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AMD XC3S700A-4FG484I
- Part No.:
- XC3S700A-4FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700A-4FG484I.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,479
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Product details
Overview
XC3S700A-4FG484I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 13,248 logic cells, and 512 KB of block RAM. It features 376 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and is rated for industrial temperature range (-40°C to +100°C). It is used in reconfigurable digital signal processing and embedded control systems.
For engineers reviewing the XC3S700A-4FG484I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, speed grade timing closure, industrial temperature support, and configuration interface compatibility (Master Serial, Slave SelectMAP).
Technical Context
The XC3S700A-4FG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per bank.
Configuration is performed via serial PROM, JTAG, or microprocessor bus (SelectMAP), with internal startup sequence controlling voltage ramp monitoring, configuration clock generation, and post-configuration I/O initialization. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 13,248 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| System Gates | 700,000 - legacy metric estimating equivalent ASIC gate count for logic density comparison |
| Block RAM | 512 KB - supports large FIFOs, buffers, or lookup tables without external memory |
| User I/O Pins | 376 - enables high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Speed Grade | -4 - guarantees worst-case propagation delay ≤4.5 ns for critical path timing closure |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Package | FG484 - 484-pin Fine-Pitch Ball Grid Array (19×19 mm, 1.0 mm pitch) |
Pinout & Package
XC3S700A-4FG484I is housed in a 484-ball fine-pitch BGA (FG484) package with 1.0 mm ball pitch and 19×19 array. Thermal and mechanical characteristics comply with JEDEC MO-230 specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered and decoupled within 10 mm of ball |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and DCM circuits |
| T14 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload |
| R15 | INIT_B | Open-drain status output indicating configuration memory readiness |
| U16 | DONE | Open-drain output signaling successful configuration completion |
| Y18 | TCK | JTAG test clock input - requires 10 kΩ pull-up for boundary scan compliance |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Two DCMs per device provide jitter-reduced clock synthesis, 0–255° phase shift, and 2×/4× frequency multiplication |
| SelectIO Technology | Supports 18 I/O standards across 16 banks with independent VCCO per bank (1.2 V to 3.3 V) |
| Embedded Multipliers | 24 × 18-bit hard multipliers enable efficient FIR filtering and math-intensive algorithms |
| Configuration Security | Bitstream encryption via AES-128 prevents unauthorized cloning or reverse engineering |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset - verified in Xilinx ISE 14.7 toolflow |
Applications
| Industrial Motor Control | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and high-speed I/O state machines. Use Value: 376 I/Os support simultaneous analog input sampling, digital output switching, and fieldbus communication (CAN, RS-485). | Use Scenario: Pixel data aggregation and preprocessing between CCD sensors and DSP subsystems in ultrasound systems. IC Role / Device Role / Timing Role: Configurable logic synchronizes parallel sensor streams and applies real-time histogram equalization. Use Value: 512 KB block RAM buffers full-frame image data while DCMs align multiple pixel clocks to sub-nanosecond skew. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging in flight control computers. IC Role / Device Role / Timing Role: FPGA implements protocol-specific transceivers and time-stamped message routing logic. Use Value: Industrial temperature rating ensures operation across cabin-to-cold-soak thermal cycles without configuration loss. | Use Scenario: High-speed digital stimulus generation for IC validation at up to 100 MHz vector rates. IC Role / Device Role / Timing Role: Logic fabric generates synchronized multi-channel patterns with precise setup/hold margins. Use Value: -4 speed grade guarantees deterministic timing for 100 MHz pattern edges with ≤0.5 ns jitter on output pins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG456C | Higher logic density (15,360 CLBs), same -4 speed grade, but 456-pin package and commercial temp range (0°C to +85°C) | Lacks industrial temperature qualification; unsuitable for extended ambient or uncontrolled enclosures | Select only if higher gate count is required and thermal environment is controlled |
| XC6SLX75-2FGG484C | Spartan-6 family; 74,691 logic cells, lower static power, DDR2/3 controller IP, but no native AES encryption | Requires migration to newer toolchain (Vivado); lacks bitstream encryption for secure deployments | Choose for new designs needing lower power and memory interface IP, not for drop-in replacement |
Compared with XC3S700A-4FG484I, XC3S1000-4FG456C offers more logic but sacrifices industrial temperature support, while XC6SLX75-2FGG484C provides modern peripherals and efficiency at the cost of legacy security features and toolchain compatibility.
Availability
XC3S700A-4FG484I is available at Aetrix Electronics and suitable for industrial motor control, medical imaging interface, avionics data concentrators, and test equipment pattern generators requiring stable component supply across extended product lifecycles.
Supply support for XC3S700A-4FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA portfolio. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded reconfigurable computing.
The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring industrial-grade reliability, moderate logic density, and mature toolchain support (ISE 14.7).
FAQ
What is the maximum operating frequency supported by the XC3S700A-4FG484I?
The XC3S700A-4FG484I supports internal logic operation up to 500 MHz when using Digital Clock Managers (DCMs) for clock multiplication and phase alignment. Its -4 speed grade guarantees timing closure for critical paths with ≤4.5 ns propagation delay, enabling reliable 200 MHz system clock domains without external PLLs. Actual achievable frequency depends on design placement, routing, and I/O standard selection.
Does the XC3S700A-4FG484I support JTAG boundary scan testing?
Yes, the XC3S700A-4FG484I fully supports IEEE 1149.1 JTAG boundary scan. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate at 3.3 V LVTTL levels. Boundary scan instruction register and device ID code are accessible via standard JTAG commands, and the feature is validated in Xilinx Impact 14.7 software for programming and verification.
Can the XC3S700A-4FG484I be configured using a microprocessor interface?
Yes, the XC3S700A-4FG484I supports Slave SelectMAP configuration mode, allowing an external microprocessor to load the configuration bitstream over an 8-/16-bit parallel bus. This mode uses dedicated pins (D0–D15, CCLK, RDWR_B, CS_B, BUSY, DONE) and is documented in UG332 v3.3. The XC3S700A-4FG484I requires no additional level-shifting for 3.3 V microprocessor interfaces.
Is the XC3S700A-4FG484I pin-compatible with other Spartan-3A devices in the FG484 package?
No, the XC3S700A-4FG484I is not pin-compatible with other Spartan-3A devices in the FG484 package. While the physical footprint matches, I/O bank assignments, VCCO requirements, and configuration pin functions differ across densities (e.g., XC3S500A vs. XC3S700A). Pin mapping must be verified against the specific device's pinout table in DS312 v5.5 before board reuse.
What configuration modes does the XC3S700A-4FG484I support?
The XC3S700A-4FG484I supports Master Serial (via external SPI PROM), Slave Serial, Slave SelectMAP, and JTAG configuration modes. Mode selection is determined by INIT_B, PROGRAM_B, and mode pins (M0–M2) at power-up. All modes are electrically and functionally supported per DS312 v5.5, with JTAG used for debugging and programming, and Master Serial preferred for production deployment.
XC3S700A-4FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700A-4FG484I FAQ
1.How can I place an order for XC3S700A-4FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FG484I reliable?
The price and inventory of XC3S700A-4FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FG484I is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FG484I?
XC3S700A-4FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FG484I?
For technical support, including XC3S700A-4FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FG484I requirements.
6.How does Aetrix verify that XC3S700A-4FG484I is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FG484I meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FG484I?
All XC3S700A-4FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FG484I part is unused and in its original packaging.
Return procedure for XC3S700A-4FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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