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AMD XC3S700A-4FGG484C
- Part No.:
- XC3S700A-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700A-4FGG484C.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:153
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Product details
Overview
XC3S700A-4FGG484C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and embedded block RAM totaling 576 Kbits. It operates at -4 speed grade with 1.2 V core voltage and supports LVCMOS/LVTTL I/O standards. It is used in industrial control logic and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC3S700A-4FGG484C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (376 user I/Os), package type (Fine-Pitch BGA), thermal performance (484-pin FGG package), and supported configuration modes (Master Serial, Slave SelectMAP).
Technical Context
The XC3S700A-4FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates twelve 18×18-bit binary multipliers and supports up to 376 user-defined I/O pins with programmable slew rate and drive strength.
Configuration is performed via external PROM or processor interface using JTAG, Master Serial, or Slave SelectMAP modes. The device includes internal oscillator for startup and supports boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - determines maximum combinational/sequential logic capacity |
| System Gates | 700,000 - legacy metric estimating equivalent gate count for ASIC comparison |
| User I/O Pins | 376 - supports high-density peripheral interfacing with configurable standards |
| Block RAM | 576 Kbits - enables on-chip data buffering and FIFO implementation |
| Embedded Multipliers | 12 × 18×18-bit - accelerates DSP arithmetic without external components |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and thermal design margin |
| Speed Grade | -4 - specifies worst-case propagation delay for timing closure at 1.2 V |
Pinout & Package
XC3S700A-4FGG484C is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 23×23 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad is not present; thermal management relies on PCB copper area and airflow.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLB and interconnect logic |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and I/O banks |
| A1 | PROGRAM_B | Active-low asynchronous reset initiating configuration reload |
| D3 | INIT_B | Open-drain status output indicating configuration progress |
| E2 | CCLK | Configuration clock input for Master Serial mode |
| H2 | DIN | Serial configuration data input in Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O Banks | Four independent banks support mixed 3.3 V / 2.5 V / 1.8 V / 1.5 V signaling |
| SelectMAP Configuration | Parallel 8-/16-bit interface enables fast FPGA programming from microcontroller |
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide jitter reduction, frequency synthesis, and phase shifting |
| Boundary-Scan Support | IEEE 1149.1 compliance enables board-level test and debug without physical probes |
| Internal Oscillator | ~4 MHz RC oscillator allows configuration without external clock source |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machine controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implements custom PWM generators, position comparators, and safety interlock state machines. Use Value: Deterministic timing from DCMs ensures sub-microsecond jitter control for synchronized axis movement. | Use Scenario: Pattern generation and response capture for semiconductor wafer probing. IC Role / Device Role / Timing Role: FPGA acts as high-speed digital vector engine, managing parallel stimulus application and pass/fail analysis. Use Value: 376 user I/Os enable simultaneous connection to multiple DUT pins without multiplexing overhead. |
| Medical Imaging Interface | Communications Baseband Processing |
Use Scenario: Pixel data aggregation and preprocessing between CCD sensors and image processors in ultrasound systems. IC Role / Device Role / Timing Role: XC3S700A-4FGG484C serves as a bridging and protocol-conversion engine handling LVDS-to-parallel conversion. Use Value: Embedded block RAM buffers bursty sensor streams while maintaining real-time throughput. | Use Scenario: Channelization and symbol mapping in point-to-point wireless transceivers. IC Role / Device Role / Timing Role: Reconfigurable datapath executes FFT, filtering, and modulation algorithms under firmware control. Use Value: Twelve 18×18-bit multipliers accelerate baseband math operations with single-cycle latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Higher logic density (19,200 CLBs), same architecture, but 456-pin package and reduced I/O count (292) | Better suited for larger state machines and wider datapaths; less I/O flexibility | Select when logic resource demand exceeds XC3S700A-4FGG484C capacity and I/O count is secondary |
| XC3S500E-4FGG320C | Lower density (11,136 CLBs), smaller 320-pin package, and no embedded multipliers | Limited DSP capability; suitable only for control-oriented designs without arithmetic acceleration | Choose for cost-sensitive, non-DSP applications where footprint and BOM cost outweigh performance needs |
Compared with XC3S700A-4FGG484C, XC3S1000-4FGG456C trades I/O count for logic resources, while XC3S500E-4FGG320C omits multipliers and reduces both logic and I/O-making XC3S700A-4FGG484C the balanced choice for mixed logic/DSP workloads requiring high pin count.
Availability
XC3S700A-4FGG484C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term production support.
Supply support for XC3S700A-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development of FPGA product lines originally designed for cost-effective, high-volume embedded logic applications.
The Spartan-3A family was engineered for mainstream industrial and communications systems where predictable timing, low power, and I/O flexibility outweigh cutting-edge process node advantages.
FAQ
What configuration modes does the XC3S700A-4FGG484C support?
The XC3S700A-4FGG484C supports Master Serial, Slave Serial, Slave SelectMAP, and JTAG configuration modes. Master Serial uses an external PROM and CCLK-driven DIN stream; SelectMAP enables parallel loading via microcontroller GPIO. JTAG is used for debugging and in-system programming. All modes are documented in Xilinx UG332 and require correct INIT_B and DONE pin handling during boot.
Does the XC3S700A-4FGG484C include analog features like ADCs or PLLs?
No, the XC3S700A-4FGG484C does not integrate ADCs, DACs, or PLLs. It includes four Digital Clock Managers (DCMs) for clock synthesis and jitter reduction, but these are all-digital delay-locked loop (DLL) structures-not analog PLLs. Analog functions must be implemented externally or via companion ICs.
What is the maximum operating temperature for the XC3S700A-4FGG484C?
The XC3S700A-4FGG484C is rated for commercial temperature range: 0 °C to +85 °C ambient. This applies to the -4 speed grade in the FGG484 package. Junction temperature must remain below 100 °C under sustained operation, requiring appropriate PCB thermal vias and copper pour per Xilinx XPE thermal guidelines.
Can the XC3S700A-4FGG484C be programmed in-system via JTAG after soldering?
Yes, the XC3S700A-4FGG484C supports in-system programming (ISP) via IEEE 1149.1 JTAG. Boundary-scan TAP controls configuration memory loading without requiring power cycle or external PROM. Xilinx iMPACT or Vivado Hardware Manager tools are used, and PCB must route TCK, TMS, TDI, TDO, and TREN_B to accessible test points or headers.
Is the XC3S700A-4FGG484C pin-compatible with other Spartan-3A devices?
No, the XC3S700A-4FGG484C is not pin-compatible with other Spartan-3A devices due to differing ball counts and I/O bank arrangements. For example, XC3S500E-4FGG320C uses a 320-pin grid, and XC3S1000-4FGG456C uses 456 pins with different power/ground ball placement. Migration requires PCB redesign.
XC3S700A-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700A-4FGG484C FAQ
1.How can I place an order for XC3S700A-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FGG484C reliable?
The price and inventory of XC3S700A-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FGG484C?
XC3S700A-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FGG484C?
For technical support, including XC3S700A-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FGG484C requirements.
6.How does Aetrix verify that XC3S700A-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FGG484C?
All XC3S700A-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FGG484C part is unused and in its original packaging.
Return procedure for XC3S700A-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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