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AMD XC3S700A-4FG400I
- Part No.:
- XC3S700A-4FG400I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S700A-4FG400I.pdf
- Description:
- IC FPGA 311 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,314
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Product details
Overview
XC3S700A-4FG400I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with I/O voltage support of 3.3V/2.5V/1.2V. It integrates up to 576 Kbits of block RAM and supports DDR SDRAM interfaces for embedded control and digital signal processing in industrial automation systems.
For engineers reviewing the XC3S700A-4FG400I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (304 user I/Os), speed grade (-4), temperature range (-40°C to +100°C), and configuration interface compatibility (JTAG, Master Serial).
Technical Context
The XC3S700A-4FG400I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic operations. It includes twelve 18×18 multipliers and supports Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction across multiple internal domains.
Configuration is performed via Master Serial mode using external PROM or through JTAG boundary-scan. The device supports SelectMAP and Slave Parallel modes for high-speed programming, and its I/O banks are independently configurable for LVCMOS, LVTTL, PCI, and SSTL standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - defines maximum combinational and sequential logic capacity for custom digital functions |
| User I/O Pins | 304 - supports high-density peripheral interfacing without external glue logic |
| Block RAM | 576 Kbits - enables on-chip data buffering and FIFO implementation for streaming applications |
| Speed Grade | -4 - guarantees timing closure at 333 MHz for critical paths in synchronous designs |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments including motor drives and PLCs |
| Configuration Mode | JTAG/Master Serial/Slave Parallel/SelectMAP - provides flexibility in production programming and field updates |
Pinout & Package
XC3S700A-4FG400I is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package measuring 23 mm × 23 mm with 0.8 mm ball pitch. The package supports thermal dissipation up to 2.5 W under typical operating conditions and is RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input - must be filtered locally to meet noise requirements for stable logic operation |
| P2 | VCCAUX | 2.5V auxiliary supply - powers configuration circuitry and DCMs; requires separate regulation |
| A1 | VCCO_0 | 3.3V I/O bank supply - sets output voltage level and input threshold for Bank 0 signals |
| T14 | TCK | JTAG test clock - synchronizes boundary-scan operations during programming and debug |
| R15 | TMS | JTAG test mode select - controls state transitions in the TAP controller |
| P15 | TDO | JTAG test data out - serially outputs scan chain results during verification |
| P16 | TDI | JTAG test data in - serially loads instructions and data into the JTAG chain |
| U1 | INIT_B | Open-drain initialization status - pulled low during configuration failure or CRC error detection |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device - enable jitter reduction, frequency synthesis, and phase alignment for multi-clock domain systems |
| Embedded Multipliers | Twelve 18×18-bit signed/unsigned multipliers - accelerate DSP algorithms without external components |
| SelectIO Technology | Support for 19 I/O standards - allows direct interfacing with memory, sensors, and legacy peripherals |
| Configuration Security | Bitstream encryption option - prevents reverse engineering of programmed logic in deployed systems |
| Power-Down Mode | Standby current < 50 µA - extends operational life in battery-backed monitoring applications |
Applications
| Industrial PLC Controller | Motor Drive Control Unit |
|---|---|
Use Scenario: Real-time motion profiling and PWM generation for servo and stepper motor control in factory automation. IC Role / Device Role / Timing Role: Configurable logic fabric executes closed-loop control algorithms; DCMs synchronize PWM timers and encoder sampling clocks. Use Value: Eliminates need for discrete timing ICs and microcontroller co-processors while supporting deterministic sub-microsecond response. | Use Scenario: Isolated gate driver interface and fault monitoring in 3-phase inverter modules. IC Role / Device Role / Timing Role: FPGA implements isolated SPI communication to gate drivers and processes overcurrent/overtemperature signals with programmable latency. Use Value: Enables adaptive dead-time adjustment and fast-shutdown response (< 200 ns) using on-chip logic and I/O delay calibration. |
| Video Surveillance Encoder | Test Equipment Pattern Generator |
Use Scenario: HD video preprocessing (de-interlacing, color space conversion) before compression in edge AI cameras. IC Role / Device Role / Timing Role: Block RAM buffers frame data; logic fabric applies pixel-level filtering; DCMs align sensor clock with processing pipeline. Use Value: Reduces external memory bandwidth by 40% via on-chip line buffers and pipelined processing stages. | Use Scenario: High-speed digital stimulus generation for ATE systems testing ASICs and memory devices. IC Role / Device Role / Timing Role: Generates synchronized multi-channel patterns at up to 200 MHz using I/O delay tuning and internal clock multiplication. Use Value: Achieves < ±50 ps channel-to-channel skew without external delay compensation hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Higher logic density (19,536 LCs), 456-pin FBGA, commercial temp range (0°C to +85°C) | Suitable for non-extended-temp lab equipment or prototyping where thermal margin is less constrained | Choose when additional logic resources are needed and industrial temperature qualification is not required |
| XC6SLX9-2TQG144I | Spartan-6 architecture, lower power, 144-pin TQFP package, 9,152 logic cells | Better suited for cost-sensitive, space-constrained designs with moderate I/O and timing requirements | Prefer for new designs targeting reduced static/dynamic power and simplified PCB layout |
Compared with XC3S700A-4FG400I, XC3S1000-4FG456C offers more logic but lacks extended temperature support, while XC6SLX9-2TQG144I delivers improved power efficiency and smaller footprint at the expense of I/O count and block RAM capacity.
Availability
XC3S700A-4FG400I is available at Aetrix Electronics and suitable for industrial automation, motor control, and video processing applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S700A-4FG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial markets.
The Spartan-3A family was designed for cost-optimized, high-volume embedded logic replacement in industrial and automotive subsystems, emphasizing I/O flexibility and configuration reliability.
FAQ
What is the maximum operating frequency supported by XC3S700A-4FG400I?
The XC3S700A-4FG400I speed grade -4 guarantees timing closure for internal logic paths up to 333 MHz under worst-case conditions. Actual achievable clock frequencies depend on design complexity, routing, and I/O standard selection. For example, DCM outputs can synthesize clean clocks up to 320 MHz with jitter below 200 ps RMS, and I/O registers support data rates up to 667 Mbps in DDR mode.
Does XC3S700A-4FG400I support configuration via SPI flash memory?
No, XC3S700A-4FG400I does not natively support SPI flash configuration. It supports Master Serial mode using XCFxx Platform Flash PROMs (parallel interface), JTAG, Slave Parallel, and SelectMAP. To use SPI flash, an external microcontroller or CPLD must manage bitstream loading into the FPGA's configuration shift register via JTAG or SelectMAP interface.
What are the power supply requirements for XC3S700A-4FG400I?
XC3S700A-4FG400I requires three independent supplies: VCCINT = 1.2V ±3% for core logic, VCCAUX = 2.5V ±3% for configuration and DCM circuits, and VCCO = 3.3V/2.5V/1.2V (per I/O bank) for output drivers and input receivers. Each supply must meet transient current demands and have local decoupling capacitors placed within 10 mm of respective power balls.
Can XC3S700A-4FG400I be used in safety-critical applications such as ISO 13849 PLd systems?
XC3S700A-4FG400I is not certified to functional safety standards like ISO 13849, IEC 61508, or ISO 26262. While it supports dual-redundant configuration and internal CRC checking, no FIT rate data, failure mode analysis, or diagnostic coverage metrics are published for this device. Safety-critical implementations require external monitoring, voting logic, and third-party certification of the full system architecture.
How many Digital Clock Managers (DCMs) are integrated in XC3S700A-4FG400I?
XC3S700A-4FG400I integrates two fully independent Digital Clock Managers (DCMs). Each DCM supports input clock frequency ranges from 24 MHz to 248 MHz, provides up to two fully independent output clocks, and offers features including phase shifting, duty cycle correction, frequency synthesis, and spread-spectrum clocking. Both DCMs can operate simultaneously with different input sources and configurations.
XC3S700A-4FG400I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 311
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S700A-4FG400I FAQ
1.How can I place an order for XC3S700A-4FG400I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FG400I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FG400I reliable?
The price and inventory of XC3S700A-4FG400I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FG400I is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FG400I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FG400I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FG400I?
XC3S700A-4FG400I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FG400I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FG400I?
For technical support, including XC3S700A-4FG400I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FG400I requirements.
6.How does Aetrix verify that XC3S700A-4FG400I is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FG400I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FG400I meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FG400I?
All XC3S700A-4FG400I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FG400I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FG400I part is unused and in its original packaging.
Return procedure for XC3S700A-4FG400I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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