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AMD XC3S700A-4FTG256I
- Part No.:
- XC3S700A-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S700A-4FTG256I.pdf
- Description:
- IC FPGA 161 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,022
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Product details
Overview
XC3S700A-4FTG256I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 700,000 system gates, 17,280 logic cells, and embedded block RAM totaling 576 Kbits. It operates at -4 speed grade with I/O voltage support of 3.3V/2.5V/1.8V/1.5V and is qualified for industrial temperature range (-40°C to +100°C). It is used in industrial control logic, reconfigurable I/O interfaces, and legacy protocol bridging.
For engineers reviewing the XC3S700A-4FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O bank flexibility, embedded RAM capacity, differential signaling support (LVDS), and industrial-grade thermal performance.
Technical Context
The XC3S700A-4FTG256I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes twelve 18×18 multipliers and supports distributed RAM and shift register functions within CLBs.
It features eight global clock networks, digital clock managers (DCMs) for phase alignment and frequency synthesis, and supports LVDS, LVPECL, and RSDS signaling standards across its 195 user I/O pins. Configuration is performed via Master Serial or JTAG mode using external PROM or processor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - provides gate-equivalent capacity for medium-complexity digital control and glue logic |
| Block RAM | 576 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| I/O Pins | 195 user-configurable - supports mixed-voltage I/O banks with independent VCCO per bank |
| Speed Grade | -4 - guarantees timing closure up to 572 MHz internal clock frequency under worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - validated for use in uncooled industrial enclosures and factory automation environments |
| Configuration Mode | Master Serial / JTAG - allows field updates and boundary-scan testing without dedicated programming hardware |
Pinout & Package
XC3S700A-4FTG256I is housed in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package with 1.0 mm pitch and 17×17 array. The package supports lead-free (Pb-free) soldering and meets JEDEC MO-220 standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input - must be filtered locally with ≥10 µF ceramic capacitor |
| P4 | VCCO_0 | I/O bank 0 output voltage - sets logic threshold for all pins in Bank 0 (pins A1–D12) |
| T13 | CLK0 | Dedicated global clock input - connects directly to DCM and low-skew routing network |
| R15 | TMS | JTAG test mode select - required for IEEE 1149.1 boundary-scan configuration and debug |
| U16 | PROGRAM_B | Active-low configuration initiator - pulls low to reset and reload bitstream from external PROM |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and 2x/4x multiplication without external PLL components |
| Embedded Multiplier Blocks | Twelve 18×18 signed multipliers enable real-time filtering and motor control math without soft IP overhead |
| SelectIO Technology | Supports single-ended and differential standards (LVDS, RSDS) on same I/O bank with programmable slew rate and drive strength |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-LUTs + flip-flop pairs - optimized for pipelined state machines and synchronous datapaths |
Applications
| Industrial PLC I/O Expansion | Legacy Bus Protocol Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O modules to DIN-rail mounted PLCs with space-constrained PCBs. IC Role / Device Role / Timing Role: FPGA acts as parallel-to-serial converter and level-shifting interface between microcontroller and opto-isolated I/O drivers. Use Value: Enables reuse of existing firmware while supporting 24V DC sensor/actuator signals and 3.3V controller logic without external level translators. | Use Scenario: Converting RS-485 Modbus RTU frames to SPI packets for ARM-based gateway processors. IC Role / Device Role / Timing Role: FPGA implements UART+SPI bridge logic with precise baud-rate timing and packet framing control. Use Value: Eliminates need for dual-CPU architecture by offloading protocol translation in hardware with sub-microsecond latency. |
| Reconfigurable Test Equipment Interface | Motor Drive Control Logic |
Use Scenario: Field-upgradable signal conditioning and trigger generation in automated test systems. IC Role / Device Role / Timing Role: FPGA configures analog front-end ADC/DAC timing, generates pattern triggers, and manages PCIe endpoint interface. Use Value: Allows instrument vendors to deploy one hardware platform across multiple test configurations via bitstream swap. | Use Scenario: Closed-loop commutation logic for 3-phase BLDC motors in HVAC blowers and pump controllers. IC Role / Device Role / Timing Role: FPGA executes space-vector PWM generation, current sensing synchronization, and fault detection with deterministic 100 ns timing resolution. Use Value: Replaces ASIC-based motor control ICs with field-programmable timing and protection logic adaptable to varying motor parameters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500A-4FTG256I | 500K-gate capacity, 12,480 logic cells, 432 Kbits block RAM - lower density and reduced I/O count (173 pins) | Suitable for simpler control tasks with fewer peripheral interfaces or smaller state machines | Select when design fits within reduced resource budget and requires lower cost or power |
| XC3S1000-4FTG256C | 1M-gate capacity, 21,120 logic cells, 720 Kbits block RAM - commercial temp range (0°C to +70°C), no industrial qualification | Applicable only in temperature-controlled environments such as lab equipment or office-based gateways | Choose only if industrial temperature rating is not required and higher logic density is needed |
Compared with XC3S500A-4FTG256I and XC3S1000-4FTG256C, the XC3S700A-4FTG256I uniquely balances logic density, industrial temperature operation, and I/O flexibility-making it optimal for field-deployed control systems where reliability across ambient extremes is non-negotiable.
Availability
XC3S700A-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, legacy system modernization, and reconfigurable test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC3S700A-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx acquisition in 2022.
The Spartan-3A family was designed specifically for cost-sensitive, high-volume applications requiring reliable programmable logic with industrial temperature support and low static power consumption.
FAQ
What is the maximum operating frequency supported by XC3S700A-4FTG256I?
The XC3S700A-4FTG256I is rated at speed grade -4, guaranteeing internal clock frequencies up to 572 MHz under worst-case industrial temperature and voltage conditions. This is verified through static timing analysis using Xilinx ISE tools and applies to paths routed through dedicated clock networks and DCM outputs.
Does XC3S700A-4FTG256I support JTAG boundary-scan testing?
Yes, XC3S700A-4FTG256I fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and interconnect testing. Pins TMS, TCK, TDI, and TDO are dedicated and electrically compliant with JTAG specifications, enabling in-system programming and verification without additional test fixtures.
Can XC3S700A-4FTG256I be configured using an external serial PROM?
Yes, XC3S700A-4FTG256I supports Master Serial configuration mode, allowing automatic loading of the bitstream from industry-standard SPI PROMs (e.g., XCF02S, XCF04S) upon power-up. The PROM connects directly to dedicated configuration pins including DIN, CCLK, and INIT_B.
What I/O standards are supported by XC3S700A-4FTG256I?
XC3S700A-4FTG256I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, LVDS, RSDS, and differential terminated standards. Each I/O bank can be independently set to 3.3V, 2.5V, 1.8V, or 1.5V VCCO, enabling mixed-voltage interfacing without level shifters.
Is XC3S700A-4FTG256I qualified for industrial temperature operation?
Yes, XC3S700A-4FTG256I carries the 'I' suffix indicating industrial temperature qualification (-40°C to +100°C). This rating is validated per Xilinx specification DS312 and applies to all logic, I/O, and configuration circuitry under specified voltage and load conditions.
XC3S700A-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 1472
- Number of Logic Elements/Cells:
- 13248
- Total RAM Bits:
- 368640
- Number of I/O:
- 161
- Number of Gates:
- 700000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S700A-4FTG256I FAQ
1.How can I place an order for XC3S700A-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S700A-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S700A-4FTG256I reliable?
The price and inventory of XC3S700A-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S700A-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S700A-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S700A-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S700A-4FTG256I?
XC3S700A-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S700A-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S700A-4FTG256I?
For technical support, including XC3S700A-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S700A-4FTG256I requirements.
6.How does Aetrix verify that XC3S700A-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S700A-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S700A-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S700A-4FTG256I?
All XC3S700A-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S700A-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S700A-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S700A-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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