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AMD XC3S700A-4FTG256C
- Part No.:
- XC3S700A-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S700A-4FTG256C.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,922
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Product details
Overview
XC3S700A-4FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and 320 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at -4 speed grade with 1.2 V core voltage and supports SelectIO standards including LVCMOS, LVTTL, and SSTL.
For engineers reviewing the XC3S700A-4FTG256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic density, embedded RAM blocks (360 kbits), differential signaling support (LVDS), and configuration via Master Serial or JTAG interface.
Technical Context
The XC3S700A-4FTG256C implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and up to 360 kbits of block RAM organized as thirty-six 10,000-bit blocks.
Configuration is supported through Master Serial mode using external PROM or via JTAG boundary-scan for programming and debugging. The device includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across up to eight user clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides combinational and sequential logic capacity for medium-complexity digital systems |
| System Gates | 700,000 - indicates overall logic capacity compatible with ASIC-style gate-count estimation |
| I/O Pins | 320 - supports high-pin-count interfaces such as video data buses, memory controllers, or parallel sensor arrays |
| Block RAM | 360 kbits - enables on-chip buffering, FIFOs, or small lookup tables without external memory |
| DCMs | 4 - delivers jitter-reduced clock outputs, phase alignment, and frequency synthesis for synchronous design |
| Core Voltage | 1.2 V - defines power supply requirement and impacts dynamic power consumption and thermal design |
| Speed Grade | -4 - specifies maximum operating frequency for timing-critical paths (e.g., 572 MHz DCM input) |
Pinout & Package
XC3S700A-4FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and standard JEDEC MO-225AC footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG380.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for internal logic; requires low-noise decoupling near package corners |
| VCCO_0 | I/O Bank Power | Configurable 1.2–3.3 V supply per bank; sets voltage standard for associated I/O pins |
| PROGRAM_B | Configuration Initiate | Active-low signal that resets configuration logic and clears SRAM contents |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and initialization |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 boundary-scan signals for programming, testing, and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers enable real-time DSP operations without external ICs |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate control per pin |
| Digital Clock Manager (DCM) | Four DCMs provide deterministic clock deskew, frequency synthesis, and 0–255° phase shift |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic functionality |
| Partial Reconfiguration | Enables dynamic logic module swapping during operation for adaptive hardware behavior |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with encoder feedback and PWM generation for multi-axis CNC systems. IC Role / Device Role / Timing Role: FPGA acts as deterministic timing engine and logic controller, synchronizing position capture, PID computation, and gate driver signals. Use Value: 320 I/O pins support parallel encoder inputs and isolated PWM outputs; DCMs ensure sub-microsecond jitter for motion timing accuracy. | Use Scenario: Converting HDMI 1.3a pixel data to LVDS panel interface for industrial displays. IC Role / Device Role / Timing Role: Protocol translator and timing adapter handling pixel clock domain crossing and data serialization. Use Value: Embedded multipliers assist in color space conversion; SelectIO supports both 3.3 V HDMI receiver and 2.5 V LVDS transmitter standards. |
| Medical Imaging Front-End | Programmable Logic Tester |
Use Scenario: Digitizing and preprocessing analog signals from ultrasound transducer arrays before transmission to host processor. IC Role / Device Role / Timing Role: High-speed data acquisition controller managing ADC synchronization, channel multiplexing, and FIR filtering. Use Value: 360 kbits block RAM buffers raw echo data; 17,280 logic cells implement real-time beamforming algorithms. | Use Scenario: Emulating legacy TTL/CMOS logic devices for production test fixture validation. IC Role / Device Role / Timing Role: Reconfigurable stimulus generator and response analyzer with precise timing control over test vectors. Use Value: -4 speed grade ensures < 3.5 ns propagation delay for setup/hold compliance; JTAG interface enables automated test script deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FG320C | Higher logic density (19,200 LCs), 320-pin FBGA, same architecture but larger die and higher static power | Better suited for designs requiring >700K gates or additional block RAM (576 kbits) | Select when future scalability or increased on-chip memory is required without changing toolchain |
| XC6SLX9-2TQG144C | Lower density (9,152 LCs), smaller 144-pin TQFP package, Spartan-6 architecture with improved DSP slices and lower power | Preferred for cost-sensitive, lower-I/O-count applications where migration to newer silicon process is acceptable | Choose for new designs targeting reduced BOM cost and better power efficiency, accepting reduced I/O count |
Compared with XC3S700A-4FTG256C, XC3S1000-4FG320C offers greater logic capacity in identical packaging form factor, while XC6SLX9-2TQG144C trades I/O and density for lower power and modern fabrication-neither is pin-compatible, but both share Xilinx ISE toolchain compatibility.
Availability
XC3S700A-4FTG256C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-end, video interface bridge, and programmable logic tester applications requiring stable component supply and long-term obsolescence management.
Supply support for XC3S700A-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-3A family was designed by Xilinx for cost-sensitive, high-volume applications requiring moderate logic density, rich I/O flexibility, and robust configuration security-targeting industrial automation, video processing, and communications infrastructure.
FAQ
What is the configuration method supported by XC3S700A-4FTG256C?
XC3S700A-4FTG256C supports Master Serial configuration using external SPI PROM and JTAG boundary-scan programming. The device boots from external memory upon power-up and allows in-system reprogramming via JTAG. Configuration modes are selected using mode pins M2:M0, and the DONE pin confirms successful initialization of XC3S700A-4FTG256C.
Does XC3S700A-4FTG256C support differential I/O standards?
Yes, XC3S700A-4FTG256C supports LVDS, RSDS, and BLVDS differential standards on dedicated I/O pairs. These are implemented using internal termination and require proper PCB routing with controlled impedance. Differential signaling capability is confirmed in Xilinx DS312 and applies specifically to XC3S700A-4FTG256C's I/O banks configured for 2.5 V or 3.3 V VCCO.
What is the maximum operating frequency of XC3S700A-4FTG256C?
The -4 speed grade of XC3S700A-4FTG256C specifies a maximum DCM input frequency of 572 MHz and a typical system clock performance of 333 MHz for register-to-register paths. Actual achievable frequency depends on design placement, routing, and resource utilization. Timing reports generated by Xilinx ISE for XC3S700A-4FTG256C confirm these limits under worst-case conditions.
Can XC3S700A-4FTG256C be used in automotive applications?
No, XC3S700A-4FTG256C is rated for commercial temperature range (0°C to 85°C) and is not qualified to AEC-Q100 or automotive reliability standards. Its packaging and test flow do not meet automotive qualification requirements. For automotive use, designers should consider Xilinx Automotive-grade Spartan-6 or AMD Versal derivatives instead of XC3S700A-4FTG256C.
Is bitstream encryption available on XC3S700A-4FTG256C?
Yes, XC3S700A-4FTG256C supports optional AES-128 bitstream encryption using a user-provided key stored in on-chip eFUSE. This feature protects intellectual property by preventing unauthorized readback or cloning of the programmed logic design. Encryption is enabled during bitstream generation in Xilinx ISE and applies exclusively to XC3S700A-4FTG256C when configured with the appropriate security options.
XC3S700A-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 161
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S700A-4FTG256C FAQ
1.How can I place an order for XC3S700A-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FTG256C reliable?
The price and inventory of XC3S700A-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FTG256C?
XC3S700A-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FTG256C?
For technical support, including XC3S700A-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FTG256C requirements.
6.How does Aetrix verify that XC3S700A-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FTG256C?
All XC3S700A-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S700A-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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