AMD XC3S700A-4FGG400C

Overview

XC3S700A-4FGG400C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 17,280 logic cells, and 512 KB of total block RAM. It features 376 user I/Os, operates at -4 speed grade (1.11 ns CLB delay), and is packaged in a 400-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch. It is used in industrial control logic, video interface bridging, and reconfigurable embedded peripherals.

For engineers reviewing the XC3S700A-4FGG400C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, speed grade timing closure, and FBGA thermal/mechanical compatibility in high-density PCB layouts.

Technical Context

The XC3S700A-4FGG400C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per I/O bank.

It includes digital clock managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction, supporting input frequencies from 1.5 MHz to 333 MHz and output jitter under 200 ps. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.

Key Specifications

Pinout & Package

XC3S700A-4FGG400C is housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 21×21 array, and thermal pad. The package supports JEDEC-standard reflow profiles and requires controlled impedance routing for high-speed I/O integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S700A-4FGG400C, XC3S1000-4FGG400C offers headroom for feature expansion without layout change, while XC3S500E-4FGG400C trades logic capacity for lower static power and bill-of-materials cost in fixed-function implementations.

Availability

XC3S700A-4FGG400C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and reconfigurable test equipment requiring stable component supply across extended production lifecycles.

Supply support for XC3S700A-4FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated systems.

The Spartan-3A family was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic, I/O flexibility, and deterministic timing - especially in industrial automation and video infrastructure.

FAQ

What is the maximum operating frequency supported by the XC3S700A-4FGG400C?

The XC3S700A-4FGG400C has a -4 speed grade, guaranteeing a 1.11 ns CLB propagation delay. This enables reliable system clock operation up to 250 MHz in typical designs, depending on routing and logic depth. DCM outputs support up to 333 MHz for derived clocks, subject to jitter and fanout constraints specified in the DS312 datasheet.

Does the XC3S700A-4FGG400C support JTAG boundary scan?

Yes, the XC3S700A-4FGG400C fully supports IEEE 1149.1 JTAG boundary scan. Pins TCK, TMS, TDI, and TDO are dedicated for this function, and the device implements mandatory instructions including SAMPLE/PRELOAD, EXTEST, and BYPASS. JTAG is used for configuration, debugging, and interconnect testing during board bring-up.

Can the XC3S700A-4FGG400C be configured via SPI flash memory?

No, the XC3S700A-4FGG400C does not support native SPI flash configuration. It uses Master Serial mode with x1 or x2 parallel PROMs (e.g., XCF02S, XCF04S), or Slave Serial mode driven by a microcontroller. SPI flash requires external controller logic or migration to Spartan-6 or newer families for native support.

What thermal considerations apply to the XC3S700A-4FGG400C in continuous operation?

The XC3S700A-4FGG400C has a maximum junction temperature of 85°C and requires thermal management based on actual power dissipation. With typical dynamic power of ~1.2 W and static power of ~150 mW, a 4-layer PCB with internal ground/power planes and exposed thermal pad soldering is recommended. Thermal vias under the package improve heat transfer to inner layers.

Is the XC3S700A-4FGG400C RoHS compliant and lead-free?

Yes, the XC3S700A-4FGG400C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FGG400 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3), requiring bake conditioning before reflow if exposed beyond floor life.