption |
| Speed Grade | -5 - specifies maximum clock frequency for worst-case timing paths (e.g., 333 MHz DLL input) |
| Configuration Memory | Integrated 2-Mbit flash - enables instant-on operation and eliminates external configuration device |
Pinout & Package
XC3S50AN-5TQG144C is housed in a 144-lead Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad (non-electrical). Lead finish is lead-free (Pb-free) matte tin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply for FPGA fabric and CLBs |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and JTAG circuitry |
| A14 | VCCO_0 | 3.3 V I/O bank supply for Bank 0 (supports LVCMOS33/LVTTL) |
| M14 | TCK | JTAG test clock input for boundary-scan and programming |
| N13 | TMS | JTAG test mode select controlling state machine transitions |
| P13 | TDO | JTAG test data output for serial configuration and debug |
| R12 | TDI | JTAG test data input for instruction and configuration data loading |
| U12 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload from flash |
| U11 | INIT_B | Open-drain status output indicating configuration completion or error |
| T11 | CCLK | Configuration clock output during master serial mode; driven by FPGA |
Key Features
| Feature | Design Value |
|---|---|
| On-chip flash memory | Enables single-chip, zero-PROM configuration with instant-on capability after power-up |
| SelectIO technology | Allows mixed-voltage I/O banks (1.2 V to 3.3 V) on same device for interfacing legacy and modern peripherals |
| Dedicated multiplier blocks | 12 × 18×18-bit signed/unsigned multipliers support real-time arithmetic in motor control and signal processing |
| Four digital clock managers (DCMs) | Provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication without external PLL ICs |
| JTAG boundary-scan support | Enables PCB-level interconnect testing and in-system programming without dedicated programming hardware |
Applications
| Industrial PLC Logic Controller | Automotive Body Control Module |
|---|---|
Use Scenario: Real-time sequencing of relay drivers, sensor polling, and CAN message filtering in compact enclosure. IC Role / Device Role / Timing Role: Configurable logic engine implementing state machines and protocol translators with deterministic sub-microsecond latency. Use Value: Integrated flash eliminates boot delay and external SPI PROM, reducing BOM count and board area. | Use Scenario: Centralized lighting control, window lift coordination, and door lock actuation with fail-safe monitoring. IC Role / Device Role / Timing Role: Reconfigurable I/O hub managing mixed-voltage sensors and actuators while maintaining ASIL-B compatible timing behavior. Use Value: SelectIO flexibility allows direct connection to 5 V analog sensors and 12 V load drivers without level-shifter ICs. |
| Medical Diagnostic Interface Bridge | Test Equipment Pattern Generator |
Use Scenario: Protocol conversion between UART-based ultrasound probe and USB 2.0 host controller in portable imaging unit. IC Role / Device Role / Timing Role: Glue logic and serializer/deserializer handling asynchronous domain crossing and packet framing. Use Value: 108 user I/Os and 192 kbits block RAM enable dual-port buffering and real-time packet assembly without external FIFOs. | Use Scenario: Generating synchronized multi-channel digital stimulus waveforms for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with precise edge placement controlled by DCM-generated clocks. Use Value: -5 speed grade ensures setup/hold timing margins for 100+ MHz vector rates across temperature range. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and configuration-integrated applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S100AN-5TQG144C | 100K-gate capacity, identical TQFP-144 package and flash architecture | Supports larger logic designs requiring more CLBs and block RAM | Choose when design exceeds 50K-gate utilization or requires >192 kbits RAM |
| XC3S50A-4TQG144C | No integrated flash; requires external SPI PROM; -4 speed grade (slower max frequency) | Suitable for cost-sensitive applications where instant-on is not required | Choose only if flash integration is unnecessary and BOM cost reduction outweighs configuration complexity |
Compared with XC3S50AN-5TQG144C, the XC3S100AN-5TQG144C offers higher logic density in same footprint, while the XC3S50A-4TQG144C trades flash integration and speed for lower unit cost-making each viable only under specific design constraints.
Availability
XC3S50AN-5TQG144C is available at Aetrix Electronics and suitable for industrial automation, automotive body electronics, and medical diagnostic equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC3S50AN-5TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of adaptive computing platforms. Xilinx pioneered FPGA technology and introduced the Spartan family for cost-optimized, high-volume applications.
The Spartan-3AN product line was designed specifically for embedded systems needing reliable, flash-based configuration in space-constrained industrial and automotive environments.
FAQ
What is the configuration method supported by XC3S50AN-5TQG144C?
The XC3S50AN-5TQG144C supports multiple configuration modes including Master Serial (using internal flash), JTAG, and Slave SelectMAP. Its integrated 2-Mbit flash enables automatic configuration on power-up without external devices, making XC3S50AN-5TQG144C ideal for systems requiring instant-on functionality and reduced component count.
Does XC3S50AN-5TQG144C require an external configuration PROM?
No, XC3S50AN-5TQG144C does not require an external configuration PROM due to its on-chip non-volatile flash memory. The device stores configuration bitstream internally and loads automatically at power-up. This eliminates boot dependencies and simplifies system design-key advantage of XC3S50AN-5TQG144C over earlier Spartan-3A variants.
What I/O standards are supported by XC3S50AN-5TQG144C?
XC3S50AN-5TQG144C supports LVCMOS, LVTTL, PCI, and SSTL I/O standards across its 108 user I/O pins. Each I/O bank can be independently powered (1.2 V to 3.3 V), allowing mixed-voltage operation. This flexibility makes XC3S50AN-5TQG144C suitable for interfacing with diverse peripherals without external level shifters.
What is the operating temperature range for XC3S50AN-5TQG144C?
XC3S50AN-5TQG144C is rated for commercial temperature range (0 °C to +70 °C) as indicated by the 'C' suffix in the part number. It is not qualified for extended or industrial temperature ranges. Designers selecting XC3S50AN-5TQG144C must ensure ambient operating conditions remain within this specification to maintain timing and reliability guarantees.
How many digital clock managers (DCMs) does XC3S50AN-5TQG144C include?
XC3S50AN-5TQG144C includes four Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, duty cycle correction, and spread-spectrum clocking. These DCMs provide precise clock control directly on-die, reducing need for external clock ICs and improving timing predictability in XC3S50AN-5TQG144C-based designs.
XC3S50AN-5TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 176
- Number of Logic Elements/Cells:
- 1584
- Total RAM Bits:
- 55296
- Number of I/O:
- 108
- Number of Gates:
- 50000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S50AN-5TQG144C FAQ
1.How can I place an order for XC3S50AN-5TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S50AN-5TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S50AN-5TQG144C reliable?
The price and inventory of XC3S50AN-5TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S50AN-5TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S50AN-5TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S50AN-5TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S50AN-5TQG144C?
XC3S50AN-5TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S50AN-5TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S50AN-5TQG144C?
For technical support, including XC3S50AN-5TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S50AN-5TQG144C requirements.
6.How does Aetrix verify that XC3S50AN-5TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S50AN-5TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S50AN-5TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S50AN-5TQG144C?
All XC3S50AN-5TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S50AN-5TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S50AN-5TQG144C part is unused and in its original packaging.
Return procedure for XC3S50AN-5TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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