AMD XC3S700A-4FGG400I

Overview

XC3S700A-4FGG400I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 700,000 system gates, 17,280 logic cells, and 512 kbits of block RAM, housed in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports industrial temperature range (-40°C to +85°C), commonly used in industrial control logic and embedded vision preprocessing.

For engineers reviewing the XC3S700A-4FGG400I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (304 user I/Os), differential signaling support (LVDS, LVPECL), internal clock management (DLL-based), and configuration interface options (Master Serial, Slave SelectMAP).

Technical Context

The XC3S700A-4FGG400I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates twelve Digital Clock Managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis across multiple clock domains.

Configuration is performed via external SPI PROM or JTAG, supporting boundary-scan testing and in-system reprogramming. The device uses 1.2 V core voltage and 3.3 V or 2.5 V I/O banks, with programmable slew rate and drive strength per bank.

Key Specifications

Pinout & Package

XC3S700A-4FGG400I is packaged in a 400-ball Fine-Pitch BGA (FGG) with 1 mm ball pitch, 23×23 array, and thermal pad. Package dimensions are 23 mm × 23 mm × 1.8 mm (height), RoHS-compliant and lead-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1000-4FGG456C and XC6SLX9-2TQG144I, the XC3S700A-4FGG400I uniquely balances industrial temperature operation, 304 I/Os, and 12 DCMs-making it optimal for deterministic, multi-peripheral embedded control where thermal robustness and clock domain isolation are critical.

Availability

XC3S700A-4FGG400I is available at Aetrix Electronics and suitable for industrial motion control, embedded vision preprocessing, and protocol bridging gateway applications requiring stable component supply and long-term lifecycle support.

Supply support for XC3S700A-4FGG400I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.

The Spartan-3A family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, industrial temperature operation, and flexible I/O interfacing-targeting industrial automation, machine vision, and communications infrastructure.

FAQ

What is the maximum supported I/O standard voltage for XC3S700A-4FGG400I?

The XC3S700A-4FGG400I supports I/O standards up to 3.3 V in dedicated banks, with individual banks configurable for 3.3 V, 2.5 V, 1.8 V, or 1.5 V operation. VCCO must match the selected I/O standard voltage per bank, and no single bank may exceed 3.3 V. This capability is documented in the Spartan-3A DC and Switching Characteristics datasheet (DS312, Table 13).

Does XC3S700A-4FGG400I include built-in configuration memory?

No, the XC3S700A-4FGG400I does not include on-chip nonvolatile configuration memory. It requires external configuration sources such as serial PROM (Master Serial mode) or microprocessor-controlled parallel loading (Slave SelectMAP). Configuration bitstream is loaded on power-up or via PROGRAM_B assertion, and the DONE pin signals completion.

Can XC3S700A-4FGG400I operate with a single 3.3 V supply?

No, XC3S700A-4FGG400I requires three distinct supply voltages: 1.2 V for VCCINT (core), 2.5 V for VCCAUX (auxiliary/configuration), and 3.3 V (or lower) for VCCO (I/O banks). Using only 3.3 V will damage the core logic and prevent configuration. Each supply must meet ripple and sequencing requirements specified in DS312 Section 5.

How many global clock networks does XC3S700A-4FGG400I support?

The XC3S700A-4FGG400I provides eight global clock lines driven by dedicated BUFGMUX resources, each capable of routing clocks from DCM outputs or external pins. These networks distribute low-skew clocks to all regions of the FPGA fabric, supporting synchronous design across large logic partitions without added routing delay.

Is XC3S700A-4FGG400I compatible with Xilinx ISE Design Suite 14.7?

Yes, XC3S700A-4FGG400I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device files, libraries, and constraint templates for the XC3S700A-4FGG400I are included in ISE 14.7 Service Pack 5 and later, and no third-party toolchain is required for full development flow.