AMD XC3S700A-4FG484C

Overview

XC3S700A-4FG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 13,248 logic cells, and 576 Kbits of block RAM. It features 376 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and uses a 484-pin Fine-Pitch Ball Grid Array (FBGA) package. It is used in industrial control logic, digital video processing, and reconfigurable embedded interfaces.

For engineers reviewing the XC3S700A-4FG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, block RAM capacity, speed grade timing, and FBGA thermal/mechanical compatibility with PCB layout constraints.

Technical Context

The XC3S700A-4FG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, HSTL, and SSTL across its 376 user I/O pins.

It integrates global clock networks with eight dedicated clock routing resources and supports internal configuration via Master Serial or JTAG modes. Configuration bitstream is loaded from external SPI PROM or microcontroller-controlled parallel interface.

Key Specifications

Pinout & Package

XC3S700A-4FG484C is housed in a 484-ball fine-pitch BGA (FBGA) package with 23×23 array, 1.0 mm ball pitch, and standard JEDEC MO-251 mechanical outline. Thermal pad is not present; power/ground balls are distributed across inner rows per Xilinx SP3A pinout conventions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S700A-4FG484C, XC3S1000-4FG456C offers more logic but fewer I/Os in a smaller package, while XC6SLX9-2TQG144C trades density, memory, and I/O flexibility for lower cost and simpler packaging-neither is pin-compatible or functionally drop-in.

Availability

XC3S700A-4FG484C is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and digital video processing applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3S700A-4FG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of legacy Spartan FPGA families under the AMD Adaptive SoC portfolio.

The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with integrated memory and I/O flexibility-targeting industrial, video, and communications edge systems.

FAQ

What is the maximum operating frequency supported by XC3S700A-4FG484C?

The XC3S700A-4FG484C has a -4 speed grade specifying guaranteed performance up to 250 MHz for internal logic paths. Actual achievable system clock frequency depends on design complexity, routing, and I/O timing constraints. The four embedded Digital Clock Managers (DCMs) support output frequencies up to 320 MHz with phase alignment and jitter reduction. XC3S700A-4FG484C does not guarantee 320 MHz across all paths-only DCM-synthesized clocks meet that specification under defined conditions.

Does XC3S700A-4FG484C support JTAG boundary-scan testing?

Yes, XC3S700A-4FG484C fully complies with IEEE 1149.1 (JTAG) for boundary-scan testing, in-system programming, and debug access. Its TCK, TMS, TDI, and TDO pins implement mandatory JTAG signals, and the TDO pin supports open-drain output with internal pull-up. XC3S700A-4FG484C also supports JTAG configuration mode, allowing bitstream loading without external PROM.

What power supply voltages are required for XC3S700A-4FG484C operation?

XC3S700A-4FG484C requires two primary supplies: VCCINT = 1.2 V ±3% for core logic, and VCCO = 1.2 V to 3.3 V (per I/O bank) for output drivers. Each I/O bank must have its own VCCO rail, and all VCCINT pins must be tied together and decoupled locally. XC3S700A-4FG484C does not require VCCAUX; auxiliary functions are powered from VCCINT and VCCO rails.

Can XC3S700A-4FG484C be configured using a microcontroller?

Yes, XC3S700A-4FG484C supports master serial configuration mode, enabling initialization from an external microcontroller via the DIN and CCLK pins. The microcontroller streams the configuration bitstream synchronously with CCLK, and XC3S700A-4FG484C asserts the DONE pin upon successful load. This method avoids external PROM and allows dynamic bitstream updates during system operation.

Is XC3S700A-4FG484C RoHS compliant and lead-free?

Yes, XC3S700A-4FG484C is manufactured in a lead-free, RoHS-compliant process. The 484-pin FBGA package uses matte tin surface finish and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). Full compliance documentation-including substance declarations and test reports-is available through AMD's product change notifications and material disclosure portals for XC3S700A-4FG484C.