My Inquiry
My Account
AMD XC3S700A-4FT256I
- Part No.:
- XC3S700A-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S700A-4FT256I.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,571
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S700A-4FT256I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and 320 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
For engineers reviewing the XC3S700A-4FT256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, industrial-grade thermal performance, configuration interface options (JTAG, Master Serial, Slave SelectMAP), and embedded block RAM capacity (576 Kbits).
Technical Context
The XC3S700A-4FT256I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.
Configuration is performed via external PROM, JTAG boundary-scan, or microprocessor interface. The device supports full IEEE 1149.1 JTAG compliance and includes internal startup circuitry with programmable configuration modes and power-on reset sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - determines maximum combinational/sequential logic capacity per design |
| System Gates | 700,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| I/O Pins | 320 - supports high-pin-count peripheral interfacing with banked voltage domains |
| Block RAM | 576 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DCMs | 8 - provides clock deskew, frequency multiplication/division, and jitter reduction for synchronous designs |
| Speed Grade | -4 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation applications |
Pinout & Package
XC3S700A-4FT256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and standard JEDEC MO-251AC footprint. Pin assignments are organized into 12 I/O banks supporting independent VCCO voltages per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output indicating successful configuration completion |
| H2 | INIT_B | Active-low open-drain output signaling configuration status and reinitialization readiness |
| J1 | PROGRAM_B | Active-low input initiating configuration reset and clearing configuration memory |
| K2 | TCK | JTAG test clock input for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select controlling TAP controller state transitions |
| M2 | TDO | JTAG test data output carrying boundary-scan or debug data |
| N1 | TDI | JTAG test data input feeding instructions and data to the TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Twelve 18×18-bit signed/unsigned multipliers enable real-time DSP operations without LUT resource overhead |
| Digital Clock Managers (DCMs) | Eight DCMs provide deterministic clock phase alignment and frequency synthesis across multiple clock domains |
| SelectIO Technology | Support for 19 I/O standards including LVDS, RSDS, and differential HSTL enables mixed-signaling board interfaces |
| Embedded Block RAM | 576 Kbits distributed across 32 blocks (18 Kbits each) allows flexible memory depth/width configuration |
| Configuration Security | Bitstream encryption option prevents unauthorized reverse engineering of programmed logic functionality |
Applications
| Industrial Motor Control | Automotive ADAS Preprocessing |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety-critical motion profiling in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond latency. Use Value: 320 I/O pins support simultaneous analog sensor inputs, digital actuator outputs, and CAN/LIN bus interfaces within one device. | Use Scenario: Pixel-level preprocessing of camera sensor streams before feeding to vision SoC in lane-departure or blind-spot detection systems. IC Role / Device Role / Timing Role: High-speed parallel image buffer and pixel-domain filtering using embedded block RAM and distributed arithmetic logic. Use Value: Twelve 18×18 multipliers accelerate convolution kernels while maintaining deterministic timing under automotive thermal stress. |
| Medical Imaging Interface | Test & Measurement Equipment |
Use Scenario: Synchronizing ultrasound transducer arrays and digitizing echo return signals with precise time-of-flight resolution. IC Role / Device Role / Timing Role: Timing-critical data acquisition engine with DCM-controlled sampling clocks and low-jitter I/O timing. Use Value: Eight DCMs allow independent clock domain management for ADC sampling, memory buffering, and USB 2.0 host interface. | Use Scenario: Protocol bridging between legacy GPIB instruments and modern Ethernet-based test platforms. IC Role / Device Role / Timing Role: Reconfigurable protocol engine implementing custom handshaking, data serialization, and error correction logic. Use Value: 17,280 logic cells accommodate dual-interface state machines plus real-time data compression firmware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FT256I | Higher logic density (20,160 LCs, 1M gates), same package and speed grade | Better suited for designs requiring additional logic resources without changing PCB layout | Select when future design scalability or added IP integration (e.g., soft-core processor) is required |
| XC3S500E-4FT256C | Lower density (11,136 LCs, 500K gates), commercial temp range (0°C to +70°C), same pinout | Not qualified for industrial ambient operation; limited to controlled-environment instrumentation | Choose only for cost-sensitive, non-industrial applications where thermal margin is guaranteed |
Compared with XC3S700A-4FT256I, the XC3S1000-4FT256I offers headroom for logic expansion without layout change, while the XC3S500E-4FT256C sacrifices industrial temperature rating and gate count for lower unit cost-making it unsuitable for field-deployed equipment.
Availability
XC3S700A-4FT256I is available at Aetrix Electronics and suitable for industrial motor control, automotive ADAS preprocessing, and medical imaging interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC3S700A-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.
The Spartan-3A family-including XC3S700A-4FT256I-was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable programmable logic with integrated clock management and I/O flexibility.
FAQ
What is the configuration method supported by XC3S700A-4FT256I?
XC3S700A-4FT256I supports three primary configuration methods: Master Serial (via on-chip oscillator and external PROM), JTAG boundary-scan (for programming and debugging), and Slave SelectMAP (for microprocessor-controlled loading). All methods are fully documented in DS312 v2.5 and require no external configuration controller.
Does XC3S700A-4FT256I include built-in flash memory for configuration storage?
No, XC3S700A-4FT256I does not contain on-chip nonvolatile configuration memory. It requires an external serial PROM (e.g., XCF02S or XCF04S) or microprocessor-based configuration source. Configuration bitstream is loaded on power-up or after PROGRAM_B assertion.
What is the maximum operating frequency of the DCMs in XC3S700A-4FT256I?
The Digital Clock Managers (DCMs) in XC3S700A-4FT256I support input frequencies up to 200 MHz and generate output frequencies ranging from 24 MHz to 400 MHz, depending on multiplication/division settings and load conditions. Timing analysis must be performed using Xilinx ISE 14.7 tools for specific DCM configurations.
Can XC3S700A-4FT256I operate in a 3.3V I/O environment?
Yes, XC3S700A-4FT256I supports 3.3V LVTTL and LVCMOS I/O standards when VCCO for the corresponding I/O bank is set to 3.3V. Each of the 12 I/O banks has independent VCCO supply, allowing mixed-voltage operation across different peripheral interfaces.
Is XC3S700A-4FT256I RoHS compliant and lead-free?
Yes, XC3S700A-4FT256I is RoHS-compliant and manufactured with lead-free FBGA packaging per JEDEC J-STD-020D moisture sensitivity level 3. The device meets EU Directive 2011/65/EU and carries the "Pb-Free" marking on the top-side laser etch.
XC3S700A-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 161
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S700A-4FT256I FAQ
1.How can I place an order for XC3S700A-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FT256I reliable?
The price and inventory of XC3S700A-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FT256I?
XC3S700A-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FT256I?
For technical support, including XC3S700A-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FT256I requirements.
6.How does Aetrix verify that XC3S700A-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FT256I?
All XC3S700A-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FT256I part is unused and in its original packaging.
Return procedure for XC3S700A-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S700A-4FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
