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AMD XC3S700A-4FG400C
- Part No.:
- XC3S700A-4FG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S700A-4FG400C.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,047
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Product details
Overview
XC3S700A-4FG400C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 17,280 logic cells, and 576 Kbits of block RAM, configured in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package for high-density embedded control and interface bridging applications.
For engineers reviewing the XC3S700A-4FG400C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (304 user I/Os), maximum DCI-controlled I/O voltage (3.3 V), distributed RAM depth (16 bits), and supported configuration modes (Master Serial, Slave SelectMAP).
Technical Context
The XC3S700A-4FG400C implements a fully static, 90 nm CMOS-based architecture with configurable logic blocks (CLBs), dedicated multipliers, and Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across banks.
Configuration occurs via external PROM, JTAG, or microprocessor interface; internal startup sequence includes power-on reset, configuration register initialization, and DCM lock detection before user mode entry. The device operates at -4 speed grade with 1.2 V core supply and 3.3 V or 2.5 V I/O supply options.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic capacity for medium-complexity digital controllers |
| User I/O Pins | 304 - supports high-pin-count peripheral interfacing including parallel buses and memory controllers |
| Block RAM | 576 Kbits - enables on-chip buffering for video frame stores, FIFOs, or protocol packet handling |
| Max DCI I/O Voltage | 3.3 V - allows direct connection to legacy 3.3 V peripherals without level-shifting circuitry |
| Speed Grade | -4 - guarantees timing closure up to 500 MHz clock input to DCM with worst-case process/voltage/temperature |
| Configuration Mode | Master Serial, Slave SelectMAP, JTAG - enables flexible programming via SPI flash, host processor, or boundary-scan tools |
Pinout & Package
Package: 400-ball Fine-Pitch BGA (FG400), 23 × 23 mm body, 1.0 mm ball pitch, RoHS-compliant, thermal pad optional.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core power supply input for CLB and interconnect logic |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration logic and DCMs |
| A1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reload |
| D3 | INIT_B | Open-drain status output indicating configuration completion or error |
| R1 | CCLK | Configuration clock input/output - driven by master or external source during serial config |
| T2 | DIN | Serial configuration data input for Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter-reduced clock outputs, 0–255° phase shift, and 2×/4×/8× multiplication |
| SelectIO Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) enables mixed-voltage system integration without external translators |
| Embedded Multipliers | 24 × 18-bit hard multipliers accelerate DSP functions like FIR filtering and motor control loops |
| Boundary-Scan Logic | IEEE 1149.1-compliant TAP controller supports in-system programming and board-level testability |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and high-speed quadrature decoder logic with sub-microsecond latency. Use Value: 304 user I/Os enable direct connection to multiple axis drivers and fieldbus interfaces; DCMs stabilize timing across variable load conditions. | Use Scenario: Converting between HDMI 1.3a pixel clock domains and parallel RGB interface for display panels. IC Role / Device Role / Timing Role: Timing-critical pixel data resynchronization and format conversion using block RAM FIFOs and DCM-generated clocks. Use Value: 576 Kbits of block RAM buffers full HD lines; dual DCMs generate precise 74.25 MHz and 148.5 MHz clocks with < ±100 ps jitter. |
| Medical Imaging Data Acquisition | Avionics Sensor Interface |
Use Scenario: Aggregating and preprocessing raw ADC streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: High-throughput data path with pipelined FFT engines and real-time gain compensation logic. Use Value: 24 × 18-bit multipliers accelerate beamforming calculations; 17,280 logic cells support concurrent channel processing pipelines. | Use Scenario: Interfacing ARINC 429 receivers/transmitters and discrete sensor inputs in flight control units. IC Role / Device Role / Timing Role: Protocol state machine implementation and deterministic response timing for safety-critical signals. Use Value: SelectIO supports 10 V differential ARINC levels via external resistors; -4 speed grade ensures < 5 ns propagation delay for watchdog timeout paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Higher gate count (1M), 456-pin FBGA, 21,600 logic cells, 720 Kbits block RAM | Supports larger state machines and more parallel datapaths; requires PCB redesign due to different footprint | Choose when additional logic density or RAM is required beyond XC3S700A-4FG400C capacity |
| XC3S500E-4FG320C | Lower density (500K gates), 320-pin FBGA, 11,520 logic cells, 360 Kbits block RAM, enhanced ESD protection | Better suited for cost-sensitive industrial I/O modules with moderate logic needs | Choose for lower BOM cost where 304 I/Os and 576 Kbits RAM remain sufficient |
Compared with XC3S700A-4FG400C, XC3S1000-4FG456C offers higher resource headroom at the cost of larger footprint and power, while XC3S500E-4FG320C reduces cost and size but constrains logic and memory scalability for future feature expansion.
Availability
XC3S700A-4FG400C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and avionics sensor interface applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3S700A-4FG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3A family was designed for cost-optimized, high-volume embedded applications requiring reliable I/O flexibility, deterministic timing, and low-power programmable logic - especially in industrial automation and legacy interface bridging.
FAQ
What is the core supply voltage requirement for XC3S700A-4FG400C?
The XC3S700A-4FG400C requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to all G1/G2/H1/H2/J1/J2/K1/K2/L1/L2/M1/M2/N1/N2/P1/P2 pins. Deviation beyond tolerance risks timing violation or configuration loss. Decoupling capacitors must be placed within 10 mm of each VCCINT ball per Xilinx UG331 guidelines.
Does XC3S700A-4FG400C support JTAG boundary-scan testing?
Yes, XC3S700A-4FG400C integrates IEEE 1149.1-compliant TAP logic with dedicated TDI, TDO, TMS, and TCK pins. It supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions for board-level fault detection and in-system programming without requiring external configuration PROM.
Can XC3S700A-4FG400C operate with 2.5 V I/O banks?
Yes, XC3S700A-4FG400C supports 2.5 V I/O operation in dedicated banks (e.g., Bank 0, Bank 1) when VCCO is set to 2.5 V and compatible I/O standards (LVTTL, LVCMOS25) are selected. Each bank must be independently powered; mixing 2.5 V and 3.3 V banks on the same device is permitted.
What configuration modes does XC3S700A-4FG400C support?
XC3S700A-4FG400C supports Master Serial (via on-board SPI PROM), Slave SelectMAP (parallel loading from microprocessor), and JTAG (boundary-scan programming). Configuration mode is selected by M2:M0 pin states at power-up; no external mode-select logic is required for basic Master Serial use.
Is XC3S700A-4FG400C qualified for extended temperature operation?
No, XC3S700A-4FG400C is rated for commercial temperature range only (0 °C to +85 °C ambient). The 'C' suffix explicitly denotes commercial grade; industrial (-40 °C to +100 °C) or automotive variants are not available in the Spartan-3A family for this density and package.
XC3S700A-4FG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S700A-4FG400C FAQ
1.How can I place an order for XC3S700A-4FG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FG400C reliable?
The price and inventory of XC3S700A-4FG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FG400C is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FG400C?
XC3S700A-4FG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FG400C?
For technical support, including XC3S700A-4FG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FG400C requirements.
6.How does Aetrix verify that XC3S700A-4FG400C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FG400C meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FG400C?
All XC3S700A-4FG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FG400C part is unused and in its original packaging.
Return procedure for XC3S700A-4FG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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