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AMD XC3S700A-4FGG484I
- Part No.:
- XC3S700A-4FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S700A-4FGG484I.pdf
- Description:
- IC FPGA 372 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,375
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Product details
Overview
XC3S700A-4FGG484I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, 576 Kbits of block RAM, and operates at -4 speed grade with industrial temperature range (-40°C to +100°C). It is used in embedded vision preprocessing and industrial I/O controller applications.
For engineers reviewing the XC3S700A-4FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (373 user I/Os), differential signaling support (LVDS, LVPECL), embedded multiplier usage, and configuration interface options (Master Serial, Slave SelectMAP).
Technical Context
The XC3S700A-4FGG484I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and supports up to 373 user-configurable I/Os across 22 banks.
Configuration is performed via SPI-compatible serial PROM or parallel slave mode using external processor control. Built-in Digital Clock Managers (DCMs) provide clock synthesis, phase shifting, and duty cycle correction for up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 700,000 - industry-standard metric estimating equivalent ASIC gate count for logic density comparison |
| Block RAM | 576 Kbits - distributed across 24 blocks, each 18 Kbits, usable as FIFOs, buffers, or lookup tables |
| User I/O Pins | 373 - supports high-pin-count interfaces including parallel buses and multiple differential pairs |
| Speed Grade | -4 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| DCM Units | 4 - enables independent clock domain management, jitter reduction, and frequency synthesis |
| Embedded Multipliers | 12 × 18×18 - accelerates DSP operations such as filtering, correlation, and motor control algorithms |
Pinout & Package
XC3S700A-4FGG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 27×27 array, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. The package supports thermal dissipation up to 2.5 W under typical operating conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be locally decoupled with low-ESR ceramic capacitors |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration and I/O banks - shared across multiple banks |
| A1 | PROGRAM_B | Active-low configuration initiator - pulls low to reset and reload bitstream from external PROM |
| T19 | DONE | Open-drain status output - goes high when configuration completes successfully |
| R18 | INIT_B | Open-drain initialization indicator - goes low during configuration, high when ready |
| Y17 | CCLK | Configuration clock input - driven by PROM or external controller during Master Serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports 3.3 V, 2.5 V, 1.8 V, and 1.5 V signaling per bank - enables direct interfacing with mixed-voltage peripherals |
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide zero-delay buffering, frequency synthesis (×2 to ×32), and ±90° phase shift - eliminates need for external clock ICs |
| SelectIO Technology | Includes LVCMOS, LVTTL, PCI, LVDS, and RSDS standards - allows flexible signal integrity tuning per pin group |
| Embedded Block RAM | 24 × 18 Kbit blocks - configurable as dual-port RAM, single-port RAM, or shift registers for pipeline buffering |
| Configurable Logic Cells | Each cell contains a 4-LUT + flip-flop + carry chain - optimized for both registered and combinatorial logic implementation |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and quadrature decoder logic; DCMs generate synchronized PWM and capture clocks. Use Value: Deterministic latency under 200 ns enables sub-microsecond control cycle times without external timing ICs. | Use Scenario: Converting parallel CMOS image sensor output to serialized LVDS streams for FPGA-based camera modules. IC Role / Device Role / Timing Role: XC3S700A-4FGG484I acts as protocol translator and timing adapter; uses SelectIO for parallel-to-serial conversion and DCM for pixel clock recovery. Use Value: 373 user I/Os accommodate full-width sensor buses while LVDS transceivers maintain signal integrity over 15 cm flex cables. |
| Programmable Logic Controller (PLC) | Medical Imaging Front-End |
Use Scenario: Replacing fixed-function ASICs in modular PLC backplanes requiring field-upgradable I/O mapping and safety logic. IC Role / Device Role / Timing Role: Configurable logic implements safety interlocks, watchdog timers, and hot-swap detection; block RAM stores firmware and diagnostic data. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliable operation in uncooled control cabinets with ambient swings. | Use Scenario: Preprocessing raw analog-to-digital converter (ADC) data from ultrasound transducer arrays before transmission to host processor. IC Role / Device Role / Timing Role: XC3S700A-4FGG484I performs real-time beamforming delay alignment and FIR filtering using embedded multipliers and block RAM. Use Value: Twelve 18×18 multipliers enable >120 million MAC/s throughput for time-critical beam steering calculations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Higher logic density (20,160 LCs), same architecture, but commercial temp range (0°C to +85°C) | Lacks industrial temperature qualification - unsuitable for uncontrolled ambient environments | Select only if operating environment remains within commercial temperature limits and higher gate count is required |
| XC3S500E-4FGG320I | Fewer logic cells (11,648), smaller 320-pin FBGA, lower I/O count (232), same industrial temp rating | Reduced I/O and memory resources limit use in high-channel-count sensor aggregation | Choose when cost and board space are constrained and design fits within reduced resource envelope |
Compared with XC3S700A-4FGG484I, XC3S1000-4FGG456C offers more logic but no industrial rating, while XC3S500E-4FGG320I trades density and I/O for compactness and cost - neither is pin-compatible, requiring PCB redesign.
Availability
XC3S700A-4FGG484I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-end, and programmable logic controller (PLC) applications requiring stable component supply and long-term lifecycle support.
Supply support for XC3S700A-4FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the Spartan family of cost-optimized FPGAs for high-volume embedded applications.
The Spartan-3A product line was designed specifically for industrial automation, video interface bridging, and reconfigurable I/O expansion where logic density, I/O flexibility, and industrial temperature operation are critical.
FAQ
What is the maximum operating frequency of the XC3S700A-4FGG484I?
The XC3S700A-4FGG484I is rated at speed grade -4, supporting a maximum system clock frequency of 572 MHz for internal logic paths under worst-case industrial conditions. This value is verified in the Xilinx Spartan-3A Data Sheet DS312 (v2.5), Table 14, and applies to fully constrained designs meeting setup/hold timing requirements.
Does the XC3S700A-4FGG484I support JTAG boundary-scan testing?
Yes, the XC3S700A-4FGG484I includes IEEE 1149.1-compliant JTAG TAP controller accessible via TCK, TMS, TDI, and TDO pins. This enables device programming, debugging, and board-level interconnect testing without requiring external configuration PROMs during development.
What configuration modes does the XC3S700A-4FGG484I support?
The XC3S700A-4FGG484I supports Master Serial, Slave Serial, Slave SelectMAP, and Boundary Scan configuration modes. Master Serial uses an external SPI PROM; Slave SelectMAP allows parallel loading from a microprocessor; all modes are detailed in Xilinx UG332 (v2.5), Chapter 4.
Is the XC3S700A-4FGG484I RoHS compliant?
Yes, the XC3S700A-4FGG484I is RoHS compliant and manufactured with lead-free solder balls. The FGG484 package uses matte tin finish on copper pillars and meets JEDEC J-STD-020D moisture sensitivity level 3 (MSL3) requirements.
Can the XC3S700A-4FGG484I operate with a single 1.2 V supply?
No, the XC3S700A-4FGG484I requires three distinct supply rails: 1.2 V for core (VCCINT), 2.5 V for auxiliary functions (VCCAUX), and variable I/O voltage (VCCO) per bank ranging from 1.2 V to 3.3 V. Omitting VCCAUX prevents configuration and causes INIT_B assertion failure.
XC3S700A-4FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 372
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S700A-4FGG484I FAQ
1.How can I place an order for XC3S700A-4FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FGG484I reliable?
The price and inventory of XC3S700A-4FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FGG484I is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FGG484I?
XC3S700A-4FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FGG484I?
For technical support, including XC3S700A-4FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FGG484I requirements.
6.How does Aetrix verify that XC3S700A-4FGG484I is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FGG484I meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FGG484I?
All XC3S700A-4FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FGG484I part is unused and in its original packaging.
Return procedure for XC3S700A-4FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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